TW201307437A - 硬化性樹脂組成物及使用此組成物之硬化物的製造方法 - Google Patents
硬化性樹脂組成物及使用此組成物之硬化物的製造方法 Download PDFInfo
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- TW201307437A TW201307437A TW101124680A TW101124680A TW201307437A TW 201307437 A TW201307437 A TW 201307437A TW 101124680 A TW101124680 A TW 101124680A TW 101124680 A TW101124680 A TW 101124680A TW 201307437 A TW201307437 A TW 201307437A
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- -1 cyanic acid ester compound Chemical class 0.000 claims abstract description 73
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- 238000004519 manufacturing process Methods 0.000 claims description 19
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- 239000004643 cyanate ester Substances 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 6
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- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
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- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 abstract 1
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- LNZIRNRHIJPNRY-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)propyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC)C1=CC=C(OC#N)C=C1 LNZIRNRHIJPNRY-UHFFFAOYSA-N 0.000 description 4
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical compound [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 4
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- 230000001588 bifunctional effect Effects 0.000 description 4
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- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 4
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- RZBUVWIMPWGGRK-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)cyclohexyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C1(C=2C=CC(OC#N)=CC=2)CCCCC1 RZBUVWIMPWGGRK-UHFFFAOYSA-N 0.000 description 3
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- NNVFMMULSKOXSJ-UHFFFAOYSA-N [4-[(4-cyanatophenyl)-phenylmethyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1C(C=1C=CC(OC#N)=CC=1)C1=CC=CC=C1 NNVFMMULSKOXSJ-UHFFFAOYSA-N 0.000 description 2
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- ALTSFBKKGZFYFL-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)-3-methylbutyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(CC(C)C)C1=CC=C(OC#N)C=C1 ALTSFBKKGZFYFL-UHFFFAOYSA-N 0.000 description 2
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- OKOGUHSERRTCOI-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)-4-methylpentan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(CC(C)C)C1=CC=C(OC#N)C=C1 OKOGUHSERRTCOI-UHFFFAOYSA-N 0.000 description 2
