CN108990320A - Flexible circuit board and preparation method thereof - Google Patents
Flexible circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108990320A CN108990320A CN201810870709.5A CN201810870709A CN108990320A CN 108990320 A CN108990320 A CN 108990320A CN 201810870709 A CN201810870709 A CN 201810870709A CN 108990320 A CN108990320 A CN 108990320A
- Authority
- CN
- China
- Prior art keywords
- layer
- prepreg
- circuit board
- flexible circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Abstract
A kind of production method of flexible circuit board and flexible circuit board.The flexible circuit board includes substrate, the substrate includes the first surface and second surface being oppositely arranged, the flexible circuit board further includes the first layer of prepreg and the first copper foil set gradually on the first surface, the flexible circuit board further includes first binder layer, the first binder layer is folded between the first surface and first layer of prepreg, and first layer of prepreg is adhesively fixed on the substrate.It includes first binder layer, is folded between the first surface and first layer of prepreg.In this way, when making the flexible circuit board to form the structure by process for pressing, pass through set first binder layer, the binding force between the first semi-solid preparation layer and substrate can be enhanced, so that the setting that the first semi-solid preparation layer consolidates is on the substrate, the service performance of flexible circuit board is improved, cost of manufacture is reduced.
Description
[technical field]
The present invention relates to acoustics design technical fields, refer specifically to a kind of flexible circuit board and a kind of system of the flexible circuit board
Make method.
[background technique]
In the related technology, flexible circuit board includes substrate and sets gradually semi-solid preparation layer and copper foil on the substrate
Layer.
But flexible circuit board in the related technology, when being pressed using process for pressing, semi-solid preparation layer and substrate
Binding force is very poor, cannot bond very well.
Thus it is necessary to study a kind of flexible circuit boards with new construction.
[summary of the invention]
The present invention, which is directed to, solves the problems, such as that semi-solid preparation layer and substrate binding force are poor, and provides a kind of novel flexible circuit board
With a kind of production method of flexible circuit board.
To achieve the above object, the first aspect of the present invention provides a kind of flexible circuit board, the flexible circuit board packet
Substrate is included, the substrate includes the first surface and second surface being oppositely arranged, and the flexible circuit board further includes setting gradually
The first layer of prepreg and the first copper foil on the first surface, the flexible circuit board further include first binder layer,
The first binder layer is folded between the first surface and first layer of prepreg, by first semi-solid preparation
Lamella is adhesively fixed on the substrate.
Optionally, the flexible circuit board further include the second layer of prepreg for being successively set on the second surface and
Second copper foil.
Optionally, the flexible circuit board further includes the second adhesive layer, and second adhesive layer is folded in described
Between two surfaces and second layer of prepreg, the second semi-solid preparation layer is adhesively fixed on the substrate.
Optionally, first layer of prepreg is made and is formed by RO4400 prepreg or RO4450 prepreg；Institute
The second layer of prepreg is stated to be made and formed by RO4400 prepreg or RO4450 prepreg.
Optionally, the first binder layer is made by HXL series material forms；Second adhesive layer is by HXL system
Column material makes to be formed.
The second aspect of the present invention provides a kind of production method of flexible circuit board, which comprises
S110, substrate is provided, the substrate includes the first surface and second surface being oppositely arranged；
S120, first binder layer, the first layer of prepreg and the first copper foil are successively formed on the first surface；
S130, the pressing first binder layer, first layer of prepreg and first copper foil, so that described
First layer of prepreg, first copper foil layer are fixed on the substrate via the first binder layer.
Optionally, the method also includes:
S140, the second adhesive layer, the second layer of prepreg and the second copper foil are successively formed on the second surface；
S150, pressing second adhesive layer, second layer of prepreg and second copper foil, so that described
Second layer of prepreg, second copper foil layer are fixed on the substrate via second adhesive layer.
Optionally, first layer of prepreg is RO4400 prepreg or RO4450 prepreg；Described the second half
Solidifying lamella is RO4400 prepreg or RO4450 prepreg.
Optionally, the first binder layer is made by HXL series material forms；Second adhesive layer is by HXL system
Column material makes to be formed.
The beneficial effects of the present invention are: flexible circuit board and preparation method thereof of the invention, flexible circuit board further includes
One adhesive layer, the first binder layer are folded between the first surface and first layer of prepreg.In this way,
When making the flexible circuit board to form the structure by process for pressing, by set first binder layer, can be enhanced
Binding force between half cured layer and substrate, so that the setting that the first semi-solid preparation layer consolidates is on the substrate,
The service performance of flexible circuit board is improved, cost of manufacture is reduced.
