TW200843071A - Flexible substrate and semiconductor device - Google Patents
Flexible substrate and semiconductor device Download PDFInfo
- Publication number
- TW200843071A TW200843071A TW97101208A TW97101208A TW200843071A TW 200843071 A TW200843071 A TW 200843071A TW 97101208 A TW97101208 A TW 97101208A TW 97101208 A TW97101208 A TW 97101208A TW 200843071 A TW200843071 A TW 200843071A
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible substrate
- pattern
- semiconductor wafer
- holes
- wiring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007010157A JP4185954B2 (ja) | 2007-01-19 | 2007-01-19 | フレキシブル基板及び半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200843071A true TW200843071A (en) | 2008-11-01 |
Family
ID=39635856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97101208A TW200843071A (en) | 2007-01-19 | 2008-01-11 | Flexible substrate and semiconductor device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4185954B2 (ja) |
TW (1) | TW200843071A (ja) |
WO (1) | WO2008087851A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037156A (zh) * | 2009-07-15 | 2014-09-10 | 瑞萨电子株式会社 | 半导体装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4983386B2 (ja) * | 2007-05-15 | 2012-07-25 | 住友金属鉱山株式会社 | Cof用配線基板 |
US8917227B2 (en) * | 2011-10-05 | 2014-12-23 | Panasonic Corporation | Display |
JP2014082481A (ja) * | 2012-09-28 | 2014-05-08 | Nichia Chem Ind Ltd | 発光装置 |
WO2014065099A1 (ja) * | 2012-10-23 | 2014-05-01 | オリンパス株式会社 | 撮像装置、内視鏡、半導体装置、及び半導体装置の製造方法 |
JP6076048B2 (ja) * | 2012-11-12 | 2017-02-08 | オリンパス株式会社 | 撮像装置及び内視鏡 |
JP5657767B2 (ja) * | 2013-10-30 | 2015-01-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5878611B2 (ja) * | 2014-11-26 | 2016-03-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP7318055B2 (ja) * | 2019-08-27 | 2023-07-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6870043B2 (ja) * | 2019-08-27 | 2021-05-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1032229A (ja) * | 1996-03-26 | 1998-02-03 | Canon Inc | Tcp構造体、回路接続構造及び表示装置 |
JPH1145913A (ja) * | 1997-05-26 | 1999-02-16 | Seiko Epson Corp | フィルムキャリアおよび半導体装置 |
JP2000031612A (ja) * | 1998-07-09 | 2000-01-28 | Seiko Epson Corp | 配線基板 |
JP3446818B2 (ja) * | 1999-05-10 | 2003-09-16 | 日本電気株式会社 | 半導体装置の実装構造、及びその製造方法 |
JP2003110202A (ja) * | 2001-09-28 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
JP3832576B2 (ja) * | 2002-03-28 | 2006-10-11 | セイコーエプソン株式会社 | 配線基板、半導体装置及びその製造方法、パネルモジュール並びに電子機器 |
JP3093150U (ja) * | 2002-10-01 | 2003-04-18 | 船井電機株式会社 | リモートコントローラのプリント基板へのic位置決め構造及びプリント基板へのic位置決め構造。 |
JP2004096072A (ja) * | 2003-05-12 | 2004-03-25 | Victor Co Of Japan Ltd | 配線基板 |
JP2005109254A (ja) * | 2003-09-30 | 2005-04-21 | Optrex Corp | 集積回路搭載基板およびこれを備えた表示装置 |
JP4437051B2 (ja) * | 2004-04-01 | 2010-03-24 | イビデン株式会社 | フレックスリジッド配線板 |
JP2006032872A (ja) * | 2004-07-22 | 2006-02-02 | Sony Corp | 回路基板及び半導体装置 |
JP4485460B2 (ja) * | 2004-12-16 | 2010-06-23 | 三井金属鉱業株式会社 | フレキシブルプリント配線板 |
JP2006351976A (ja) * | 2005-06-20 | 2006-12-28 | Murata Mfg Co Ltd | 回路モジュールおよび回路装置 |
JP2008010496A (ja) * | 2006-06-27 | 2008-01-17 | Victor Co Of Japan Ltd | 実装基板の作製方法 |
-
2007
- 2007-01-19 JP JP2007010157A patent/JP4185954B2/ja not_active Expired - Fee Related
- 2007-12-28 WO PCT/JP2007/075243 patent/WO2008087851A1/ja active Application Filing
-
2008
- 2008-01-11 TW TW97101208A patent/TW200843071A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037156A (zh) * | 2009-07-15 | 2014-09-10 | 瑞萨电子株式会社 | 半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2008177402A (ja) | 2008-07-31 |
WO2008087851A1 (ja) | 2008-07-24 |
JP4185954B2 (ja) | 2008-11-26 |
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