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- DTBYAMREORWBRN-UHFFFAOYSA-N [4-[3-(4-cyanatophenyl)-2-methylpentan-3-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C(C)C)(CC)C1=CC=C(OC#N)C=C1 DTBYAMREORWBRN-UHFFFAOYSA-N 0.000 description 2
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- IKUGFMANZPAVJJ-UHFFFAOYSA-L manganese(2+);3-oxobutanoate Chemical compound [Mn+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O IKUGFMANZPAVJJ-UHFFFAOYSA-L 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
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- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
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- 239000008117 stearic acid Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
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- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
- C08G73/0661—Preparatory processes from polycyanurates characterised by the catalyst used
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
- C08L65/02—Polyphenylenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
- C09D165/02—Polyphenylenes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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Abstract
本發明提供一種在常溫為液狀、可製得耐熱性優異且具有低的熱膨脹係數的硬化物之硬化性樹脂組成物。依據本發明之硬化性樹脂組成物係包含以下式(I)表示之氰酸酯化合物(A)與硬化促進劑(B):□(式中,R1表示碳數2~20之烴基。)
Description
本發明係有關包含氰酸酯化合物之硬化性樹脂組成物及使用該組成物之硬化物之製造方法;更詳細言之,係關於一種在常溫為液狀、可製得耐熱性優異、且具有低的熱膨脹係數的硬化物之硬化性樹脂組成物,及使用其製得的硬化物之製造方法。
近年來,於半導體相關材料的領域中,行動電話、超薄型液晶、電漿電視、輕型筆電等之以「輕、薄、短、小」為訴求的電子設備比比皆是,因而在封裝體(package)材料上也要求著高度的特性。尤其是先進封裝體之構造趨於複雜,非液狀封裝則難以將其密封的元件也日益增加。例如,如EBGA般的具有Cavity down type構造的元件必須進行局部密封,用轉移(transfer)成形並無法因應。基於此理由,作為密封材料之高機能的液狀硬化性樹脂組成物之開發備受期盼。
由於液狀密封材料和粉粒狀密封材料不同,難以達到填料的高度填充、基質樹脂本身難以達到高Tg(玻璃轉化溫度)化,故密封材料的熱膨脹係數有增大的傾向。因而,液狀密封材料與轉移成形之粉粒狀密封材料相較,熔焊耐熱性與耐熱溫度刺激(heat shock)性差,其結果,因與晶片的熱膨脹係數的差異所產生之應力使樹脂或晶片容易產生裂縫,有使得半導體之可靠性降低的問題。因此,高Tg(玻璃轉化溫度)、且熱膨脹係數小的液狀密封材料用之樹脂備受期盼。
作為用以密封半導體元件之液狀密封用樹脂組成物,曾被提出者有:包含以雙酚A型環氧樹脂或脂環型環氧樹脂等作為主成份,及作為硬化劑之液狀的酸酐或苯酚酚醛清漆,並含有無機填充材等之添加物所成的環氧樹脂組成物(參照例如專利文獻1、2、3)。然而,以雙
酚A型環氧樹脂或脂環型環氧樹脂等作為主成份的樹脂組成物之Tg低,在高溫度區域的熱膨脹係數大。而且,此等樹脂組成物在高頻區域的介電係數及介電損失大,未必能滿足半導體裝置的小型化、高密度化及高速化之要求。
相對於此,氰酸酯樹脂除了耐熱性優異之外,亦作為低介電係數、低介電損失的熱硬化性樹脂而早為人知者,尤其,如於專利文獻4所提出般,將併用雙酚A型氰酸酯樹脂與雙馬來醯亞胺化合物的樹脂組成物稱為BT樹脂,由於其具有優異的電氣特性、機械特性、耐藥品性等而適合作為半導體元件之密封材料。然而,由於雙酚A型氰酸酯係熔點為80℃的結晶性化合物,故無法以原來狀態直接使用來作為液狀密封材料,必須與其他於常溫為液狀的成分併用。然而,與其他成分併用,除了會受到其他成分的影響之外,組成物調配的自由度也會降低,致對於性能之提高會有造成妨礙的情形。
又,作為改善熱膨脹性者,例如於專利文獻5中曾揭示出使用三苯基甲烷型的氰酸酯化合物之樹脂組成物。然而,三苯基甲烷型的氰酸酯化合物在常溫下為固體,作為液狀密封材料並不理想。再者,於專利文獻6中,曾揭示出一種2個氰氧基苯基(cyanatophenyl)中介著非對稱性的伸烷基而鍵結所成之2官能氰氧基苯基型之氰酸酯化合物,其係低黏度非結晶性,使用此化合物的樹脂硬化物有優異的熱變形溫度與撓曲強度,作為其例子可列舉:雙(4-氰氧基苯基)-2,2-丙烷、雙(4-氰氧基苯基)1,1-乙烷、雙(4-氰氧基苯基)-2,2-丁烷等。然而,由於作為耐熱性的指標之熱變形溫度為200~250℃左右,故上述化合物作為液狀密封材料的耐熱性不足。