[Detailed description of the invention]
Fig. 1 is the structural schematic diagram of flexible circuit board in first embodiment of the invention；
Fig. 2 is the flow chart of the production method of flexible circuit board in second embodiment of the invention.
[specific embodiment]
Below with reference to Fig. 1 to Fig. 2, the present invention is described in detail.
As shown in Figure 1, the first aspect of the present invention, is related to a kind of flexible circuit board 100, the flexible circuit board 100 is wrapped
Substrate 110 is included, the substrate 110 includes the first surface 111 and second surface 112 being oppositely arranged, the flexible circuit board 100
It further include the first layer of prepreg 120 being successively set on the first surface 111 and the first copper foil 130, the flexible electrical
Road plate 100 further includes first binder floor 140, and the first binder layer 140 is folded in the first surface 111 and described
Between one layer of prepreg 120, first layer of prepreg 120 is bonded and fixed on the substrate 110.
It should be noted that the specific making material for first binder layer 140 does not make specific restriction, example
Such as, first binder layer 140 can be made by HXL series material and be formed.Certainly, first binder layer 140 can also be by other
Cohesive material makes to be formed.
Flexible circuit board 100 in the present embodiment further includes first binder layer 140, the first binder layer 140
It is folded between the first surface 111 and first layer of prepreg 120.In this way, to be formed being made by process for pressing
When the flexible circuit board 100 of the structure, by set first binder layer 140, can be enhanced the first semi-solid preparation layer 120 with
Binding force between substrate 110, so that the setting that the first semi-solid preparation layer 120 consolidates on the substrate 110, improves
The service performance of flexible circuit board 100 reduces cost of manufacture.
As shown in Figure 1, the flexible circuit board 100 further includes the second half be successively set on the second surface 112
Solidify lamella 150 and the second copper foil 160.
Specifically, as shown in Figure 1, the flexible circuit board 100 further includes the second adhesive layer 170, second bonding
Oxidant layer 170 is folded between the second surface 112 and second layer of prepreg 150, by the second semi-solid preparation layer
150 are bonded and fixed on the substrate 110.
It should be noted that not making specific restriction, example for the specific making material of the second adhesive layer 170
Such as, the second adhesive layer 170 can be made by HXL series material and be formed.Certainly, the second adhesive layer 170 can also be by other
Cohesive material makes to be formed.
Flexible circuit board 100 in the present embodiment further includes the second adhesive layer 170, second adhesive layer 170
It is folded between the second surface 112 and second layer of prepreg 150.In this way, to be formed being made by process for pressing
When the flexible circuit board 100 of the structure, by the second set adhesive layer 170, can be enhanced the second semi-solid preparation layer 150 with
Binding force between substrate 110, so that the setting that the second semi-solid preparation layer 150 consolidates on the substrate 110, improves
The service performance of flexible circuit board 100 reduces cost of manufacture.
Optionally, first layer of prepreg 120 can be made by RO4400 prepreg or RO4450 prepreg
It is formed, certainly, second layer of prepreg 150 can also make shape by RO4400 prepreg or RO4450 prepreg
At.In addition to this, the first semi-solid preparation layer 120 and the second semi-solid preparation layer 150 can also be made by other materials and be formed.
The second aspect of the present invention, as shown in Fig. 2, providing a kind of production method S100 of flexible circuit board, the side
Method includes:
S110, substrate is provided, the substrate includes the first surface and second surface being oppositely arranged.
S120, first binder layer, the first layer of prepreg and the first copper foil are successively formed on the first surface.
S130, the pressing first binder layer, first layer of prepreg and first copper foil, so that described
First layer of prepreg, first copper foil layer are fixed on the substrate via the first binder layer.
The production method S100 of flexible circuit board in the present embodiment, when the first semi-solid preparation layer is pressed together on substrate,
Due to being additionally provided with first binder layer between first surface and the first semi-solid preparation layer, it can effectively enhance the first half
Binding force between cured layer and substrate improves so that the setting that the first semi-solid preparation layer consolidates is on the substrate
The service performance of flexible circuit board reduces cost of manufacture.
Optionally, as shown in Fig. 2, the method also includes:
S140, the second adhesive layer, the second layer of prepreg and the second copper foil are successively formed on the second surface；
S150, pressing second adhesive layer, second layer of prepreg and second copper foil, so that described
Second layer of prepreg, second copper foil layer are fixed on the substrate via second adhesive layer.
The production method S100 of flexible circuit board in the present embodiment, when the second semi-solid preparation layer is pressed together on substrate,
Due to being additionally provided with the second adhesive layer between second surface and the second semi-solid preparation layer, it can effectively enhance the second half
Binding force between cured layer and substrate improves so that the setting that the second semi-solid preparation layer consolidates is on the substrate
The service performance of flexible circuit board reduces cost of manufacture.
