JP5161335B2 - 基板の搬送装置及びこれを備えた基板の加工装置 - Google Patents
基板の搬送装置及びこれを備えた基板の加工装置 Download PDFInfo
- Publication number
- JP5161335B2 JP5161335B2 JP2011084845A JP2011084845A JP5161335B2 JP 5161335 B2 JP5161335 B2 JP 5161335B2 JP 2011084845 A JP2011084845 A JP 2011084845A JP 2011084845 A JP2011084845 A JP 2011084845A JP 5161335 B2 JP5161335 B2 JP 5161335B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- robot arm
- substrates
- stage
- robot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 231
- 238000012545 processing Methods 0.000 title claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 21
- 238000001291 vacuum drying Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000032258 transport Effects 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 5
- 230000001965 increasing effect Effects 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 126
- 238000000926 separation method Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
2,20 製造ライン
3 ロボットアーム
4,22 搬入コンベア
5,7,8,11,23,25,29 ステージ
6,9,24,26,28,30 ハンドリングロボット
10,27 加熱ステージ
12,31 搬出コンベア
13 昇降手段
14,21,32 ターンテーブル
15 支持部
16 フォーク
16a フォークの先端
16b フォークの基端
17 屈伸アーム
18 昇降手段制御装置
19 傾斜面
Claims (5)
- 製造ラインに備えられる加熱ステージと、該加熱ステージ上で、上昇された基板の下に進入し、該基板が下降されることでこれを受け取り、その後、後退して当該基板を次のステージへ搬送する水平方向に移動可能なロボットアームとを有し、該ロボットアームが、その先端側と基端側との間で、該加熱ステージへ先行して進入する先端側よりも後行して進入する基端側が遅いタイミングで昇温する習性のある基板の搬送装置であって、
上記加熱ステージには、複数の上記基板を、上記ロボットアームの移動方向に沿って直列に並べて配置し、
上記加熱ステージには、これら基板を同じ高さに持ち上げるために上昇され、かつこれら基板を上記ロボットアームに受け渡すために下降させる昇降手段を設けると共に、
上記ロボットアームの温度上昇過程で複数の上記基板を同じ温度にて該ロボットアームに受け渡しするために、これら基板の該ロボットアームへの受け渡しを、当該ロボットアームの先端側で先に行いかつ基端側で後に行うための、タイミング調整手段を備えたことを特徴とする基板の搬送装置。 - 前記昇降手段は、前記複数の基板それぞれを個別に持ち上げ及び受け渡すために、個別に上昇かつ下降できるように複数設けられ、
前記タイミング調整手段は、前記ロボットアームの先端側に位置する前記昇降手段よりも、前記ロボットアームの基端側に位置する前記昇降手段を遅く下降させる昇降手段制御装置であることを特徴とする請求項1に記載の基板の搬送装置。 - 前記タイミング調整手段は、前記ロボットアームの先端側上面よりも、該ロボットアームの基端側上面を前記基板から離隔させるために、該ロボットアームに、基端側上面から先端側上面へ向かって漸次高くなるように傾斜させて設けられた傾斜面であることを特徴とする請求項1に記載の基板の搬送装置。
- 前記ロボットアームは、すべての前記基板を搭載したときの重量で前記傾斜面がおおよそ水平となるように撓む習性を有することを特徴とする請求項3に記載の基板の搬送装置。
- 請求項1〜4いずれかの項に記載の基板の搬送装置を備え、上記基板を2枚一組で取り扱って搬送する第1ハンドリングロボットと、該第1ハンドリングロボットにより搬送される上記基板を2枚一組で塗工処理する塗装ステージと、上記第1ハンドリングロボットにより上記塗装ステージから搬送される2枚一組の上記基板に対し真空乾燥処理する真空乾燥ステージと、該真空乾燥ステージで真空乾燥処理された後の上記基板を2枚一組で取り扱って搬送する第2ハンドリングロボットと、該第2ハンドリングロボットにより上記真空乾燥ステージから搬送される2枚一組の基板に対し、焼成のための加熱処理を施す加熱ステージと、上記第2ハンドリングロボットにより上記加熱ステージから搬送される2枚一組の上記基板に対し冷却処理を施す冷却ステージとから構成されることを特徴とする基板の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011084845A JP5161335B2 (ja) | 2011-04-06 | 2011-04-06 | 基板の搬送装置及びこれを備えた基板の加工装置 |
