CN100570260C - 机架、机架***、热处理装置和热处理*** - Google Patents

机架、机架***、热处理装置和热处理*** Download PDF

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Publication number
CN100570260C
CN100570260C CNB2007101091760A CN200710109176A CN100570260C CN 100570260 C CN100570260 C CN 100570260C CN B2007101091760 A CNB2007101091760 A CN B2007101091760A CN 200710109176 A CN200710109176 A CN 200710109176A CN 100570260 C CN100570260 C CN 100570260C
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China
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longeron
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access
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Expired - Fee Related
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CNB2007101091760A
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English (en)
Chinese (zh)
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CN101089530A (zh
Inventor
神田敏朗
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Espec Corp
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Espec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Charging Or Discharging (AREA)
CNB2007101091760A 2006-06-14 2007-06-14 机架、机架***、热处理装置和热处理*** Expired - Fee Related CN100570260C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006164198A JP2007333272A (ja) 2006-06-14 2006-06-14 ラック、ラックシステム、熱処理装置、並びに、熱処理システム
JP2006164198 2006-06-14

Publications (2)

Publication Number Publication Date
CN101089530A CN101089530A (zh) 2007-12-19
CN100570260C true CN100570260C (zh) 2009-12-16

Family

ID=38932910

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101091760A Expired - Fee Related CN100570260C (zh) 2006-06-14 2007-06-14 机架、机架***、热处理装置和热处理***

Country Status (4)

Country Link
JP (1) JP2007333272A (ja)
KR (1) KR20070119516A (ja)
CN (1) CN100570260C (ja)
TW (1) TW200817645A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4896954B2 (ja) * 2008-12-05 2012-03-14 エスペック株式会社 熱処理装置
JP2014504039A (ja) * 2011-02-01 2014-02-13 株式会社テラセミコン 基板支持用ボートおよびこれを用いた支持ユニット
DE102013107110A1 (de) * 2013-07-05 2015-01-22 Epcos Ag Verfahren zur Behandlung von Grünteilen und Träger für Grünteile
JP6491073B2 (ja) * 2015-10-15 2019-03-27 豊田鉄工株式会社 加熱装置
JP6491072B2 (ja) * 2015-10-15 2019-03-27 豊田鉄工株式会社 加熱装置
CN111302627A (zh) * 2020-02-18 2020-06-19 龙泉瓯江青瓷有限公司 一种中温龙泉青釉的烧制工艺及其烧制设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964217A1 (de) * 1998-04-15 1999-12-15 Maschinen- und Stahlbau Julius Lippert GmbH & Co. Ofenwagen-Brennregal
CN2387491Y (zh) * 1999-09-30 2000-07-12 程春根 热处理炉用托架
US6454564B2 (en) * 2000-06-16 2002-09-24 Steeltech Ltd. Workpiece support trays for furnances
US6644966B1 (en) * 2002-07-03 2003-11-11 Bell New Ceramics Co., Ltd. Carriage for supporting objects to be heated by kiln
CN2700337Y (zh) * 2004-04-30 2005-05-18 洛阳轴承集团有限公司 铁路轴承套圈渗碳用组合架
CN1836054A (zh) * 2003-06-13 2006-09-20 申克碳化技术股份有限公司 构件的托架及用于制造这种托架的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964217A1 (de) * 1998-04-15 1999-12-15 Maschinen- und Stahlbau Julius Lippert GmbH & Co. Ofenwagen-Brennregal
CN2387491Y (zh) * 1999-09-30 2000-07-12 程春根 热处理炉用托架
US6454564B2 (en) * 2000-06-16 2002-09-24 Steeltech Ltd. Workpiece support trays for furnances
US6644966B1 (en) * 2002-07-03 2003-11-11 Bell New Ceramics Co., Ltd. Carriage for supporting objects to be heated by kiln
CN1836054A (zh) * 2003-06-13 2006-09-20 申克碳化技术股份有限公司 构件的托架及用于制造这种托架的方法
CN2700337Y (zh) * 2004-04-30 2005-05-18 洛阳轴承集团有限公司 铁路轴承套圈渗碳用组合架

Also Published As

Publication number Publication date
JP2007333272A (ja) 2007-12-27
CN101089530A (zh) 2007-12-19
TW200817645A (en) 2008-04-16
KR20070119516A (ko) 2007-12-20

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Granted publication date: 20091216

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CF01 Termination of patent right due to non-payment of annual fee