In addition, for the first semi-solid preparation layer, the second semi-solid preparation layer, first binder layer and the second adhesive layer specific material
Material can be recorded with reference to related above, and therefore not to repeat here.
Above-described is only embodiments of the present invention, it should be noted here that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, improvement can also be made, but these belong to protection model of the invention
It encloses.
Claims (9)
1. a kind of flexible circuit board, the flexible circuit board includes substrate, the substrate include the first surface that is oppositely arranged and
Second surface, the flexible circuit board further include the first layer of prepreg and the first bronze medal set gradually on the first surface
Foil, which is characterized in that the flexible circuit board further includes first binder layer, and the first binder layer is folded in described first
Between surface and first layer of prepreg, first layer of prepreg is adhesively fixed on the substrate.
2. flexible circuit board according to claim 1, which is characterized in that the flexible circuit board further includes being successively set on
The second layer of prepreg and the second copper foil on the second surface.
3. flexible circuit board according to claim 2, which is characterized in that the flexible circuit board further includes the second binder
Layer, second adhesive layer is folded between the second surface and second layer of prepreg, by described the second half
Cured layer is adhesively fixed on the substrate.
4. flexible circuit board according to claim 3, which is characterized in that first layer of prepreg is solid by RO4400 half
Change piece or RO4450 prepreg makes to be formed；Second layer of prepreg is by RO4400 prepreg or RO4450 semi-solid preparation
Piece makes to be formed.
5. flexible circuit board according to claim 3, which is characterized in that the first binder layer is by HXL series material
Production is formed；Second adhesive layer is made by HXL series material to be formed.
6. a kind of production method of flexible circuit board, which is characterized in that the described method includes:
S110, substrate is provided, the substrate includes the first surface and second surface being oppositely arranged；
S120, first binder layer, the first layer of prepreg and the first copper foil are successively formed on the first surface；
S130, the pressing first binder layer, first layer of prepreg and first copper foil, so that described first
Layer of prepreg, first copper foil layer are fixed on the substrate via the first binder layer.
7. the production method of flexible circuit board according to claim 6, which is characterized in that the method also includes:
S140, the second adhesive layer, the second layer of prepreg and the second copper foil are successively formed on the second surface；
S150, pressing second adhesive layer, second layer of prepreg and second copper foil, so that described second
Layer of prepreg, second copper foil layer are fixed on the substrate via second adhesive layer.
8. the production method of flexible circuit board according to claim 7, which is characterized in that first layer of prepreg is
RO4400 prepreg or RO4450 prepreg；Second layer of prepreg is that RO4400 prepreg or RO4450 half are solid
Change piece.
9. the production method of flexible circuit board according to claim 7, which is characterized in that the first binder layer by
HXL series material makes to be formed；Second adhesive layer is made by HXL series material to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810870709.5A CN108990320A (en) | 2018-08-02 | 2018-08-02 | Flexible circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810870709.5A CN108990320A (en) | 2018-08-02 | 2018-08-02 | Flexible circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990320A true CN108990320A (en) | 2018-12-11 |
Family
ID=64554610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810870709.5A Withdrawn CN108990320A (en) | 2018-08-02 | 2018-08-02 | Flexible circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108990320A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100234946B1 (en) * | 1996-11-30 | 1999-12-15 | 이형도 | Rigid-flexible multi-layer printed wired board |
| JP2013098536A (en) * | 2011-10-31 | 2013-05-20 | Tripod Technology Corp | Method for manufacturing folding type printed circuit board |
| CN203675439U (en) * | 2013-11-06 | 2014-06-25 | 广德宝达精密电路有限公司 | High-stability multilayer flexible printed board |
| CN104302126A (en) * | 2014-10-11 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technique of rigid and flexible combined printed board |
-
2018
- 2018-08-02 CN CN201810870709.5A patent/CN108990320A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100234946B1 (en) * | 1996-11-30 | 1999-12-15 | 이형도 | Rigid-flexible multi-layer printed wired board |
| JP2013098536A (en) * | 2011-10-31 | 2013-05-20 | Tripod Technology Corp | Method for manufacturing folding type printed circuit board |
| CN203675439U (en) * | 2013-11-06 | 2014-06-25 | 广德宝达精密电路有限公司 | High-stability multilayer flexible printed board |
| CN104302126A (en) * | 2014-10-11 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technique of rigid and flexible combined printed board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181211 |
|
| WW01 | Invention patent application withdrawn after publication |