[專利文獻1]日本特開2002-241469號公報
[專利文獻2]日本特開2003-160639號公報
[專利文獻3]日本特開2007-5750號公報
[專利文獻4]日本特開平7-70315號公報
[專利文獻5]日本特開2006-169317號公報
[專利文獻6]日本特開昭63-150257號公報
本案發明人等於今發現:併用特定的2官能型氰酸酯化合物與硬化促進劑所成之硬化性樹脂組成物於常溫為液狀,其硬化物之耐熱性優異、且具有低的熱膨脹係數。本發明乃基於此發現而達成者。
因而,本發明之目的在於提供一種在常溫為液狀、可製得耐熱性優異、且具有低的熱膨脹係數的硬化物之硬化性樹脂組成物。
又,本發明之另一目的在於提供使用上述硬化性樹脂組成物而成的硬化物之製造方法。
又,依據本發明之硬化性樹脂組成物,係包含以下式(I)表示之氰酸酯化合物(A)與硬化促進劑(B)而成:
(式中,R1表示碳數2~20之烴基。)
於本發明之實施形態中,前述R1為碳數2~5之烷基亦可。
又,於本發明之實施形態中,前述R1亦可為選自於由乙基、異丙基、及第三丁基構成的群組。
又,於本發明之實施形態中,前述硬化促進劑(B)亦可為金屬錯合化合物。
又,於本發明之實施形態中,前述金屬錯合化合物亦可為選自於由鈷、鋁、銅、錳、鋯、及鎳構成之群組中之金屬之錯合化合物。
又,於本發明之實施形態中,前述硬化促進劑(B)之含量,相對於該氰酸酯化合物(A)100質量份為0.01~1.0質量份亦可。
又,於本發明之實施形態中,亦可更包含選自於由下式(II)、下式(III)、下式(IV)及下式(V)構成之群組中之至少1種以上的氰酸酯化合物(C):
(式中,R2為選自於由下式(i)~(v)構成之群組中之任一者:
[式中,R3、R4均為氫原子,或為碳數1~8之烷基或三氟甲基,n為4~7之整數。]。)
又,於本發明之實施形態中,亦可更包含選自於由環氧樹脂(D)、馬來醯亞胺化合物(E)、苯并化合物(F)、及具有可聚合之不飽和基之化合物(G)構成之群組中之1種以上。
又,依據本發明之另一實施形態之硬化物之製造方法,係使用上述硬化性樹脂組成物製造硬化物之方法,包含將該硬化性樹脂組成物於160~300℃之溫度加熱使其硬化之步驟。
又,於本發明之實施形態中,前述加熱步驟至少以2次的步驟進行亦可。
又,於本發明之實施形態中,前述第2次以後的加熱步驟,係於較該第1次的加熱步驟在更高溫實施。
於本發明之另一實施形態中,也提供藉由上述方法獲得之硬化物。
於本發明之另一實施形態中,也提供含有上述硬化性樹脂組成物而成之密封用材料、黏接劑、及絕緣材料。
於本發明之另一實施形態中,也提供將上述硬化性樹脂組成物含浸或塗佈於基材而成之預浸體,並提供將至少1片以上之前述預浸體重疊並予以疊層成形而獲得之疊層板。
依據本發明,藉由併用特定的2官能氰酸酯化合物與硬化促進劑,在常溫為液狀,可得到耐熱性優異、且具有低的熱膨脹係數的硬化物。
本發明之硬化性樹脂組成物係包含特定的氰酸酯化合物(A)與硬化促進劑(B)作為必要成分。對各成分說明如下。
依據本發明之硬化性樹脂組成物中所含有的氰酸酯化合物(A)係以下式(I)表示者。
作為以上式(I)表示之氰酸酯化合物,可列舉例如:1,1-雙(4-氰氧基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丙烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯
基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)己烷、1,1-雙(4-氰氧基苯基)-4-甲基戊烷、1,1-雙(4-氰氧基苯基)-3-甲基戊烷、1,1-雙(4-氰氧基苯基)-2-甲基戊烷、1,1-雙(4-氰氧基苯基)-2,3-二甲基丁烷、1,1-雙(4-氰氧基苯基)-3,3-二甲基丁烷、雙(4-氰氧基苯基)環戊基甲烷、雙(4-氰氧基苯基)環己基甲烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)庚烷、1,1-雙(4-氰氧基苯基)-2-甲基己烷、1,1-雙(4-氰氧基苯基)-3-甲基己烷、1,1-雙(4-氰氧基苯基)-4-甲基己烷、1,1-雙(4-氰氧基苯基)-5-甲基己烷、1,1-雙(4-氰氧基苯基)-3,4-二甲基戊烷、1,1-雙(4-氰氧基苯基)-2,3-二甲基戊烷、1,1-雙(4-氰氧基苯基)-3-乙基戊烷、1,1-雙(4-氰氧基苯基)-2-乙基戊烷、雙(4-氰氧基苯基)-1-萘基甲烷、1,1-雙(4-氰氧基苯基)-2-苯基甲基己烷。
上述氰酸酯化合物之中,由樹脂組成物的黏度、耐熱性及線膨脹係數的觀點,上式(I)之R1較佳為碳數2~5之烷基,可列舉例如:1,1-雙(4-氰氧基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丙烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)-2,3-二甲基丁烷、1,1-雙(4-氰氧基苯基)-3,3-二甲基丁烷、環戊基雙(4-氰氧基苯基)甲烷、環己基雙(4-氰氧基苯基)甲烷、雙(4-氰氧基苯基)苯基甲烷;更佳為:1,1-雙(4-氰氧基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丙烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)-2,3-二甲基丁烷、1,1-雙(4-氰氧基苯基)-3,3-二甲基丁烷、環戊基雙(4-氰氧基苯基)甲烷。
尤其是上式(I)之R1為乙基、異丙基、或第三丁基的1,1-雙(4-氰氧基苯基)丙烷、1,1-雙(4-氰氧基苯基)-2-甲基丙烷、及1,1-雙(4-
