TW200731333A - Optics characteristics measurement method, exposure method, method for producing devices, inspection device, and method of measurement - Google Patents
Optics characteristics measurement method, exposure method, method for producing devices, inspection device, and method of measurementInfo
- Publication number
- TW200731333A TW200731333A TW095137468A TW95137468A TW200731333A TW 200731333 A TW200731333 A TW 200731333A TW 095137468 A TW095137468 A TW 095137468A TW 95137468 A TW95137468 A TW 95137468A TW 200731333 A TW200731333 A TW 200731333A
- Authority
- TW
- Taiwan
- Prior art keywords
- measurement
- exposure
- inspection device
- producing devices
- optics characteristics
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
- G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0271—Testing optical properties by measuring geometrical properties or aberrations by using interferometric methods
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005294858 | 2005-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200731333A true TW200731333A (en) | 2007-08-16 |
Family
ID=37942771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095137468A TW200731333A (en) | 2005-10-07 | 2006-10-11 | Optics characteristics measurement method, exposure method, method for producing devices, inspection device, and method of measurement |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080208499A1 (zh) |
EP (1) | EP1950794A4 (zh) |
JP (1) | JPWO2007043535A1 (zh) |
KR (1) | KR20080059572A (zh) |
TW (1) | TW200731333A (zh) |
WO (1) | WO2007043535A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI483084B (zh) * | 2010-01-29 | 2015-05-01 | Vanguard Int Semiconduct Corp | 曝光品質控制方法 |
TWI484167B (zh) * | 2012-03-22 | 2015-05-11 | Nuflare Technology Inc | Inspection device and inspection method |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7948616B2 (en) | 2007-04-12 | 2011-05-24 | Nikon Corporation | Measurement method, exposure method and device manufacturing method |
WO2008153023A1 (ja) * | 2007-06-11 | 2008-12-18 | Nikon Corporation | 計測部材、センサ、計測方法、露光装置、露光方法、及びデバイス製造方法 |
JP5209946B2 (ja) * | 2007-12-12 | 2013-06-12 | 株式会社オーク製作所 | 焦点位置検出方法および描画装置 |
JP5630627B2 (ja) * | 2009-02-27 | 2014-11-26 | 株式会社ニコン | 検出方法、光学特性計測方法、露光方法及び露光装置、並びにデバイス製造方法 |
KR101493133B1 (ko) * | 2009-07-01 | 2015-02-12 | 가부시키가이샤 니콘 | 노광 상태 평가 방법 및 노광 상태 평가 장치 |
JP5434353B2 (ja) * | 2009-08-06 | 2014-03-05 | 株式会社ニコン | 表面検査装置および表面検査方法 |
JP5434352B2 (ja) * | 2009-08-06 | 2014-03-05 | 株式会社ニコン | 表面検査装置および表面検査方法 |
US20110242520A1 (en) | 2009-11-17 | 2011-10-06 | Nikon Corporation | Optical properties measurement method, exposure method and device manufacturing method |
JP6043583B2 (ja) * | 2012-10-23 | 2016-12-14 | 株式会社ニューフレアテクノロジー | 焦点位置検出装置、検査装置、焦点位置検出方法および検査方法 |
CN107250915B (zh) | 2015-02-23 | 2020-03-13 | 株式会社尼康 | 测量装置、光刻***及曝光装置、以及管理方法、重迭测量方法及组件制造方法 |
WO2016136691A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 基板処理システム及び基板処理方法、並びにデバイス製造方法 |
EP3264030B1 (en) * | 2015-02-23 | 2020-07-22 | Nikon Corporation | Measurement device, lithography system and exposure device, and device manufacturing method |
TWI561908B (en) * | 2015-03-27 | 2016-12-11 | Vivotek Inc | Auto focus method and apparatus using the same method |
US10317285B2 (en) * | 2015-07-13 | 2019-06-11 | The Boeing Company | System and method for measuring optical resolution with an optical resolution target assembly |
WO2017149689A1 (ja) * | 2016-03-02 | 2017-09-08 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置、パターンチップ及び欠陥検査方法 |
US10445894B2 (en) * | 2016-05-11 | 2019-10-15 | Mitutoyo Corporation | Non-contact 3D measuring system |
US10649342B2 (en) | 2016-07-11 | 2020-05-12 | Asml Netherlands B.V. | Method and apparatus for determining a fingerprint of a performance parameter |
DE102016121649A1 (de) * | 2016-11-11 | 2018-05-17 | Cl Schutzrechtsverwaltungs Gmbh | Verfahren zur automatisierbaren bzw. automatisierten Ermittlung der Fokuslage eines von einer Belichtungseinrichtung erzeugten Laserstrahls |
GB2571997B (en) * | 2018-03-16 | 2021-10-27 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
US11356583B2 (en) * | 2019-06-05 | 2022-06-07 | Shanghai Harvest Intelligence Technology Co., Ltd. | Image capturing apparatus, electronic equipment and terminal |
