TW200725759A - Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method - Google Patents
Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off methodInfo
- Publication number
- TW200725759A TW200725759A TW095137712A TW95137712A TW200725759A TW 200725759 A TW200725759 A TW 200725759A TW 095137712 A TW095137712 A TW 095137712A TW 95137712 A TW95137712 A TW 95137712A TW 200725759 A TW200725759 A TW 200725759A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- picking
- peeling
- thin slice
- sucking mouth
- Prior art date
Links
- 229920001971 elastomer Polymers 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
- Y10S156/931—Peeling away backing
- Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
- Y10S156/943—Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1195—Delaminating from release surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1994—Means for delaminating from release surface
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005300044A JP4765536B2 (ja) | 2005-10-14 | 2005-10-14 | チップピックアップ装置およびチップピックアップ方法ならびにチップ剥離装置およびチップ剥離方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200725759A true TW200725759A (en) | 2007-07-01 |
Family
ID=37942875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095137712A TW200725759A (en) | 2005-10-14 | 2006-10-13 | Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method |
Country Status (6)
Country | Link |
---|---|
US (1) | US8192578B2 (zh) |
JP (1) | JP4765536B2 (zh) |
KR (1) | KR101218662B1 (zh) |
CN (1) | CN100578749C (zh) |
TW (1) | TW200725759A (zh) |
WO (1) | WO2007043654A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI467693B (zh) * | 2009-06-11 | 2015-01-01 | Tech Wing Co Ltd | 用於測試分選機的拾放模組 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4935442B2 (ja) * | 2007-03-16 | 2012-05-23 | 村田機械株式会社 | 板材搬出装置および板材搬出方法 |
JP4985513B2 (ja) | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | 電子部品の剥離方法及び剥離装置 |
CN102074458A (zh) * | 2010-11-19 | 2011-05-25 | 华中科技大学 | 一种芯片剥离装置 |
DE102011087388A1 (de) * | 2011-02-17 | 2012-08-23 | Semikron Elektronik Gmbh & Co. Kg Ip-Department | Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie |
JP5936847B2 (ja) * | 2011-11-18 | 2016-06-22 | 富士機械製造株式会社 | ウエハ関連データ管理方法及びウエハ関連データ作成装置 |
KR101869922B1 (ko) * | 2011-11-28 | 2018-06-22 | 삼성디스플레이 주식회사 | 진공 필링 장치 및 진공 필링 방법 |
JP6055239B2 (ja) * | 2012-08-29 | 2016-12-27 | ファスフォードテクノロジ株式会社 | ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法 |
JP5977710B2 (ja) * | 2013-05-10 | 2016-08-24 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP6120748B2 (ja) * | 2013-10-11 | 2017-04-26 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
KR101596461B1 (ko) * | 2014-04-01 | 2016-02-23 | 주식회사 프로텍 | 칩 디테칭 장치 및 칩 디테칭 방법 |
JP6283573B2 (ja) | 2014-06-03 | 2018-02-21 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
KR101683398B1 (ko) * | 2015-10-02 | 2016-12-07 | 주식회사 프로텍 | 칩 디테칭 장치 및 칩 디테칭 방법 |
CN107251212B (zh) * | 2016-01-29 | 2020-08-18 | 业纳光学***有限公司 | 用于从晶片中取出微芯片并且将微芯片施装到基底上的方法和设备 |
JP2019169516A (ja) * | 2018-03-22 | 2019-10-03 | 東芝メモリ株式会社 | 半導体装置の突き上げ装置及び突き上げ方法 |
KR102284151B1 (ko) * | 2019-09-06 | 2021-07-30 | 세메스 주식회사 | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02186657A (ja) * | 1989-01-13 | 1990-07-20 | Matsushita Electron Corp | 半導体素子剥離装置 |
JP2679266B2 (ja) | 1989-06-28 | 1997-11-19 | 松下電器産業株式会社 | Icベアーチップの移載装置 |
JPH0685060A (ja) * | 1992-09-04 | 1994-03-25 | Sony Corp | 半導体チップの剥離方法及びその装置 |
JPH0697212A (ja) * | 1992-09-14 | 1994-04-08 | Hitachi Ltd | ダイボンディング装置および前記装置を使用した半導体装置の製造方法 |
JP3243391B2 (ja) * | 1995-03-17 | 2002-01-07 | 岩手東芝エレクトロニクス株式会社 | 半導体製造装置 |
JP3976541B2 (ja) * | 2001-10-23 | 2007-09-19 | 富士通株式会社 | 半導体チップの剥離方法及び装置 |
JP4574251B2 (ja) * | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP3999744B2 (ja) * | 2004-01-05 | 2007-10-31 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置 |
JP4985513B2 (ja) * | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | 電子部品の剥離方法及び剥離装置 |
-
2005
- 2005-10-14 JP JP2005300044A patent/JP4765536B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-13 WO PCT/JP2006/320471 patent/WO2007043654A1/ja active Application Filing
- 2006-10-13 US US12/089,865 patent/US8192578B2/en not_active Expired - Fee Related
- 2006-10-13 KR KR1020087008895A patent/KR101218662B1/ko not_active IP Right Cessation
- 2006-10-13 TW TW095137712A patent/TW200725759A/zh unknown
- 2006-10-13 CN CN200680047075A patent/CN100578749C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI467693B (zh) * | 2009-06-11 | 2015-01-01 | Tech Wing Co Ltd | 用於測試分選機的拾放模組 |
Also Published As
Publication number | Publication date |
---|---|
WO2007043654A1 (ja) | 2007-04-19 |
KR20080068655A (ko) | 2008-07-23 |
KR101218662B1 (ko) | 2013-01-18 |
JP4765536B2 (ja) | 2011-09-07 |
US8192578B2 (en) | 2012-06-05 |
JP2007109936A (ja) | 2007-04-26 |
CN100578749C (zh) | 2010-01-06 |
CN101331601A (zh) | 2008-12-24 |
US20090279995A1 (en) | 2009-11-12 |
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