氰氧基苯基)異丁烷,由於是澄清透明非結晶性液體、且在高溫環境下的物性變化少,故為特佳。又,併用上述3種氰酸酯化合物與硬化促進劑(B)所成的硬化性樹脂組成物,和包含亞甲基(-CHR1-)中的氫以其他烷基等取代而成的二氰氧基苯基型之2官能氰酸酯的樹脂組成物相較,硬化物的線膨脹係數即使在高溫下也小,可適合使用於耐熱性優異的液狀密封材料用之樹脂與經高密度化的多層印刷線路板之絕緣層用的樹脂等。當然,依據本發明之硬化性樹脂組成物可更包含上述以外的其他2官能氰酸酯化合物是不言而喻的。
以上式(I)表示之氰酸酯化合物的製造方法並無特別限制,藉由從下式(vI)表示的苯酚應用作為氰酸酯合成法的公知方法,可得到所期望的化合物。
藉由例如記載於IAN HAMERTON,"Chemistry and Technology of Cyanate Ester Resins",BLACKIE ACADEMIC & PROFESSIONAL中的方法,將上式(VI)的苯酚氰酸酯化,可得到上式(I)之氰酸酯化合物。又,習知的方法有:在溶劑中、鹼存在下,使鹵化氰一直保持對鹼為過剩而使其反應的方法(美國專利3553244號);用3級胺作為鹼,使其較鹵化氰為過剩的狀態下進行合成的方法(日本特開平7-53497號公報);以連續柱塞流(plug flow)方式,使三烷基胺與鹵化氰反應的方法(日本特表2000-501138號);使苯酚與鹵化氰在三級胺存在下於非水溶液中反應時所副生的三級鹵化銨以陽離子及陰離子交換對進行處理的方法(日本特表2001-504835號公報);使苯酚化合物在可與水分
離的溶劑之存在下,同時添加3級胺和鹵化氰使其反應,然後,進行水洗分液,自得到的溶液用2級或3級醇或烴的不良溶劑進行沈澱精製的方法(日本專利2991054號);以及使萘酚類、鹵化氰、及3級胺在水與有機溶劑的二相系溶劑中,在酸性條件下使其反應的方法(日本特開2007-277102公報)等。本發明中,可適當地使用此等方法,可得到氰酸酯化合物。藉由上述等的方法得到的氰酸酯化合物,可藉由NMR等公知的方法鑑定。
依據本發明之硬化性樹脂組成物包含硬化促進劑作為必須成分。藉由使用上述特定的氰酸酯化合物(A)與硬化促進劑(B),能使硬化性樹脂組成物硬化時的溫度可降低,更進一步,能使硬化物的貯存彈性係數之降低受到抑制、可得到即使在高溫下硬化物的線膨脹係數也小、且耐熱性優異的硬化性。尤其,與不含有硬化促進劑(B)的情形比較,由於可減低在高溫下的硬化物之線膨脹係數,故依據本發明之硬化性樹脂組成物可適合使用作為經高密度化的多層印刷線路板之絕緣層用的樹脂。
作為硬化促進劑(B),可無特別限制地使用向來所公知者,可使用例如:辛酸、硬脂酸、環烷酸、乙醯丙酮鹽之Cu、Fe、Co、Mn、Al、Ti、Zr、Ni等之有機金屬鹽、Ti、Sn、Bi、Zr、Al等金屬之烷氧化物、辛基苯酚、壬基苯酚等之苯酚化合物、1-丁醇、2-乙己醇等之醇類、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等之咪唑衍生物、雙氰胺(dicyandiamide)、苄基二甲胺、4-甲基-N,N-二甲基苄基胺等之胺化合物、膦系或鏻系之磷化合物等。
上述硬化促進劑之中,從線膨脹係數之觀點,較佳可使用鈷、鋁、銅、錳、鋯、或鎳的金屬錯合化合物;例如,較佳可使用辛酸銅、辛
酸鈷、辛酸鋁、辛酸錳、硬脂酸銅、硬脂酸鈷、硬脂酸鋁、環烷酸銅、環烷酸鈷、環烷酸鋁、環烷酸錳、乙醯丙酮銅(II)、乙醯丙酮鈷(II)、乙醯丙酮鈷(III)、乙醯丙酮鐵(III)、乙醯丙酮錳(II)、乙醯丙酮錳(III)、乙醯丙酮鋁(III)、乙醯丙酮鋯(IV)、乙醯丙酮鎳(II)、四丁氧基鋯、肆(2-乙基-1,3-己烷二醇酸)鈦、四異丙氧基鈦、四-正丁氧基鈦等;尤其更佳可使用硬脂酸鈷、乙醯丙酮銅(II)、乙醯丙酮鈷(II)、乙醯丙酮鈷(III)、乙醯丙酮錳(II)、乙醯丙酮錳(III)、乙醯丙酮鋯(IV)、乙醯丙酮鎳(II)。
上述硬化促進劑(B),相對於該氰酸酯化合物(A)100質量份,較佳為含有0.01~1.0質量份。藉由硬化促進劑(B)的含量為在此範圍內,更進一步,硬化物的貯存彈性係數之降低受到抑制、可得到即使在高溫下硬化物的線膨脹係數也小、且耐熱性優異的硬化物。更佳的硬化促進劑之含量為0.01~0.5質量份。
依據本發明之硬化性樹脂組成物亦可含有上述氰酸酯化合物(A)以外的氰酸酯化合物(C)。作為氰酸酯化合物(C)可舉出以下式(II)~(V)表示之氰酸酯化合物。
以上式(II)表示之氰酸酯化合物,可藉由將下式(VII)表示之苯酚用與上述相同的方法氰酸酯化而得到。
又,以上式(III)表示之氰酸酯化合物,可藉由將下式(VIII)表示之苯酚用與上述相同的方法氰酸酯化而得到。
又,以上式(IV)表示之氰酸酯化合物,可藉由將下式(IX)表示之苯酚用與上述相同的方法氰酸酯化而得到。
又,以上式(V)表示之氰酸酯化合物,可藉由將下式(X)表示之苯酚用與上述相同的方法氰酸酯化而得到。
作為以上式(II)~(V)表示之氰酸酯化合物,可使用一般所公知者。可列舉例如:2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4’-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)醚、雙(4氰氧基苯基)硫醚、1,3-雙(4-氰氧基-α、α-二甲基苄基)苯、1,1-雙(4’-氰氧基苯基)環戊烷、1,1-雙(4’-氰氧基苯基)環己烷、苯酚酚醛型氰酸酯、甲酚酚酚型氰酸酯、聯苯芳烷基型氰酸酯、萘酚芳烷基型氰酸酯。
上述氰酸酯化合物之中,較佳為:2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、2,2-雙(4’-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、1,3-雙(4-氰氧基-α、α-二甲基苄基)
苯、1,1-雙(4’-氰氧基苯基)環戊烷、1,1-雙(4’-氰氧基苯基)環己烷、苯酚酚醛型氰酸酯、甲酚酚醛型氰酸酯、聯苯芳烷基型氰酸酯、萘酚芳烷基型氰酸酯;更佳為:2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4’-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、1,3-雙(4-氰氧基-α、α-二甲基苄基)苯、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、1,1-雙(4’-氰氧基苯基)環己烷、苯酚酚醛型氰酸酯、萘酚芳烷基型氰酸酯。此等氰酸酯化合物可使用1種或混合2種以上使用。
