TW200725759A - Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method - Google Patents

Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method

Info

Publication number
TW200725759A
TW200725759A TW095137712A TW95137712A TW200725759A TW 200725759 A TW200725759 A TW 200725759A TW 095137712 A TW095137712 A TW 095137712A TW 95137712 A TW95137712 A TW 95137712A TW 200725759 A TW200725759 A TW 200725759A
Authority
TW
Taiwan
Prior art keywords
chip
picking
peeling
thin slice
sucking mouth
Prior art date
Application number
TW095137712A
Other languages
English (en)
Inventor
Hiroshi Haji
Mitsuru Ozono
Teruaki Kasai
Kazuhiro Noda
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200725759A publication Critical patent/TW200725759A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y10S156/931—Peeling away backing
    • Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/943—Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/976—Temporary protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1195—Delaminating from release surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW095137712A 2005-10-14 2006-10-13 Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method TW200725759A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300044A JP4765536B2 (ja) 2005-10-14 2005-10-14 チップピックアップ装置およびチップピックアップ方法ならびにチップ剥離装置およびチップ剥離方法

Publications (1)

Publication Number Publication Date
TW200725759A true TW200725759A (en) 2007-07-01

Family

ID=37942875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137712A TW200725759A (en) 2005-10-14 2006-10-13 Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method

Country Status (6)

Country Link
US (1) US8192578B2 (zh)
JP (1) JP4765536B2 (zh)
KR (1) KR101218662B1 (zh)
CN (1) CN100578749C (zh)
TW (1) TW200725759A (zh)
WO (1) WO2007043654A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467693B (zh) * 2009-06-11 2015-01-01 Tech Wing Co Ltd 用於測試分選機的拾放模組

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4935442B2 (ja) * 2007-03-16 2012-05-23 村田機械株式会社 板材搬出装置および板材搬出方法
JP4985513B2 (ja) 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
CN102074458A (zh) * 2010-11-19 2011-05-25 华中科技大学 一种芯片剥离装置
DE102011087388A1 (de) * 2011-02-17 2012-08-23 Semikron Elektronik Gmbh & Co. Kg Ip-Department Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie
JP5936847B2 (ja) * 2011-11-18 2016-06-22 富士機械製造株式会社 ウエハ関連データ管理方法及びウエハ関連データ作成装置
KR101869922B1 (ko) * 2011-11-28 2018-06-22 삼성디스플레이 주식회사 진공 필링 장치 및 진공 필링 방법
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
JP5977710B2 (ja) * 2013-05-10 2016-08-24 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6120748B2 (ja) * 2013-10-11 2017-04-26 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
KR101596461B1 (ko) * 2014-04-01 2016-02-23 주식회사 프로텍 칩 디테칭 장치 및 칩 디테칭 방법
JP6283573B2 (ja) 2014-06-03 2018-02-21 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
KR101683398B1 (ko) * 2015-10-02 2016-12-07 주식회사 프로텍 칩 디테칭 장치 및 칩 디테칭 방법
CN107251212B (zh) * 2016-01-29 2020-08-18 业纳光学***有限公司 用于从晶片中取出微芯片并且将微芯片施装到基底上的方法和设备
JP2019169516A (ja) * 2018-03-22 2019-10-03 東芝メモリ株式会社 半導体装置の突き上げ装置及び突き上げ方法
KR102284151B1 (ko) * 2019-09-06 2021-07-30 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02186657A (ja) * 1989-01-13 1990-07-20 Matsushita Electron Corp 半導体素子剥離装置
JP2679266B2 (ja) 1989-06-28 1997-11-19 松下電器産業株式会社 Ｉｃベアーチップの移載装置
JPH0685060A (ja) * 1992-09-04 1994-03-25 Sony Corp 半導体チップの剥離方法及びその装置
JPH0697212A (ja) * 1992-09-14 1994-04-08 Hitachi Ltd ダイボンディング装置および前記装置を使用した半導体装置の製造方法
JP3243391B2 (ja) * 1995-03-17 2002-01-07 岩手東芝エレクトロニクス株式会社 半導体製造装置
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467693B (zh) * 2009-06-11 2015-01-01 Tech Wing Co Ltd 用於測試分選機的拾放模組

Also Published As

Publication number Publication date
WO2007043654A1 (ja) 2007-04-19
KR20080068655A (ko) 2008-07-23
KR101218662B1 (ko) 2013-01-18
JP4765536B2 (ja) 2011-09-07
US8192578B2 (en) 2012-06-05
JP2007109936A (ja) 2007-04-26
CN100578749C (zh) 2010-01-06
CN101331601A (zh) 2008-12-24
US20090279995A1 (en) 2009-11-12

Similar Documents

Publication Publication Date Title
TW200725759A (en) Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method
JP3947741B2 (ja) 真空把持装置
EP2325905A3 (en) Semiconductor light-emitting device and method for manufacturing same
TW200608530A (en) Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
US20100171331A1 (en) Gripper, in particular a bernoulli gripper
US9781960B2 (en) Support device
EP2224466A3 (en) High power AllnGaN based multi-chip light emitting diode
WO2009072388A1 (ja) ソケット
TW200625503A (en) Non-contact suction holding apparatus
TW200644269A (en) Light emitting diode and method of fabricating thereof
EP1601005A3 (en) Peeling device for chip detachment
EP1983575A3 (en) Method for manufacturing bonded substrate
EP1617463A3 (en) Film peeling method and film peeling device
EP1505661A3 (en) GaN-based LED and its manufacturing method
MY139253A (en) Apparatus for mounting of semi-conductor chips and method for stripping of a semi-conductor chip from a film
EP2360417A3 (en) Light-emitting device and illumination device
EP1953802A3 (en) Semiconductor process chamber
CN101383275A (zh) 半导体芯片的拾取装置及拾取方法
TW200722356A (en) Flat material conveying method and its device
MX2009007189A (es) Maquina ppara decorar objetos y metodo para la misma.
CN107403744A (zh) 基板搬送装置
EP2053656A3 (en) Semiconductor device and its fabrication process
EP2219237A3 (en) Semiconductor light emitting device and method of manufacturing the same
TW200715426A (en) Device and method for picking up semiconductor chip
CN205438598U (zh) 机械手吸附头剥离装置