WO2009072388A1 - ソケット - Google Patents

ソケット Download PDF

Info

Publication number
WO2009072388A1
WO2009072388A1 PCT/JP2008/070899 JP2008070899W WO2009072388A1 WO 2009072388 A1 WO2009072388 A1 WO 2009072388A1 JP 2008070899 W JP2008070899 W JP 2008070899W WO 2009072388 A1 WO2009072388 A1 WO 2009072388A1
Authority
WO
WIPO (PCT)
Prior art keywords
latch
socket
base member
latch plate
bga
Prior art date
Application number
PCT/JP2008/070899
Other languages
English (en)
French (fr)
Inventor
Hideyuki Takahashi
Kiyokazu Ikeya
Original Assignee
Sensata Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies, Inc. filed Critical Sensata Technologies, Inc.
Priority to US12/734,933 priority Critical patent/US8388365B2/en
Priority to CN200880117021.4A priority patent/CN101919128B/zh
Publication of WO2009072388A1 publication Critical patent/WO2009072388A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB

Landscapes

  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

【課題】　ラッチプレートを用いることで、半導体装置の上面を接触傷から保護することができるソケットを提供する。 【解決手段】　ソケット１０は、ベース部材２０と、ベース部材２０に対して接近または離間する方向に往復動可能なカバー部材３０と、複数のコンタクト４０と、ベース部材に対して接近もしくは離間する方向に移動が可能でありかつ半導体パッケージの載置面を提供するアダプター５０と、カバー部材３０の往復動に連動して回転移動するラッチ部材６０と、ラッチ部材６０に接続されたラッチプレート７０とを含む。ラッチプレート７０は、ラッチ部材６０の先端がＢＧＡに直接的に接触することを防ぎ、かつ、アダプター５０に載置されたＢＧＡを垂直方向に押し下げる。
PCT/JP2008/070899 2007-12-04 2008-11-18 ソケット WO2009072388A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/734,933 US8388365B2 (en) 2007-12-04 2008-11-18 Semiconductor device burn-in test socket
CN200880117021.4A CN101919128B (zh) 2007-12-04 2008-11-18 插座

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-313167 2007-12-04
JP2007313167A JP4868413B2 (ja) 2007-12-04 2007-12-04 ソケット

Publications (1)

Publication Number Publication Date
WO2009072388A1 true WO2009072388A1 (ja) 2009-06-11

Family

ID=40717569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070899 WO2009072388A1 (ja) 2007-12-04 2008-11-18 ソケット

Country Status (5)

Country Link
US (1) US8388365B2 (ja)
JP (1) JP4868413B2 (ja)
KR (1) KR101466425B1 (ja)
CN (1) CN101919128B (ja)
WO (1) WO2009072388A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022070279A1 (ja) * 2020-09-29 2022-04-07 株式会社エンプラス ソケット

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5656578B2 (ja) * 2010-11-19 2015-01-21 センサータ テクノロジーズ マサチューセッツ インコーポレーテッド ソケット
KR101217205B1 (ko) * 2011-09-23 2012-12-31 하이콘 주식회사 아이씨 테스트용 소켓장치
TWI506874B (zh) 2012-03-22 2015-11-01 Hon Hai Prec Ind Co Ltd 插座
CN103367982B (zh) * 2012-03-26 2016-07-13 富士康(昆山)电脑接插件有限公司 插座
KR101320646B1 (ko) * 2012-03-27 2013-10-23 주식회사 오킨스전자 디스플레이 패널 검사모듈 및 이를 포함하는 검사장치
KR101485779B1 (ko) * 2013-06-28 2015-01-26 황동원 반도체 소자 테스트용 소켓장치
KR101432449B1 (ko) * 2013-08-30 2014-09-29 아주야마이찌전기공업(주) 반도체 장치 검사용 소켓 장치
JP6195372B2 (ja) 2013-12-11 2017-09-13 センサータ テクノロジーズ マサチューセッツ インコーポレーテッド ソケット
KR101585182B1 (ko) * 2014-04-28 2016-01-14 황동원 반도체 소자 테스트용 소켓장치
KR102211488B1 (ko) * 2014-10-31 2021-02-03 삼성전자주식회사 어댑터 구조물 및 이를 포함하는 반도체 패키지 검사 장치
KR101599051B1 (ko) * 2014-11-18 2016-03-02 주식회사 세미코어 반도체 칩 검사장치용 소켓
EP3112830B1 (en) 2015-07-01 2018-08-22 Sensata Technologies, Inc. Temperature sensor and method for the production of a temperature sensor
JP2017050202A (ja) * 2015-09-03 2017-03-09 株式会社エンプラス 電気部品用ソケット
JP6706494B2 (ja) 2015-12-14 2020-06-10 センサータ テクノロジーズ インコーポレーテッド インターフェース構造
CN105589025B (zh) * 2016-03-08 2018-06-12 江苏福田电气有限公司 一种bga封装测试插座
JP6744173B2 (ja) * 2016-08-09 2020-08-19 株式会社エンプラス 電気部品用ソケット
PH12017000234A1 (en) * 2016-09-02 2018-07-23 Knight Auto Prec Engineering Pte Ltd Handling assembly of semiconductor test equipment
US10428716B2 (en) 2016-12-20 2019-10-01 Sensata Technologies, Inc. High-temperature exhaust sensor
US10502641B2 (en) 2017-05-18 2019-12-10 Sensata Technologies, Inc. Floating conductor housing
JP6991782B2 (ja) 2017-08-23 2022-01-13 センサータ テクノロジーズ インコーポレーテッド ソケット
JP7018310B2 (ja) * 2017-12-27 2022-02-10 株式会社エンプラス 電気部品用ソケット
JP7057499B2 (ja) * 2018-05-08 2022-04-20 山一電機株式会社 検査用ソケット
US11237207B2 (en) 2019-11-25 2022-02-01 Sensata Technologies, Inc. Semiconductor test socket with a floating plate and latch for holding the semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000113954A (ja) * 1998-10-05 2000-04-21 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2003168532A (ja) * 2001-11-29 2003-06-13 Texas Instr Japan Ltd 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3789789B2 (ja) * 2001-08-31 2006-06-28 株式会社エンプラス 電気部品用ソケット
JP4721580B2 (ja) * 2001-09-11 2011-07-13 株式会社センサータ・テクノロジーズジャパン ソケット
JP4721582B2 (ja) * 2001-09-14 2011-07-13 株式会社センサータ・テクノロジーズジャパン ソケット
US6547580B1 (en) * 2001-09-24 2003-04-15 Texas Instruments Incorporated Socket apparatus particularly adapted for land grid array type semiconductor devices
JP3566691B2 (ja) * 2001-12-17 2004-09-15 日本テキサス・インスツルメンツ株式会社 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法
JP2007109607A (ja) * 2005-10-17 2007-04-26 Three M Innovative Properties Co 電子デバイス用ソケット
JP2010118275A (ja) * 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd 半導体装置用ソケット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000113954A (ja) * 1998-10-05 2000-04-21 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2003168532A (ja) * 2001-11-29 2003-06-13 Texas Instr Japan Ltd 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022070279A1 (ja) * 2020-09-29 2022-04-07 株式会社エンプラス ソケット

Also Published As

Publication number Publication date
JP2009140629A (ja) 2009-06-25
KR101466425B1 (ko) 2014-12-01
JP4868413B2 (ja) 2012-02-01
CN101919128A (zh) 2010-12-15
KR20100091156A (ko) 2010-08-18
US8388365B2 (en) 2013-03-05
US20100248518A1 (en) 2010-09-30
CN101919128B (zh) 2013-03-20

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