依據本發明之硬化性樹脂組成物,亦可包含氰酸酯化合物以外的樹脂、化合物,可列舉例如:環氧樹脂(D)、馬來醯亞胺化合物(E)、苯并化合物(F)、及具有可聚合之不飽和基之化合物(G)等。
作為硬化性樹脂組成物中的任意成分而含有之環氧樹脂(D),只要為在1分子中具有2個以上的環氧基之化合物即可,一般公知者皆可使用。可列舉例如:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、雙酚A酚醛型環氧樹脂、溴化雙酚A型環氧樹脂、溴化苯酚酚醛型環氧樹脂、3官能苯酚型環氧樹脂、4官能苯酚型環氧樹脂、萘型環氧樹脂、聯苯型環氧樹脂、苯酚芳烷基型環氧樹脂、聯苯芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、脂環型環氧樹脂、多元醇型環氧樹脂、含磷環氧樹脂、縮水甘油胺、縮水甘油酯、丁二烯等之雙鍵經環氧化之化合物、由含有羥基之矽氧樹脂類與環氧氯丙烷反應所得之化合物等。此等之中,較佳為:雙酚A型環氧樹脂、雙酚F型環氧樹脂、苯酚酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、溴化雙酚A型環氧樹脂、溴化苯酚酚醛型環氧樹脂、萘型環氧樹脂、聯苯型環氧樹脂、苯酚芳烷基型環氧樹脂、聯苯芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、脂環型環氧樹脂、多元醇型環氧樹脂、含磷環氧樹脂、縮水甘油胺、縮水甘油酯等;更佳為:雙酚A型環氧樹脂、雙酚F型環氧樹脂、萘型環氧樹脂、聯苯型環氧樹脂、苯酚芳烷基型環氧樹脂、聯苯芳烷基型環氧樹脂、萘酚芳烷基型環氧
樹脂、脂環型環氧樹脂等。此等環氧樹脂可使用1種或混合2種以上使用。
作為硬化性樹脂組成物中的任意成分而含有之馬來醯亞胺化合物(E),可適當地使用以下式(XI)表示之化合物。
作為以上式(XI)表示之馬來醯亞胺化合物,較佳為:雙(4-馬來醯亞胺苯基)甲烷、2,2-雙[4-(4-馬來醯亞胺苯氧基)苯基)丙烷、雙(3,5-二甲基-4-馬來醯亞胺苯基)甲烷、雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷、雙(3,5-二乙基-4--馬來醯亞胺苯基)甲烷。又,作為馬來醯亞胺化合物(E),可舉出:上述馬來醯亞胺化合物之預聚物或馬來醯亞胺化合物與胺化合物之預聚物等,此等化合物及預聚物可使用1種或適當地混合2種以上使用。
作為硬化性樹脂組成物中的任意成分而含有之苯并化合物(F),只要為在1分子中具有2個以上的二氫苯并環即可,一般所公知者皆可使用。可舉出例如日本特開2009-096874號公報中所記載之苯并化合物。此等苯并化合物可使用1種或混合2種以上使用。
又,作為硬化性樹脂組成物中的任意成分而含有之具有可聚合之不飽和基之化合物(G),可使用一般所公知者,可列舉例如:乙烯、丙烯、苯乙烯、二乙烯苯、二乙烯聯苯等乙烯基化合物、(甲基)丙烯酸
甲酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、聚丙二醇二(甲基)丙烯酸酯、三羥甲丙烷二(甲基)丙烯酸酯、三羥甲丙烷三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等之1元醇或多元醇之(甲基)丙烯酸酯類、雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等之環氧(甲基)丙烯酸酯類、苯并環丁烯樹脂等。此等具有不飽和基之化合物可使用1種或混合2種以上使用。
上述成分(C)至(G),在無損於依據本發明之硬化性樹脂組成物的效果之範圍內,可依用途而適當地添加,例如,相對於氰酸酯化合物(A)100質量份,較佳為含有氰酸酯化合物(C)0~100質量份、環氧樹脂(D)0~500質量份、馬來醯亞胺化合物(E)0~100質量份、苯并 化合物(F)0~100質量份、及具有可聚合之不飽和基之化合物(G)0~100質量份。藉由以上述比例含有各化合物及樹脂,更能獲得即使在高溫下硬化物的線膨脹係數也小、且耐熱性優異的硬化性樹脂組成物。
依據本發明之硬化性樹脂組成物,於上述化合物及樹脂之外,亦可更含有無機填充材。作為無機填充材,可列舉:滑石、煅燒黏土、未煅燒黏土、雲母、玻璃等之矽酸鹽、二氧化鈦、氧化鋁、二氧化矽、熔融二氧化矽等之氧化物、碳酸鈣、碳酸鎂、水滑石等之碳酸鹽、氫氧化鋁、氫氧化鎂、氫氧化鈣等之氫氧化物、硫酸鋇、硫酸鈣、亞硫酸鈣等之硫酸鹽或亞硫酸鹽、硼酸鋅、偏硼酸鋇、硼酸鋁、硼酸鈣、硼酸鈉等之硼酸鹽、氮化鋁、氮化硼、氮化矽、氮化碳等之氮化物、鈦酸鍶、鈦酸鋇等之鈦酸鹽等。此等之中,可單獨使用1種類,亦可併用2種類以上。此等之中,尤以二氧化矽為佳,基於熔融二氧化矽有優異的低熱膨脹性,尤其特佳。又,有破碎狀、球狀的二氧化矽存在著,基於降低樹脂組成物的熔融黏度的考量,以球狀二氧化矽為佳。
球狀二氧化矽亦可為更進一步預先以表面處理用處理劑進行處理
者。作為處理劑,較佳可使用選自於由含有官能基之矽烷類、環狀寡聚矽氧烷類、有機鹵矽烷類、及烷基矽氨烷(silazane)類構成的群組中之至少一種類以上的化合物。該等之中,由於用有機鹵矽烷類及烷基矽氨烷類進行球狀二氧化矽的表面處理,適於將二氧化矽表面疏水化,在硬化性樹脂組成物中之球狀二氧化矽的分散性優異,故較佳。