TW101109055A TWI418502B (zh) | 2011-04-06 | 2012-03-16 | 基板之搬送裝置及具備其之基板之加工裝置 |
KR1020120027613A KR101331626B1 (ko) | 2011-04-06 | 2012-03-19 | 기판의 반송장치 및 이를 구비한 기판의 가공장치 |
CN2012100906055A CN102730416B (zh) | 2011-04-06 | 2012-03-30 | 基板搬送装置及具备该基板搬送装置的基板加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011084845A JP5161335B2 (ja) | 2011-04-06 | 2011-04-06 | 基板の搬送装置及びこれを備えた基板の加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012222087A JP2012222087A (ja) | 2012-11-12 |
JP5161335B2 true JP5161335B2 (ja) | 2013-03-13 |
Family
ID=46986852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011084845A Active JP5161335B2 (ja) | 2011-04-06 | 2011-04-06 | 基板の搬送装置及びこれを備えた基板の加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5161335B2 (ja) |
KR (1) | KR101331626B1 (ja) |
CN (1) | CN102730416B (ja) |
TW (1) | TWI418502B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5767361B1 (ja) | 2014-04-10 | 2015-08-19 | 中外炉工業株式会社 | 基板処理装置 |
JP2016024511A (ja) * | 2014-07-16 | 2016-02-08 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
CN104386489B (zh) * | 2014-09-10 | 2016-06-08 | 深圳市华星光电技术有限公司 | 玻璃基板传递***及其机械手 |
US9589825B2 (en) | 2014-09-10 | 2017-03-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass substrate transfer system and robot arm thereof |
WO2016103300A1 (ja) * | 2014-12-26 | 2016-06-30 | 川崎重工業株式会社 | ロボット |
CN105799326B (zh) * | 2014-12-30 | 2018-11-20 | 深圳Tcl工业研究院有限公司 | 喷墨印刷机及喷墨印刷机的喷墨方法 |
KR102309790B1 (ko) * | 2015-08-11 | 2021-10-12 | 삼성디스플레이 주식회사 | 기판 처리 시스템 |
KR101999838B1 (ko) | 2015-08-11 | 2019-07-15 | 삼성디스플레이 주식회사 | 기판 처리 시스템 |
WO2017052958A1 (en) * | 2015-09-22 | 2017-03-30 | Applied Materials, Inc. | Large area dual substrate processing system |
JP2018106019A (ja) * | 2016-12-27 | 2018-07-05 | 三菱電機株式会社 | 搬送装置、光配向処理装置、および光配向膜形成システム |
JP6864514B2 (ja) * | 2017-03-23 | 2021-04-28 | 株式会社Screenホールディングス | 基板処理システムおよび基板処理方法 |
JP6881010B2 (ja) * | 2017-05-11 | 2021-06-02 | 東京エレクトロン株式会社 | 真空処理装置 |
JP6899813B2 (ja) * | 2018-11-27 | 2021-07-07 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
TWI685059B (zh) * | 2018-12-11 | 2020-02-11 | 財團法人國家實驗研究院 | 半導體反應裝置與方法 |
KR102442087B1 (ko) * | 2019-09-20 | 2022-09-14 | 삼성디스플레이 주식회사 | 기판 처리 시스템 |
KR102108263B1 (ko) * | 2019-09-20 | 2020-05-11 | 삼성디스플레이 주식회사 | 기판 처리 시스템 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002064132A (ja) * | 2000-08-22 | 2002-02-28 | Tokyo Electron Ltd | 被処理体の受け渡し方法、被処理体の載置機構及びプローブ装置 |
