CN106714453B - A kind of false rigid-flex combined board and preparation method thereof - Google Patents
A kind of false rigid-flex combined board and preparation method thereof Download PDFInfo
- Publication number
- CN106714453B CN106714453B CN201611193006.0A CN201611193006A CN106714453B CN 106714453 B CN106714453 B CN 106714453B CN 201611193006 A CN201611193006 A CN 201611193006A CN 106714453 B CN106714453 B CN 106714453B
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- slot
- wall
- bending slot
- bending
- rigid
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The present invention relates to board production technical field, specially a kind of false rigid-flex combined board and preparation method thereof.The present invention makes bending slot by using the mode of two secondary control depth gong slots, slot is bent in first production in the first secondary control depth gong slot, so that upper bending slot is metallized through heavy copper and electric plating of whole board processing, then carry out the second secondary control depth gong slot on the basis of upper bending slot again, bending slot is thus made.Since its cell wall has metallized upper bending slot in the processing of heavy copper and electric plating of whole board, to realize that the part cell wall of bending slot has copper electroplating layer.The false rigid-flex combined board made by the method for the invention can parcel plating copper because of the inner wall of bending slot, make circuit board realize portion inner layer high speed transmission of signals and reduce bending slot inner wall because extra electro-coppering during high speed transmission of signals signal caused by reflect and interference, it can guarantee the integrality of signal transmission, the diversified demand in market can be better adapted to and be met, the competitiveness of product in market is improved.
Description
Technical field
The present invention relates to board production technical fields more particularly to a kind of false rigid-flex combined board and preparation method thereof.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board.Common
PCB is made of hardboard, can not bend in installation and use process, not have bending.In order to meet installation and use
The requirement of bending in journey can be combined production PCB, such PCB by soft board and rigid plate and be known as rigid-flex combined board.Rigid-flexible combination
Plate has both rigid layer and flexible layers, is that the flexible layers of lamelliform and rigid layer are combined the circuit board formed.Rigid-flex combined board changes
Traditional planar designs concept is become, so that design concept is expanded to three-dimensional three-dimensional space, brought to product design huge
It is convenient.In addition, there are also one kind PCB to be known as false rigid-flex combined board, false rigid-flex combined board refers to be produced using conventional rigid plate
A kind of PCB product for alternative rigid-flex combined board that can be realized three-dimensional installation that equipment, material and technique manufacture.It is false
It is high that rigid-flex combined board is applied to some reliability requirements, but is not subjected to multiple dynamic bending, and only need to be in installation and maintenance
It bears in the curved electronic product of finite number of time.False rigid-flex combined board has relatively low cost, low price and easy processing etc. special
Point.The conventional production method of existing false rigid-flex combined board is to control deep gong channel process, that is, is being made with the more of required route
Laminate and after having carried out surface treatment and processing and forming, needs the area for having bending by way of controlling deep gong slot on multilayer boards
The bending slot of domain gong certain depth, so bending slot has certain bending, can be born since the plate thickness at bending slot is smaller
The bending of certain number.The conventional production process of existing false rigid-flex combined board is as follows: sawing sheet → inner figure → internal layer erosion
The erosion of copper → electric plating of whole board → outer graphics → graphic plating → outer layer is sunk in quarter → internal layer AOI → brownification → pressing → outer layer drills →
Carve → take off tin → outer layer AOI → silk-screen welding resistance/character → surface treatment → molding → control depth gong → electrical testing → FOC → FQA →
Packaging.With the high speed development of electronic product performance and the demand of market diversification, it is necessary to which producing one kind can further improve
Circuit board section internal layer high speed transmission of signals simultaneously reduces bending slot inner wall because extra electro-coppering is during high speed transmission of signals
Reflection and interference caused by signal, it is ensured that the false rigid-flex combined board of signal transmission integrity.
Summary of the invention
The present invention can only make bending slot inner wall without the false rigid-flexible of copper plate for the deep gong slot process of existing control
The problem of board, it is false just with copper-plated false rigid-flex combined board and this kind to provide a kind of internal partial wall for bending slot
The production method of flex combined board.
To achieve the above object, the present invention uses following technical scheme.
A kind of false rigid-flex combined board, including rigid region and flexure region, the flexure region are equipped with bending slot, institute
The inner wall for stating bending slot is divided into upper inside wall and lower inner wall, and the lower inner wall is connected with the slot bottom of bending slot, the top
Inner wall is located at the top of lower inner wall and is connected with lower inner wall；The outer layer of the upper inside wall is copper plate.
The production method of above-described false rigid-flex combined board, comprising the following steps:
Slot is bent on S1: core material and outer copper foil are press-fitted together as one by prepreg by simultaneously root according to the prior art
Outer layer is completed according to borehole data to drill to form multilayer production plate；The multilayer production plate is equipped with rigid region and flexure region；
Then, in a manner of controlling deep gong slot in flexure region gong slot, be made upper and bend slot.
The metallization of S2 hole slot: successively carrying out heavy copper to multilayer production plate and electric plating of whole board processed, and makes on multilayer production plate
Hole and the metallization of upper bending slot.