KR20220140129A (ko) * | 2021-04-09 | 2022-10-18 | 삼성전자주식회사 | 반도체 소자의 검출용 패드 구조물 |
Family Cites Families (28)
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US4759626A (en) * | 1986-11-10 | 1988-07-26 | Hewlett-Packard Company | Determination of best focus for step and repeat projection aligners |
US4908656A (en) * | 1988-01-21 | 1990-03-13 | Nikon Corporation | Method of dimension measurement for a pattern formed by exposure apparatus, and method for setting exposure conditions and for inspecting exposure precision |
KR100300618B1 (ko) * | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3412704B2 (ja) * | 1993-02-26 | 2003-06-03 | 株式会社ニコン | 投影露光方法及び装置、並びに露光装置 |
JP3269343B2 (ja) * | 1995-07-26 | 2002-03-25 | キヤノン株式会社 | ベストフォーカス決定方法及びそれを用いた露光条件決定方法 |
US5872618A (en) * | 1996-02-28 | 1999-02-16 | Nikon Corporation | Projection exposure apparatus |
JP3728613B2 (ja) * | 1996-12-06 | 2005-12-21 | 株式会社ニコン | 走査型露光装置の調整方法及び該方法を使用する走査型露光装置 |
JP3747566B2 (ja) * | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
JPH118194A (ja) * | 1997-04-25 | 1999-01-12 | Nikon Corp | 露光条件測定方法、投影光学系の評価方法及びリソグラフィシステム |
JPH11288879A (ja) * | 1998-02-04 | 1999-10-19 | Hitachi Ltd | 露光条件決定方法とその装置ならびに半導体装置の製造方法 |
JPH11233434A (ja) * | 1998-02-17 | 1999-08-27 | Nikon Corp | 露光条件決定方法、露光方法、露光装置、及びデバイスの製造方法 |
US6368763B2 (en) * | 1998-11-23 | 2002-04-09 | U.S. Philips Corporation | Method of detecting aberrations of an optical imaging system |
US6248486B1 (en) * | 1998-11-23 | 2001-06-19 | U.S. Philips Corporation | Method of detecting aberrations of an optical imaging system |
JP3784987B2 (ja) * | 1999-03-18 | 2006-06-14 | 株式会社東芝 | 露光装置のna測定方法及びna測定用光学部材 |
SG124257A1 (en) * | 2000-02-25 | 2006-08-30 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
JP4068281B2 (ja) * | 2000-03-27 | 2008-03-26 | 株式会社東芝 | フォトマスクの製造方法 |
US7095904B2 (en) * | 2000-04-12 | 2006-08-22 | Ultratech, Inc. | Method and apparatus for determining best focus using dark-field imaging |
WO2002029870A1 (fr) * | 2000-10-05 | 2002-04-11 | Nikon Corporation | Procede de determination des conditions d'exposition, procede d'exposition, dispositif de realisation dudit procede et support d'enregistrement |
US6611316B2 (en) * | 2001-02-27 | 2003-08-26 | Asml Holding N.V. | Method and system for dual reticle image exposure |
TW563178B (en) * | 2001-05-07 | 2003-11-21 | Nikon Corp | Optical properties measurement method, exposure method, and device manufacturing method |
TW529172B (en) * | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
JP2004146702A (ja) * | 2002-10-25 | 2004-05-20 | Nikon Corp | 光学特性計測方法、露光方法及びデバイス製造方法 |
JP2004165307A (ja) * | 2002-11-11 | 2004-06-10 | Nikon Corp | 像検出方法、光学特性計測方法、露光方法及びデバイス製造方法 |
TWI232357B (en) * | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
JP2004207521A (ja) * | 2002-12-25 | 2004-07-22 | Nikon Corp | 光学特性計測方法、露光方法及びデバイス製造方法 |
EP3301511A1 (en) * | 2003-02-26 | 2018-04-04 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP4444920B2 (ja) * | 2003-09-19 | 2010-03-31 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
JP4786224B2 (ja) * | 2005-03-30 | 2011-10-05 | 富士フイルム株式会社 | 投影ヘッドピント位置測定方法および露光方法 |
-
2006
- 2006-10-10 JP JP2007539951A patent/JPWO2007043535A1/ja active Pending
- 2006-10-10 KR KR1020087009179A patent/KR20080059572A/ko not_active Application Discontinuation
- 2006-10-10 EP EP06811544A patent/EP1950794A4/en not_active Withdrawn
- 2006-10-10 WO PCT/JP2006/320232 patent/WO2007043535A1/ja active Application Filing
- 2006-10-11 TW TW095137468A patent/TW200731333A/zh unknown
-
2008
- 2008-04-07 US US12/078,864 patent/US20080208499A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI483084B (zh) * | 2010-01-29 | 2015-05-01 | Vanguard Int Semiconduct Corp | 曝光品質控制方法 |
TWI484167B (zh) * | 2012-03-22 | 2015-05-11 | Nuflare Technology Inc | Inspection device and inspection method |
Also Published As
Publication number | Publication date |
---|---|
EP1950794A4 (en) | 2010-03-31 |
JPWO2007043535A1 (ja) | 2009-04-16 |
US20080208499A1 (en) | 2008-08-28 |
EP1950794A1 (en) | 2008-07-30 |
WO2007043535A1 (ja) | 2007-04-19 |
KR20080059572A (ko) | 2008-06-30 |
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