作為處理劑使用之含有官能基之矽烷類並無特別限定,可列舉例如:3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、及2-(3、4-環氧環己基)乙基二甲氧基矽烷等之環氧矽烷化合物、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、及3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷等之(甲基)丙烯基矽烷、3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、及3-巰基丙基甲基二甲氧基矽烷等之巰基矽烷、乙烯基三乙氧基矽烷、乙烯基三甲氧基矽烷、及乙烯基三氯矽烷等之乙烯基矽烷、3-異氰酸酯丙基三乙氧基矽烷等之異氰酸酯矽烷、3-脲丙基三甲氧基矽烷、及3-脲丙基三乙氧基矽烷等之脲矽烷、(5-降莰烯-2-基)三甲氧基矽烷、(5-降莰烯-2-基)三乙氧基矽烷、及(5-降莰烯-2-基)乙基三甲氧基矽烷等之(5-降莰烯-2-基)烷基矽烷、苯基三甲氧基矽烷等之苯基矽烷等。
又,於硬化性樹脂組成物中,亦可添加矽氧樹脂粉。矽氧樹脂粉末係矽氧烷鍵為以(RSiO3/2)n表示之交聯成具有三維網目狀構造的硬化物粉末,較佳為平均粒徑0.1~10μm的粉末。具體而言,可列舉:KMP-590(信越SILICONE製)、KMP-701(信越SILICONE製)、X-52-854(信越SILICONE製)、X-52-1621(信越SILICONE製)、XC99-B5664(Momentive Performance Materials製)、XC99-A8808(Momentive Performance Materials製)、Tospal 120(Momentive Performance Materials製)等,可使用1種或適當地混合2種以上使用。
依據本發明之硬化性樹脂組成物之獲得,可藉由將上述之氰酸酯化合物(A)及硬化促進劑(B),以及依需要之上述任意的成分之氰酸酯化合物(C)、環氧樹脂(D)、馬來醯亞胺化合物(E)、苯并化合物(F)及/或具有可聚合之不飽和基之化合物(G)、或各種添加劑,與溶劑一起,用公知的混合機混合,例如:高速混合機、Nauter混合機、螺旋帶式摻混機(ribbon blender)、捏合機、高速混練機(intensive mixer)、萬能混合機、溶解機(desolver)、靜態混合機(static mixer)等。混合時之氰酸酯化合物、各種添加劑、溶劑的添加方法並無特別限定。
依據本發明之硬化物,可將上述硬化性樹脂組成物藉由光或熱等使其硬化而得到。例如,使硬化性樹脂組成物熔融或溶解於溶劑中後,流入模具內,在通常的條件下使其硬化,藉此可得到任意形狀之硬化物。
於以熱使硬化性樹脂組成物硬化的情形,較佳為於160~300℃使其硬化,更佳為於170~250℃下使其硬化,又更佳為於180~230℃下使其硬化。藉由在上述溫度範圍進行熱硬化,可得到更進一步硬化物的貯存彈性係數之降低受到抑制、即使在高溫硬化物的線膨脹係數也小、且耐熱性優異的硬化物。
於依據本發明之硬化物的製造方法中,可在上述溫度範圍實施特定時間的加熱步驟,也可進行2次以上在特定的加熱溫度保持特定時間之步驟,即所謂的分階段硬化(step cure),藉此使硬化性樹脂組成物硬化。於採用分階段硬化的情形,較佳為第2次以後的加熱步驟係在較前述第1次加熱步驟更高溫下實施。例如,可在80~150℃實施第1次加熱步驟,在150~300℃實施第2次以後的加熱步驟。藉此,可得到更進一步硬化物的貯存彈性係數之降低受到抑制、即使在高溫硬化物的線膨脹係數也小、且耐熱性優異的硬化物。
用上述硬化性樹脂組成物可製造密封材料。密封材料之製造方法並無特別限定,可將上述成分用公知的混合機混合而得到。混合時之氰酸酯化合物(A)、硬化促進劑(B)、或其他任意成分、溶劑等之添加方法並無特別限定。
又,用本發明之硬化性樹脂組成物可製造無機及/或有機纖維基材預浸體。預浸體的製造方法並無特別限定,可使用於印刷線路材料的周知之方法。例如,可使用使樹脂組成物清漆含浸於無機及/或有機纖維基材中,使其乾燥,使其B步驟化而做成為預浸體的方法等。
依據本發明之硬化性樹脂組成物可使用於覆金屬疊層板及多層板之製造。此等疊層板之製造方法並無特別限定,可藉由將上述預浸體與金屬箔疊合者進行加熱加壓成形而得到疊層板。加熱之溫度並無特別限定,較佳為65~300℃,特佳為120~270℃。又,加壓之壓力並無特別限定,較佳為2~5Mpa,更佳為2.5~4Mpa。
又,用依據本發明之硬化性樹脂組成物可製造纖維強化複合材料。有關強化纖維的形態與排列並無特別限定,可由織物、不織物、氈、針織物、編織物(braid)、單方向股線、紗束、切股(chopped strand)等之中適當選擇。又,作為強化纖維之形態,亦可使用預成形物(preform)(使由強化纖維構成的織布基布疊層者、或將其以縫合線縫合而一體化者、或立體織物、編組物等之纖維構造物)。作為此等纖維強化複合材料之製造方法,具體而言,可列舉:液體複合塑造法(liquid composite molding method)、樹脂-膜融合法、纖維纏繞法、帶疊層法、突出法(protrusion method)等。此等之中,尤其以液體複合塑造法之一的樹脂轉移成形法,由於可將金屬板、發泡物芯、蜂巢式芯等預成形物以外的材料預先設置於成形模具內,故可因應各種用途,因而可較佳地使用於在短時間內大量生產形狀比較複雜的複合材料的情
形。
依據本發明之硬化性樹脂組成物由於具有優異的低熱膨脹性及高耐熱性,故作為高機能性高分子材料極為有用,作為熱性能、電氣性能及機械物性優異之材料可較佳地使用於電絕緣材料、密封材料、黏接劑、疊層材料、抗蝕劑、堆積疊層板材料之外,亦可使用於土木、建築、電氣、電子、汽車、鐵路、船舶、航空器、運動用品、美術、工藝等方面之固定材料、構造構件、補強劑、塑型材料等。此等之中,尤其適用於要求低熱膨脹性、耐燃性及高度機械強度的半導體密封材料、或電子零件的黏接劑、航空器構造構件、衛星構造構件及鐵路車輛構造構件。
於下述中,藉由實施例就本發明更具體地做說明,但本發明並非限定於此等實施例。
將1,1-雙(4-羥基苯基)異丁烷(和光純藥工業(股)公司製)24.2g(100毫莫耳)及三乙胺28.3g(280毫莫耳)溶解於四氫呋喃100mL中(溶液1)。於-10℃下將溶液1以1.5小時的時間滴入到氯化氰18.4g(300毫莫耳)的二氯甲烷溶液46.2g與四氫呋喃100ml的混合液中。於確認得反應結束時將反應液濃縮,使得到的粗製物溶解於二氯甲烷300mL中。將其以1M鹽酸、蒸餾水洗淨,以無水硫酸鎂乾燥。將二氯甲烷餾出,得到標的物之1,1-雙(4-氰氧基苯基)異丁烷28.3g。藉由NMR波譜鑑定上述所得到的化合物之構造。NMR波譜係如圖1所示。
