TW200817645A - Rack, rack system, heat treatment apparatus, and heat treatment system - Google Patents

Rack, rack system, heat treatment apparatus, and heat treatment system Download PDF

Info

Publication number
TW200817645A
TW200817645A TW096119357A TW96119357A TW200817645A TW 200817645 A TW200817645 A TW 200817645A TW 096119357 A TW096119357 A TW 096119357A TW 96119357 A TW96119357 A TW 96119357A TW 200817645 A TW200817645 A TW 200817645A
Authority
TW
Taiwan
Prior art keywords
frame
heat treatment
plate
hand
shed
Prior art date
Application number
TW096119357A
Other languages
English (en)
Chinese (zh)
Inventor
Toshiro Kanda
Original Assignee
Espec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espec Corp filed Critical Espec Corp
Publication of TW200817645A publication Critical patent/TW200817645A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Charging Or Discharging (AREA)
TW096119357A 2006-06-14 2007-05-30 Rack, rack system, heat treatment apparatus, and heat treatment system TW200817645A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006164198A JP2007333272A (ja) 2006-06-14 2006-06-14 ラック、ラックシステム、熱処理装置、並びに、熱処理システム

Publications (1)

Publication Number Publication Date
TW200817645A true TW200817645A (en) 2008-04-16

Family

ID=38932910

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119357A TW200817645A (en) 2006-06-14 2007-05-30 Rack, rack system, heat treatment apparatus, and heat treatment system

Country Status (4)

Country Link
JP (1) JP2007333272A (ja)
KR (1) KR20070119516A (ja)
CN (1) CN100570260C (ja)
TW (1) TW200817645A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4896954B2 (ja) * 2008-12-05 2012-03-14 エスペック株式会社 熱処理装置
JP2014504039A (ja) * 2011-02-01 2014-02-13 株式会社テラセミコン 基板支持用ボートおよびこれを用いた支持ユニット
DE102013107110A1 (de) * 2013-07-05 2015-01-22 Epcos Ag Verfahren zur Behandlung von Grünteilen und Träger für Grünteile
JP6491073B2 (ja) * 2015-10-15 2019-03-27 豊田鉄工株式会社 加熱装置
JP6491072B2 (ja) * 2015-10-15 2019-03-27 豊田鉄工株式会社 加熱装置
CN111302627A (zh) * 2020-02-18 2020-06-19 龙泉瓯江青瓷有限公司 一种中温龙泉青釉的烧制工艺及其烧制设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964217B1 (de) * 1998-04-15 2003-06-25 Saint-Gobain IndustrieKeramik Rödental GmbH Ofenwagen-Brennregal
CN2387491Y (zh) * 1999-09-30 2000-07-12 程春根 热处理炉用托架
US6454564B2 (en) * 2000-06-16 2002-09-24 Steeltech Ltd. Workpiece support trays for furnances
US6644966B1 (en) * 2002-07-03 2003-11-11 Bell New Ceramics Co., Ltd. Carriage for supporting objects to be heated by kiln
DE10327095A1 (de) * 2003-06-13 2005-02-10 Schunk Kohlenstofftechnik Gmbh Träger für Bauteile sowie Verfahren zum Herstellen eines solchen
CN2700337Y (zh) * 2004-04-30 2005-05-18 洛阳轴承集团有限公司 铁路轴承套圈渗碳用组合架

Also Published As

Publication number Publication date
JP2007333272A (ja) 2007-12-27
CN101089530A (zh) 2007-12-19
CN100570260C (zh) 2009-12-16
KR20070119516A (ko) 2007-12-20

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