S3 outer graphics and graphic plating: pasting dry film and exposed and developed processing on multilayer production plate, raw in multilayer
It produces and forms outer-layer circuit figure on plate, then successively electro-coppering and electrotinning on outer-layer circuit figure.
S4 bends slot: continuing gong slot at the slot bottom of upper bending slot in a manner of controlling deep gong slot, bending slot is made；On described
The inner wall of bending slot is the upper inside wall for bending slot, and the inner wall bent between the slot bottom of slot and upper inside wall is known as lower inner wall.
S5 outer-layer circuit: the dry film on multilayer production plate is removed according to the prior art and outer layer erosion is carried out to multilayer production plate
Processing is carved, the tin layers on multilayer production plate is then taken off, outer-layer circuit figure is made.
Process after S6: solder mask, surface treatment, molding and survey are successively made on multilayer production plate according to the prior art
Examination.
Preferably, above-described surface treatment is heavy nickel golden watch surface treatment.
Compared with prior art, the beneficial effects of the present invention are: the present invention by using two secondary control depth gong slots mode system
Make bending slot, bend slot in first production in the first secondary control depth gong slot, makes upper bending slot metal through heavy copper and electric plating of whole board processing
Change, then carry out the second secondary control depth gong slot on the basis of upper bending slot again, bending slot is thus made.Since upper bending slot is heavy
Its cell wall has metallized in the processing of copper and electric plating of whole board, to realize that the part cell wall of bending slot has copper electroplating layer.Pass through
The method of the present invention production false rigid-flex combined board because bending slot inner wall can parcel plating copper, make circuit board realize portion inner layer
High speed transmission of signals and reduce bending slot inner wall because extra electro-coppering during high speed transmission of signals signal caused by it is anti-
It penetrates and interferes, it is ensured that the integrality of signal transmission can better adapt to and meet the diversified demand in market, improve product
The market competitiveness.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of false rigid-flex combined board in embodiment；
Fig. 2 is the structural schematic diagram that the multilayer production plate of upper bending slot has been made in embodiment；
Fig. 3 is the structural schematic diagram of the multilayer production plate in embodiment after upper bending slot metallization.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
Referring to Fig.1, the present embodiment provides a kind of four layers of false rigid-flex combined board, the false rigid-flex combined board is by rigid region
Domain and flexure region are constituted, and are successively copper plate 40, the outer copper foil layer for having made outer-layer circuit from top to bottom in Fig. 1
31, layer of prepreg 21, the core material layer 10 for having made internal layer circuit, layer of prepreg 22 and the outer of outer-layer circuit has been made
Layer copper foil layer 32.It is equipped with bending slot 50 in the flexure region of false rigid-flex combined board, and the inner wall for bending slot 50 is divided into
Portion's inner wall 51 and lower inner wall 52, the lower inner wall 52 are connected with the slot bottom 53 of bending slot 50, and upper inside wall 51 is located at lower part
The top of inner wall 52 is simultaneously connected with lower inner wall 52, and the outer layer of upper inside wall 51 is copper plate 40.
Making false rigid-flex combined board described in the present embodiment, specific step is as follows:
(1) process before
It, will be interior successively by sawing sheet → negative film technique production internal layer circuit → pressing → outer layer drilling according to the prior art
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will make the core material of internal layer circuit and outer by prepreg
Layer copper foil is press-fitted together as one and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is equipped with
Rigid region and flexure region.It is specific as follows:
A, core plate, core thickness 1.1mm H/H sawing sheet: are outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique): LDI dry film stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, line pattern is etched after development, it is 3mil that internal layer line width, which measures,.
C, internal layer AOI: checking the defects of opening short circuit, route notch, route pin hole of internal layer, defective to scrap processing, nothing
The product of defect goes out to downstream.
D, it presses: brownification speed is selected according to plate thickness.After lamination, lamination appropriate is selected to be pressed according to plate Tg
It closes.
E, outer layer drills: carrying out drilling processing (including through-hole and blind hole) using borehole data.
(2) slot is bent on
Using it is existing it is accurate control deep gong slot equipment in the flexure region gong slot of multilayer production plate, the depth of control flume be at
The depth that slot inner wall needs electro-coppering is bent in product, is formed by slot and is known as upper bending slot, as shown in Figure 2.In Fig. 2, on toward
Under be successively that outer copper foil layer 31, layer of prepreg 21, core material layer 10, layer of prepreg 22, outer copper foil layer 32,60 are
Upper bending slot.
(3) hole slot metallizes
Heavy copper and electric plating of whole board processing are successively carried out to multilayer production plate, make hole and upper bending slot gold on multilayer production plate
Categoryization.The inner wall of bending slot is plated layers of copper covering, i.e. the surface layer of bending slot inner wall is copper electroplating layer, as shown in Figure 3.In Fig. 3,
It is successively copper plate 40 from top to bottom, outer copper foil layer 31, layer of prepreg 21, core material layer 10, layer of prepreg 22, outer
Layer copper foil layer 32,70 is the upper bending slot after metallization.