1H-NMR:(270MHz、氯仿-d、內部標準TMS)
δ(ppm)0.88(d,6H)、2.41(m,1H)、3.51(d,1H)、7.20-7.35(complex,8H)
除了係用1,1-雙(4-羥基苯基)乙烷(和光純藥工業(股)公司製)代替1,1-雙(4-羥基苯基)異丁烷之外,係以與合成例1同樣地實施,得到1,1-雙(4-氰氧基苯基)乙烷23.1g。藉由NMR波譜鑑定上述所得到的化合物之構造。NMR波譜係如圖2所示。
1H-NMR:(270MHz、氯仿-d、內部標準TMS)
δ(ppm)1.62(d,3H)、4.22(q,1H)、7.42(complex,8H)
將合成例1所得之Bis-IB CN 100質量份與乙醯丙酮鈷(III)(和光純藥工業(股)公司製)0.01質量份混合並加熱,以真空泵脫氣,得到組成物。對得到的組成物以目視確認其在50℃之不溶解物之有無及硬化進行之狀況。並測定組成物在50℃的黏度。黏度測定係用動態黏彈性測定裝置(AR2000,T.A.Instrument公司製)測定,於角速度10 rad/秒、幾何間隙(geometry gap)1mm的測定條件測定黏度。
將如上述所得之組成物再度加熱,注入到以玻璃板(120mm×120mm×5mm)、聚醯亞胺膜(Kapton 200H:東麗杜邦(股)公司製)、氟橡膠製O型環(S-100:森清化工(股)製)所製作的模具中,在烤爐內於150℃加熱1小時,接著,在200℃加熱3小時,然後,在250℃加熱4小時使其硬化。冷卻後,藉由研磨將聚醯亞胺膜去除,得到硬化物。
除了將例1中之硬化條件改為在130℃ 3小時、在250℃ 4小時之分階段硬化之外,係以與例1同樣的做法得到硬化物。
除了將例1中之乙醯丙酮鈷(III)的調配量由0.01質量份改為0.5質量份之外,係以與例1同樣的做法得到硬化物。
除了將例1中之使用乙醯丙酮鈷(III)0.01質量份改為使用乙醯丙酮鋁(III)(東京化成工業(股)公司製)0.02質量份之外,係以與例1同樣的做法得到硬化物。
除了將例4中之乙醯丙酮鋁(III)改用乙醯丙酮銅(II)(東京化成工業(股)公司製)之外,係以與例4同樣的做法得到硬化物。
除了將例1中之使用乙醯丙酮鈷(III)0.01質量份改為使用乙醯丙酮錳(II)(東京化成工業(股)公司製)0.06質量份之外,係以與例1同樣的做法得到硬化物。
除了將例6中之乙醯丙酮錳(II)改用乙醯丙酮鋯(IV)(東京化成工業(股)公司製)之外,係以與例6同樣的做法得到硬化物。
將例6中之乙醯丙酮錳(II)改用乙醯丙酮鎳(II)(東京化成工業(股)公司製),並將硬化條件改為180℃ 3小時、250℃ 4小時之分階段硬化,除此之外,係以與例6同樣的做法得到硬化物。
除了例1中未使用乙醯丙酮鈷(III)之外,係以與例1同樣的做法
得到硬化物。
除了將例9中之使用Bis-IB CN 100質量份改為使用合成例2中得到的Bis-E CN 100質量份之外,係以與例9同樣的做法得到硬化物。
將例1中之使用Bis-IB CN改為使用合成例2中得到的Bis-E CN,並將乙醯丙酮鈷(III)的調配量0.01質量份改為0.02質量份,除此之外,係以與例1同樣的做法得到硬化物。
除了將例11中之使用乙醯丙酮鈷(III)0.02質量份改為使用乙醯丙酮鋁(III)(東京化成工業(股)公司製)0.06質量份之外,係以與例11同樣的做法得到硬化物。
除了將例12中之乙醯丙酮鋁(III)改用乙醯丙酮錳(II)之外,係以與例12同樣的做法得到硬化物。
除了將例11中之Bis-E CN改為2,2-雙(4-氰氧基苯基)丙烷(三菱瓦斯化學(股)公司製,簡記為Bis-A CN)之外,係以與例11同樣的做法得到硬化物。
除了將例12中之Bis-E CN改為2,2-雙(4-氰氧基苯基)丙烷(三菱瓦斯化學(股)公司製,簡記為Bis-A CN)之外,係以與例12同樣的做法得到硬化物。
將例14中之乙醯丙酮鈷(III)改用乙醯丙酮銅(II),並將硬化條件改為180℃ 3小時、250℃ 4小時之分階段硬化,除此之外,係以與例14同樣的做法得到硬化物。
將例14中之乙醯丙酮鈷(III)改用乙醯丙酮錳(II),並將硬化條件改為180℃ 3小時、250℃ 4小時之分階段硬化,除此之外,係以與例14同樣的做法得到硬化物。
除了將例15中之乙醯丙酮鋁(III)改用乙醯丙酮鋯(IV)之外,係以與例15同樣的做法得到硬化物。
對如上述所得到之各硬化物測定貯存彈性係數、玻璃轉化溫度及線膨脹係數。貯存彈性係數及玻璃轉化溫度係依據JIS-K7244-7-2007進行測定,用動態黏彈性測定裝置(AR2000,T.A.Instrument公司製),於開始溫度100℃、終了溫度350℃、昇溫速度3℃/分鐘、測定頻率1Hz的測定條件施行動態黏度測定,並測定貯存彈性係數(G’)變化與玻璃轉化溫度。貯存彈性係數變化與玻璃轉化溫度係定義如下。
以於350℃之貯存彈性係數除以於100℃之貯存彈性係數所得之值來評價。求得之貯存彈性係數變化係以例9的數值作為100來做成指數而表示。
係以測定溫度範圍內之損失正切(tan δ)的最大值作為玻璃轉化溫度。
又,線膨脹係數係依據JIS-K-7197-1991而進行測定,將試驗片(5mm×5mm×5mm)設置於熱機械分析裝置(TMA/SS7100,SII Nanotechnology(股)公司製),以開始溫度100℃、終了溫度300℃、昇溫速度5℃/分鐘、負載0.05N之測定條件,實施膨脹-壓縮模式下之熱機械分析,測定於200℃~300℃下之每1℃的平均熱膨脹量。評價結果係如下述表1及表2所示。又,表中之數值單位係表示質量份,「-」之記載部份表示未調配該原料。
圖1係於合成例1得到的1,1-雙(氰氧基苯基)異丁烷之1H-NMR圖。
圖2係於合成例2得到的1,1-雙(氰氧基苯基)乙烷之1H-NMR圖。
Claims (17)
- 一種硬化性樹脂組成物,係包含以下式(1)表示之氰酸酯化合物(A)與硬化促進劑(B)而成:
- 如申請專利範圍第1項之硬化性樹脂組成物,其中,該R1為碳數2~5之烷基。
- 如申請專利範圍第2項之硬化性樹脂組成物,其中,該R1係選自於由乙基、異丙基、及第三丁基構成的群組。