JP2003060004A (ja) * | 2001-08-20 | 2003-02-28 | Yaskawa Electric Corp | ロボットハンド |
KR101198179B1 (ko) * | 2005-01-17 | 2012-11-16 | 삼성전자주식회사 | 핸들링 로봇의 정적 처짐 보정방법 및 장치 |
JP4680657B2 (ja) * | 2005-04-08 | 2011-05-11 | 株式会社アルバック | 基板搬送システム |
JP2008166623A (ja) * | 2006-12-29 | 2008-07-17 | Chugai Ro Co Ltd | レジスト液塗布処理装置 |
JP4688004B2 (ja) * | 2008-04-22 | 2011-05-25 | 株式会社ダイフク | 物品搬送装置 |
CN201458340U (zh) * | 2009-07-06 | 2010-05-12 | 北京京城清达电子设备有限公司 | 一种基板立式挂架的装载装置 |
-
2011
- 2011-04-06 JP JP2011084845A patent/JP5161335B2/ja active Active
-
2012
- 2012-03-16 TW TW101109055A patent/TWI418502B/zh active
- 2012-03-19 KR KR1020120027613A patent/KR101331626B1/ko active IP Right Grant
- 2012-03-30 CN CN2012100906055A patent/CN102730416B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102730416B (zh) | 2013-12-25 |
KR101331626B1 (ko) | 2013-11-20 |
CN102730416A (zh) | 2012-10-17 |
JP2012222087A (ja) | 2012-11-12 |
TWI418502B (zh) | 2013-12-11 |
TW201245023A (en) | 2012-11-16 |
KR20120114155A (ko) | 2012-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5161335B2 (ja) | 基板の搬送装置及びこれを備えた基板の加工装置 | |
JP4633161B2 (ja) | 基板搬送装置 | |
JP4711770B2 (ja) | 搬送装置、真空処理装置および搬送方法 | |
JPS60169148A (ja) | 基板の搬送方法及びその装置 | |
JP6910798B2 (ja) | 減圧乾燥方法および減圧乾燥装置 | |
WO2006137407A1 (ja) | ワーク収納装置及びワーク収納方法 | |
WO2004079283A1 (ja) | 線材を用いた搬送機構並びにそれを使用した熱処理炉及び熱処理方法 | |
JP2007186321A (ja) | 板材の搬送システム | |
JP2013009007A (ja) | 基板処理装置における基板搬送方法 | |
JP4133489B2 (ja) | 基板待機装置およびそれを備えた基板処理装置 | |
KR20130105848A (ko) | 라미네이트 장치 및 라미네이트 방법 | |
JP2008153369A (ja) | レジスト液塗布処理装置 | |
JP2011035103A (ja) | 搬送装置及び処理システム | |
JP7289881B2 (ja) | 基板処理装置および基板処理方法 | |
JP2010182504A (ja) | 燃料電池の製造装置、および燃料電池の製造方法 | |
KR101600394B1 (ko) | 반도체 부품 적재용 매거진 이송장치 | |
KR20180035660A (ko) | 기판 배열 장치 및 기판 배열 방법 | |
JP5688838B2 (ja) | 基板処理装置 | |
JPH0462859A (ja) | 搬送装置および熱処理装置 | |
JP2013084798A (ja) | 基板検査装置、基板搬送方法 | |
JP3193831U (ja) | ラミネート装置 | |
JP2004115137A (ja) | 薄板搬送装置 | |
JP2000081283A (ja) | 焼成炉 | |
JP2020128289A (ja) | 基板搬送システムおよび基板搬送システムの制御方法 | |
TWM468509U (zh) | 薄型玻璃基板搬運裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120918 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121025 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121127 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121213 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5161335 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151221 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |