TW200724264A - Paste silver composition, process for preparing the same, process for preparing solid silver, solid silver, jointing method, and process for preparing circuit board - Google Patents
Paste silver composition, process for preparing the same, process for preparing solid silver, solid silver, jointing method, and process for preparing circuit boardInfo
- Publication number
- TW200724264A TW200724264A TW095134899A TW95134899A TW200724264A TW 200724264 A TW200724264 A TW 200724264A TW 095134899 A TW095134899 A TW 095134899A TW 95134899 A TW95134899 A TW 95134899A TW 200724264 A TW200724264 A TW 200724264A
- Authority
- TW
- Taiwan
- Prior art keywords
- silver
- preparing
- composition
- solid
- solid silver
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/062—Fibrous particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29339—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005274240 | 2005-09-21 | ||
JP2005309126 | 2005-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200724264A true TW200724264A (en) | 2007-07-01 |
Family
ID=37888876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134899A TW200724264A (en) | 2005-09-21 | 2006-09-21 | Paste silver composition, process for preparing the same, process for preparing solid silver, solid silver, jointing method, and process for preparing circuit board |
Country Status (6)
Country | Link |
---|---|
US (1) | US7766218B2 (zh) |
EP (1) | EP1950767B1 (zh) |
JP (1) | JP4353380B2 (zh) |
KR (1) | KR101046197B1 (zh) |
TW (1) | TW200724264A (zh) |
WO (1) | WO2007034833A1 (zh) |
Cited By (6)
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CN102441741A (zh) * | 2010-09-03 | 2012-05-09 | 贺利氏材料工艺有限及两合公司 | 脂肪族碳氢化合物和石蜡作为银烧结膏中的溶剂的用途 |
CN102791421A (zh) * | 2009-09-04 | 2012-11-21 | 贺利氏材料工艺有限责任两合公司 | 具有co前体的金属糊 |
TWI508103B (zh) * | 2008-01-17 | 2015-11-11 | Nichia Corp | A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method |
CN105324198A (zh) * | 2013-05-03 | 2016-02-10 | 贺利氏德国有限责任两合公司 | 具有部分氧化的金属颗粒的改进的烧结糊料 |
CN105414560A (zh) * | 2015-12-25 | 2016-03-23 | 广东羚光新材料股份有限公司 | 一种高分辨显示屏浆料用小粒径片状银粉的制备方法 |
TWI685856B (zh) * | 2014-02-24 | 2020-02-21 | 德商漢高智慧財產控股公司 | 可燒結金屬粒子及其於電子應用中之用途 |
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US8555491B2 (en) * | 2007-07-19 | 2013-10-15 | Alpha Metals, Inc. | Methods of attaching a die to a substrate |
KR101004553B1 (ko) * | 2007-10-24 | 2011-01-03 | 도와 일렉트로닉스 가부시키가이샤 | 미소 은 입자 함유 조성물, 그 제조방법, 미소 은 입자의 제조방법 |
JP5207281B2 (ja) * | 2008-01-17 | 2013-06-12 | 国立大学法人大阪大学 | 導電性ペースト |
DE102008009510B3 (de) * | 2008-02-15 | 2009-07-16 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
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DE102008034952B4 (de) * | 2008-07-26 | 2016-05-19 | Semikron Elektronik Gmbh & Co. Kg | Edelmetallverbindungsmittel und Verwendungsverfahren hierzu |
JP5301385B2 (ja) * | 2008-10-29 | 2013-09-25 | ニホンハンダ株式会社 | 金属製部材用接合剤、金属製部材接合体の製造方法、金属製部材接合体および電気回路接続用バンプの製造方法 |
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JP4447273B2 (ja) * | 2003-09-19 | 2010-04-07 | 三井金属鉱業株式会社 | 銀インク及びその銀インクの製造方法 |
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JP4320447B2 (ja) * | 2004-02-03 | 2009-08-26 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
US20070183920A1 (en) * | 2005-02-14 | 2007-08-09 | Guo-Quan Lu | Nanoscale metal paste for interconnect and method of use |
JP3858902B2 (ja) * | 2004-03-03 | 2006-12-20 | 住友電気工業株式会社 | 導電性銀ペーストおよびその製造方法 |
JP2005330529A (ja) * | 2004-05-19 | 2005-12-02 | Dowa Mining Co Ltd | 球状銀粉およびその製造方法 |
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JP2006002228A (ja) * | 2004-06-18 | 2006-01-05 | Dowa Mining Co Ltd | 球状銀粉およびその製造方法 |
JP4482930B2 (ja) * | 2004-08-05 | 2010-06-16 | 昭栄化学工業株式会社 | 導電性ペースト |
JP4706637B2 (ja) * | 2004-11-29 | 2011-06-22 | Dic株式会社 | 導電性ペースト、及び導電性ペーストの製造方法 |
EP1947654B1 (en) * | 2005-09-29 | 2013-07-10 | Alpha Scientific, Corporation | Conductive powder and process for producing the same, conductive powder paste, and process for producing the conductive powder paste |
WO2009085651A1 (en) * | 2007-12-20 | 2009-07-09 | Nucryst Pharmaceuticals Corp. | Metal carbonate particles for use in medicine and methods of making thereof |
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2006
- 2006-09-20 EP EP06810329A patent/EP1950767B1/en active Active
- 2006-09-20 JP JP2007536534A patent/JP4353380B2/ja active Active
- 2006-09-20 US US12/067,648 patent/US7766218B2/en active Active
- 2006-09-20 WO PCT/JP2006/318633 patent/WO2007034833A1/ja active Application Filing
- 2006-09-20 KR KR1020087005933A patent/KR101046197B1/ko active IP Right Grant
- 2006-09-21 TW TW095134899A patent/TW200724264A/zh unknown
Cited By (8)
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TWI508103B (zh) * | 2008-01-17 | 2015-11-11 | Nichia Corp | A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method |
CN102791421A (zh) * | 2009-09-04 | 2012-11-21 | 贺利氏材料工艺有限责任两合公司 | 具有co前体的金属糊 |
CN102791421B (zh) * | 2009-09-04 | 2015-07-22 | 贺利氏材料工艺有限责任两合公司 | 具有co前体的金属糊 |
CN102441741A (zh) * | 2010-09-03 | 2012-05-09 | 贺利氏材料工艺有限及两合公司 | 脂肪族碳氢化合物和石蜡作为银烧结膏中的溶剂的用途 |
CN105324198A (zh) * | 2013-05-03 | 2016-02-10 | 贺利氏德国有限责任两合公司 | 具有部分氧化的金属颗粒的改进的烧结糊料 |
TWI685856B (zh) * | 2014-02-24 | 2020-02-21 | 德商漢高智慧財產控股公司 | 可燒結金屬粒子及其於電子應用中之用途 |
CN105414560A (zh) * | 2015-12-25 | 2016-03-23 | 广东羚光新材料股份有限公司 | 一种高分辨显示屏浆料用小粒径片状银粉的制备方法 |
CN105414560B (zh) * | 2015-12-25 | 2017-12-19 | 广东羚光新材料股份有限公司 | 一种高分辨显示屏浆料用小粒径片状银粉的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2007034833A1 (ja) | 2007-03-29 |
JPWO2007034833A1 (ja) | 2009-03-26 |
EP1950767A1 (en) | 2008-07-30 |
KR101046197B1 (ko) | 2011-07-04 |
US20090236404A1 (en) | 2009-09-24 |
KR20080052582A (ko) | 2008-06-11 |
US7766218B2 (en) | 2010-08-03 |
JP4353380B2 (ja) | 2009-10-28 |
EP1950767B1 (en) | 2012-08-22 |
EP1950767A4 (en) | 2009-10-21 |
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