- 如申請專利範圍第1至3項中任一項之硬化性樹脂組成物,其中,該硬化促進劑(B)為金屬錯合化合物。
- 如申請專利範圍第4項之硬化性樹脂組成物,其中,該金屬錯合化合物係選自於由鈷、鋁、銅、錳、鋯、及鎳構成之群組中之金屬之錯合化合物。
- 如申請專利範圍第1至5項中任一項之硬化性樹脂組成物,其中,該硬化促進劑(B)之含量,相對於該氰酸酯化合物(A)100質量份為0.01~1.0質量份。
- 如申請專利範圍第1至6項中任一項之硬化性樹脂組成物,更包含選自於由下式(II)、下式(III)、下式(IV)及下式(V)構成之群組中之至少1種以上的氰酸酯化合物(C)而成:
- 如申請專利範圍第1至7項中任一項之硬化性樹脂組成物,更 包含選自於由環氧樹脂(D)、馬來醯亞胺化合物(E)、苯并化合物(F)、及具有可聚合之不飽和基之化合物(G)構成之群組中之1種以上。
- 一種硬化物之製造方法,係使用如申請專利範圍第1至8項中任一項之硬化性樹脂組成物製造硬化物之方法,包含將該硬化性樹脂組成物於160~300℃之溫度加熱使其硬化之步驟。
- 如申請專利範圍第9項之硬化物之製造方法,其中,該加熱步驟至少以2次的步驟進行。
- 如申請專利範圍第10項之硬化物之製造方法,其中,該第2次以後的加熱步驟,係於較該第1次的加熱步驟在更高溫實施。
- 一種硬化物,係依照如申請專利範圍第9至11項中任一項之硬化物之製造方法獲得。
- 一種密封用材料,係含有如申請專利範圍第1至8項中任一項之硬化性樹脂組成物而成。
- 一種黏接劑,係含有如申請專利範圍第1至8項中任一項之硬化性樹脂組成物而成。
- 一種絕緣材料,係含有如申請專利範圍第1至8項中任一項之硬化性樹脂組成物而成。
- 一種預浸體,係將如申請專利範圍第1至8項中任一項之硬化性樹脂組成物含浸或塗佈於基材而成。
- 一種疊層板,係將至少1片以上之如申請專利範圍第16項之預浸體重疊並予以疊層成形而獲得。
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US (1) | US20140242394A1 (zh) |
EP (1) | EP2733159A4 (zh) |
JP (1) | JPWO2013008667A1 (zh) |
KR (1) | KR20140041718A (zh) |
CN (1) | CN103748140B (zh) |
TW (1) | TW201307437A (zh) |
WO (1) | WO2013008667A1 (zh) |
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JP6667126B2 (ja) * | 2015-06-02 | 2020-03-18 | 三菱瓦斯化学株式会社 | シアン酸エステル化合物、該化合物を含む硬化性樹脂組成物及びその硬化物 |
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JP6544713B2 (ja) * | 2015-06-17 | 2019-07-17 | 三菱瓦斯化学株式会社 | シアン酸エステル化合物、該化合物を含む硬化性樹脂組成物及びその硬化物 |
CN107236300A (zh) * | 2017-07-26 | 2017-10-10 | 魏龙飞 | 一种用作智能机器人壳体的复合材料 |
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2012
- 2012-07-02 US US14/131,772 patent/US20140242394A1/en not_active Abandoned
- 2012-07-02 WO PCT/JP2012/066916 patent/WO2013008667A1/ja active Application Filing
- 2012-07-02 JP JP2013523893A patent/JPWO2013008667A1/ja active Pending
- 2012-07-02 KR KR1020147000754A patent/KR20140041718A/ko not_active Application Discontinuation
- 2012-07-02 CN CN201280034767.5A patent/CN103748140B/zh not_active Expired - Fee Related
- 2012-07-02 EP EP12811497.2A patent/EP2733159A4/en not_active Withdrawn
- 2012-07-09 TW TW101124680A patent/TW201307437A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI681985B (zh) * | 2015-07-07 | 2020-01-11 | 日商信越化學工業股份有限公司 | 半導體密封用熱硬化性樹脂組成物 |
Also Published As
Publication number | Publication date |
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CN103748140A (zh) | 2014-04-23 |
WO2013008667A1 (ja) | 2013-01-17 |
EP2733159A4 (en) | 2015-01-07 |
CN103748140B (zh) | 2016-03-09 |
US20140242394A1 (en) | 2014-08-28 |
JPWO2013008667A1 (ja) | 2015-02-23 |
KR20140041718A (ko) | 2014-04-04 |
EP2733159A1 (en) | 2014-05-21 |
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