TW200843071A - Flexible substrate and semiconductor device - Google Patents

Flexible substrate and semiconductor device Download PDF

Info

Publication number
TW200843071A
TW200843071A TW97101208A TW97101208A TW200843071A TW 200843071 A TW200843071 A TW 200843071A TW 97101208 A TW97101208 A TW 97101208A TW 97101208 A TW97101208 A TW 97101208A TW 200843071 A TW200843071 A TW 200843071A
Authority
TW
Taiwan
Prior art keywords
flexible substrate
pattern
semiconductor wafer
holes
wiring
Prior art date
Application number
TW97101208A
Other languages
English (en)
Chinese (zh)
Inventor
Katsuyuki Naitoh
Hiroaki Kitazaki
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200843071A publication Critical patent/TW200843071A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
TW97101208A 2007-01-19 2008-01-11 Flexible substrate and semiconductor device TW200843071A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007010157A JP4185954B2 (ja) 2007-01-19 2007-01-19 フレキシブル基板及び半導体装置

Publications (1)

Publication Number Publication Date
TW200843071A true TW200843071A (en) 2008-11-01

Family

ID=39635856

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97101208A TW200843071A (en) 2007-01-19 2008-01-11 Flexible substrate and semiconductor device

Country Status (3)

Country Link
JP (1) JP4185954B2 (ja)
TW (1) TW200843071A (ja)
WO (1) WO2008087851A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037156A (zh) * 2009-07-15 2014-09-10 瑞萨电子株式会社 半导体装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4983386B2 (ja) * 2007-05-15 2012-07-25 住友金属鉱山株式会社 Ｃｏｆ用配線基板
US8917227B2 (en) * 2011-10-05 2014-12-23 Panasonic Corporation Display
JP2014082481A (ja) * 2012-09-28 2014-05-08 Nichia Chem Ind Ltd 発光装置
WO2014065099A1 (ja) * 2012-10-23 2014-05-01 オリンパス株式会社 撮像装置、内視鏡、半導体装置、及び半導体装置の製造方法
JP6076048B2 (ja) * 2012-11-12 2017-02-08 オリンパス株式会社 撮像装置及び内視鏡
JP5657767B2 (ja) * 2013-10-30 2015-01-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5878611B2 (ja) * 2014-11-26 2016-03-08 ルネサスエレクトロニクス株式会社 半導体装置
JP7318055B2 (ja) * 2019-08-27 2023-07-31 ルネサスエレクトロニクス株式会社 半導体装置
JP6870043B2 (ja) * 2019-08-27 2021-05-12 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032229A (ja) * 1996-03-26 1998-02-03 Canon Inc Ｔｃｐ構造体、回路接続構造及び表示装置
JPH1145913A (ja) * 1997-05-26 1999-02-16 Seiko Epson Corp フィルムキャリアおよび半導体装置
JP2000031612A (ja) * 1998-07-09 2000-01-28 Seiko Epson Corp 配線基板
JP3446818B2 (ja) * 1999-05-10 2003-09-16 日本電気株式会社 半導体装置の実装構造、及びその製造方法
JP2003110202A (ja) * 2001-09-28 2003-04-11 Toshiba Corp カード型電子機器
JP3832576B2 (ja) * 2002-03-28 2006-10-11 セイコーエプソン株式会社 配線基板、半導体装置及びその製造方法、パネルモジュール並びに電子機器
JP3093150U (ja) * 2002-10-01 2003-04-18 船井電機株式会社 リモートコントローラのプリント基板へのｉｃ位置決め構造及びプリント基板へのｉｃ位置決め構造。
JP2004096072A (ja) * 2003-05-12 2004-03-25 Victor Co Of Japan Ltd 配線基板
JP2005109254A (ja) * 2003-09-30 2005-04-21 Optrex Corp 集積回路搭載基板およびこれを備えた表示装置
JP4437051B2 (ja) * 2004-04-01 2010-03-24 イビデン株式会社 フレックスリジッド配線板
JP2006032872A (ja) * 2004-07-22 2006-02-02 Sony Corp 回路基板及び半導体装置
JP4485460B2 (ja) * 2004-12-16 2010-06-23 三井金属鉱業株式会社 フレキシブルプリント配線板
JP2006351976A (ja) * 2005-06-20 2006-12-28 Murata Mfg Co Ltd 回路モジュールおよび回路装置
JP2008010496A (ja) * 2006-06-27 2008-01-17 Victor Co Of Japan Ltd 実装基板の作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037156A (zh) * 2009-07-15 2014-09-10 瑞萨电子株式会社 半导体装置

Also Published As

Publication number Publication date
JP2008177402A (ja) 2008-07-31
WO2008087851A1 (ja) 2008-07-24
JP4185954B2 (ja) 2008-11-26

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