(4) outer graphics and graphic plating
Dry film and exposed and developed processing are pasted on multilayer production plate, forms outer-layer circuit figure on multilayer production plate
Shape, then successively electro-coppering and electrotinning on outer-layer circuit figure.It is specific as follows:
(5) slot is bent
Continue gong slot down at the slot bottom of upper bending slot using the existing accurate deep gong slot equipment of control, the step institute gong
Slot constitutes bending slot together with upper bending slot, and the inner wall of upper bending slot is the upper inside wall for bending slot, bend the slot bottom of slot with
Inner wall between upper inside wall is known as lower inner wall.
(6) outer-layer circuit
The dry film on multilayer production plate is removed according to the prior art and outer layer etching and processing is carried out to multilayer production plate, then
The tin layers on multilayer production plate are taken off, outer-layer circuit figure is made.Then carry out outer layer AOI, check the line width of route, spacing,
Route pin hole and whether there is route notch, and checks product and the whether mutually same relevant item of product requirement.
(6) process afterwards
Solder mask, surface treatment, molding and test are successively made on multilayer production plate according to the prior art.Specifically such as
Under:
A, silk-screen welding resistance, character: using the white face wire mark brush TOP solder mask, and the face TOP character adds UL label.
B, the nickel that sinks is golden: depositing one layer of nickel and one layer of gold respectively on the copper surface that welding resistance opens a window by chemically reacting, makes its tool
There are excellent solderability and wearability etc..
C, it forms: gong external form, the +/- 0.05mm of external form tolerance.
D, electrical testing: the electric property of test-based examination production board.
E, final inspection: check that the aesthetic appearance of production board is bad.
F, FQA: appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. are taken a sample test again.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (3)
1. a kind of false rigid-flex combined board, including rigid region and flexible region, the flexible region is equipped with bending slot, and feature exists
In the inner wall of the bending slot is divided into upper inside wall and lower inner wall, and the lower inner wall is connected with the slot bottom of bending slot, described
Upper inside wall is located at the top of lower inner wall and is connected with lower inner wall；The outer layer of the upper inside wall is copper plate.
2. a kind of production method of false rigid-flex combined board as described in claim 1, which comprises the following steps:
Slot is bent on S1: core material and outer copper foil being press-fitted together as one and according to brill by prepreg according to the prior art
Hole data completes outer layer and drills to form multilayer production plate；The multilayer production plate is equipped with rigid region and flexure region；
Then, in a manner of controlling deep gong slot on flexible region gong slot, be made upper and bend slot；
The metallization of S2 hole slot: successively carrying out heavy copper to multilayer production plate and electric plating of whole board processed, make hole on multilayer production plate and
Upper bending slot metallization；
S3 outer graphics and graphic plating: pasting dry film and exposed and developed processing on multilayer production plate, produces plate in multilayer
Upper formation outer-layer circuit figure, then successively electro-coppering and electrotinning on outer-layer circuit figure；
S4 bends slot: continuing gong slot at the slot bottom of upper bending slot in a manner of controlling deep gong slot, bending slot is made；The upper bending
The inner wall of slot is the upper inside wall for bending slot, and the inner wall bent between the slot bottom of slot and upper inside wall is known as lower inner wall；
S5 outer-layer circuit: add according to the dry film on prior art removing multilayer production plate and to multilayer production plate progress outer layer etching
Work then takes off the tin layers on multilayer production plate, outer-layer circuit figure is made；
Process after S6: solder mask, surface treatment, molding and test are successively made on multilayer production plate according to the prior art.
3. a kind of production method of false rigid-flex combined board according to claim 2, which is characterized in that described in step S6
Surface treatment is heavy nickel golden watch surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611193006.0A CN106714453B (en) | 2016-12-21 | 2016-12-21 | A kind of false rigid-flex combined board and preparation method thereof |
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| CN201611193006.0A CN106714453B (en) | 2016-12-21 | 2016-12-21 | A kind of false rigid-flex combined board and preparation method thereof |
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| CN106714453A CN106714453A (en) | 2017-05-24 |
| CN106714453B true CN106714453B (en) | 2019-04-02 |
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| CN111295053B (en) * | 2020-03-31 | 2021-07-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112261800A (en) * | 2020-10-26 | 2021-01-22 | 景旺电子科技(龙川)有限公司 | Manufacturing method of high-heat-dissipation PCB |
| CN115843158B (en) * | 2023-02-22 | 2023-05-12 | 遂宁睿杰兴科技有限公司 | Printed circuit board embedded with inductance magnetic core and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN103096647A (en) * | 2011-10-31 | 2013-05-08 | 健鼎（无锡）电子有限公司 | Method for manufacturing bent type printed circuit board (PCB) |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
-
2016
- 2016-12-21 CN CN201611193006.0A patent/CN106714453B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN103096647A (en) * | 2011-10-31 | 2013-05-08 | 健鼎（无锡）电子有限公司 | Method for manufacturing bent type printed circuit board (PCB) |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
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| CN106714453A (en) | 2017-05-24 |
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