WO2009072388A1 - ソケット - Google Patents
ソケット Download PDFInfo
- Publication number
- WO2009072388A1 WO2009072388A1 PCT/JP2008/070899 JP2008070899W WO2009072388A1 WO 2009072388 A1 WO2009072388 A1 WO 2009072388A1 JP 2008070899 W JP2008070899 W JP 2008070899W WO 2009072388 A1 WO2009072388 A1 WO 2009072388A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- latch
- socket
- base member
- latch plate
- bga
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
Landscapes
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/734,933 US8388365B2 (en) | 2007-12-04 | 2008-11-18 | Semiconductor device burn-in test socket |
CN200880117021.4A CN101919128B (zh) | 2007-12-04 | 2008-11-18 | 插座 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-313167 | 2007-12-04 | ||
JP2007313167A JP4868413B2 (ja) | 2007-12-04 | 2007-12-04 | ソケット |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009072388A1 true WO2009072388A1 (ja) | 2009-06-11 |
Family
ID=40717569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070899 WO2009072388A1 (ja) | 2007-12-04 | 2008-11-18 | ソケット |
Country Status (5)
Country | Link |
---|---|
US (1) | US8388365B2 (ja) |
JP (1) | JP4868413B2 (ja) |
KR (1) | KR101466425B1 (ja) |
CN (1) | CN101919128B (ja) |
WO (1) | WO2009072388A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022070279A1 (ja) * | 2020-09-29 | 2022-04-07 | 株式会社エンプラス | ソケット |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5656578B2 (ja) * | 2010-11-19 | 2015-01-21 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | ソケット |
KR101217205B1 (ko) * | 2011-09-23 | 2012-12-31 | 하이콘 주식회사 | 아이씨 테스트용 소켓장치 |
TWI506874B (zh) | 2012-03-22 | 2015-11-01 | Hon Hai Prec Ind Co Ltd | 插座 |
CN103367982B (zh) * | 2012-03-26 | 2016-07-13 | 富士康(昆山)电脑接插件有限公司 | 插座 |
KR101320646B1 (ko) * | 2012-03-27 | 2013-10-23 | 주식회사 오킨스전자 | 디스플레이 패널 검사모듈 및 이를 포함하는 검사장치 |
KR101485779B1 (ko) * | 2013-06-28 | 2015-01-26 | 황동원 | 반도체 소자 테스트용 소켓장치 |
KR101432449B1 (ko) * | 2013-08-30 | 2014-09-29 | 아주야마이찌전기공업(주) | 반도체 장치 검사용 소켓 장치 |
JP6195372B2 (ja) | 2013-12-11 | 2017-09-13 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | ソケット |
KR101585182B1 (ko) * | 2014-04-28 | 2016-01-14 | 황동원 | 반도체 소자 테스트용 소켓장치 |
KR102211488B1 (ko) * | 2014-10-31 | 2021-02-03 | 삼성전자주식회사 | 어댑터 구조물 및 이를 포함하는 반도체 패키지 검사 장치 |
KR101599051B1 (ko) * | 2014-11-18 | 2016-03-02 | 주식회사 세미코어 | 반도체 칩 검사장치용 소켓 |
EP3112830B1 (en) | 2015-07-01 | 2018-08-22 | Sensata Technologies, Inc. | Temperature sensor and method for the production of a temperature sensor |
JP2017050202A (ja) * | 2015-09-03 | 2017-03-09 | 株式会社エンプラス | 電気部品用ソケット |
JP6706494B2 (ja) | 2015-12-14 | 2020-06-10 | センサータ テクノロジーズ インコーポレーテッド | インターフェース構造 |
CN105589025B (zh) * | 2016-03-08 | 2018-06-12 | 江苏福田电气有限公司 | 一种bga封装测试插座 |
JP6744173B2 (ja) * | 2016-08-09 | 2020-08-19 | 株式会社エンプラス | 電気部品用ソケット |
PH12017000234A1 (en) * | 2016-09-02 | 2018-07-23 | Knight Auto Prec Engineering Pte Ltd | Handling assembly of semiconductor test equipment |
US10428716B2 (en) | 2016-12-20 | 2019-10-01 | Sensata Technologies, Inc. | High-temperature exhaust sensor |
US10502641B2 (en) | 2017-05-18 | 2019-12-10 | Sensata Technologies, Inc. | Floating conductor housing |
JP6991782B2 (ja) | 2017-08-23 | 2022-01-13 | センサータ テクノロジーズ インコーポレーテッド | ソケット |
JP7018310B2 (ja) * | 2017-12-27 | 2022-02-10 | 株式会社エンプラス | 電気部品用ソケット |
JP7057499B2 (ja) * | 2018-05-08 | 2022-04-20 | 山一電機株式会社 | 検査用ソケット |
US11237207B2 (en) | 2019-11-25 | 2022-02-01 | Sensata Technologies, Inc. | Semiconductor test socket with a floating plate and latch for holding the semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000113954A (ja) * | 1998-10-05 | 2000-04-21 | Yamaichi Electronics Co Ltd | Icソケット |
JP2003168532A (ja) * | 2001-11-29 | 2003-06-13 | Texas Instr Japan Ltd | 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3789789B2 (ja) * | 2001-08-31 | 2006-06-28 | 株式会社エンプラス | 電気部品用ソケット |
JP4721580B2 (ja) * | 2001-09-11 | 2011-07-13 | 株式会社センサータ・テクノロジーズジャパン | ソケット |
JP4721582B2 (ja) * | 2001-09-14 | 2011-07-13 | 株式会社センサータ・テクノロジーズジャパン | ソケット |
US6547580B1 (en) * | 2001-09-24 | 2003-04-15 | Texas Instruments Incorporated | Socket apparatus particularly adapted for land grid array type semiconductor devices |
JP3566691B2 (ja) * | 2001-12-17 | 2004-09-15 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法 |
JP2007109607A (ja) * | 2005-10-17 | 2007-04-26 | Three M Innovative Properties Co | 電子デバイス用ソケット |
JP2010118275A (ja) * | 2008-11-13 | 2010-05-27 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
-
2007
- 2007-12-04 JP JP2007313167A patent/JP4868413B2/ja active Active
-
2008
- 2008-11-18 US US12/734,933 patent/US8388365B2/en active Active
- 2008-11-18 KR KR1020107007967A patent/KR101466425B1/ko not_active IP Right Cessation
- 2008-11-18 WO PCT/JP2008/070899 patent/WO2009072388A1/ja active Application Filing
- 2008-11-18 CN CN200880117021.4A patent/CN101919128B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000113954A (ja) * | 1998-10-05 | 2000-04-21 | Yamaichi Electronics Co Ltd | Icソケット |
JP2003168532A (ja) * | 2001-11-29 | 2003-06-13 | Texas Instr Japan Ltd | 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022070279A1 (ja) * | 2020-09-29 | 2022-04-07 | 株式会社エンプラス | ソケット |
Also Published As
Publication number | Publication date |
---|---|
JP2009140629A (ja) | 2009-06-25 |
KR101466425B1 (ko) | 2014-12-01 |
JP4868413B2 (ja) | 2012-02-01 |
CN101919128A (zh) | 2010-12-15 |
KR20100091156A (ko) | 2010-08-18 |
US8388365B2 (en) | 2013-03-05 |
US20100248518A1 (en) | 2010-09-30 |
CN101919128B (zh) | 2013-03-20 |
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