CN107221506A - 一种高导热效率石墨复合片的制作方法 - Google Patents
一种高导热效率石墨复合片的制作方法 Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 65
- 239000010439 graphite Substances 0.000 title claims abstract description 65
- 239000002131 composite material Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 34
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
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- Microelectronics & Electronic Packaging (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
本发明公开一种高导热效率石墨复合片的制作方法,所述石墨复合片包括表面与热源相接触的石墨片以及贯穿所述石墨片的多片导热铜箔,所述导热铜箔的厚度与所述石墨片的厚度相同;它包括以下步骤:(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;(b)将铜箔卷冲切成导热铜箔;(c)将所述导热铜箔填入所述通孔中即可。通过在石墨片中贯穿设置石墨片,这样能够提高其在垂直方向上的导热能力,从而提高了导热效率,使得石墨片在垂直方向上的导热率达到150W/(m·k)以上。
Description
技术领域
本发明涉及一种石墨复合片,具体涉及一种高导热效率石墨复合片的制作方法。
背景技术
近年来,随着电子技术的不断发展,电子类产品不断更新换代,其工作组件的尺寸越来越小,工作的速度和效率越来越高,其发热量也越来越大,因此不仅要求其配备相应的散热装置,还要确保散热装置具有更强的散热能力,以保证产品性能的可靠性和延长其使用寿命。
石墨导热散热材料,因其特有的低密度(相对于金属类)和高导热散热系数及低热阻成为现代电子类产品解决导热散热技术的首选材料。石墨散热片可以沿水平、垂直两个方向导热,但是它在垂直方向的散热效果相对较差而容易形成热点,影响电子产品的散热效果。
发明内容
针对上述存在的技术不足,本发明的目的是提供一种高导热效率石墨复合片的制作方法。
为解决上述技术问题,本发明采用如下技术方案:一种高导热效率石墨复合片的制作方法,所述石墨复合片包括表面与热源相接触的石墨片以及贯穿所述石墨片的多片导热铜箔,所述导热铜箔的厚度与所述石墨片的厚度相同;它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;
(c)将所述导热铜箔填入所述通孔中即可。
优化地,它还包括步骤(d)在所述石墨片另一表面粘贴形成粘结层。
优化地,它还包括步骤(d')将步骤(c)得到的产品置于1000~1080℃、真空条件下保温 10~30分钟后降至室温。
进一步地,所述步骤(d')中,其升温速度为30~50℃/h,其降温速度为50~100℃/h。
本发明的有益效果在于:本发明高导热效率石墨复合片的制作方法,通过在石墨片中贯穿设置石墨片,这样能够提高其在垂直方向上的导热能力,从而提高了导热效率,使得石墨片在垂直方向上的导热率达到150W/(m·k)以上。
具体实施方式
下面结合所示的实施例对本发明作以下详细描述:
实施例1
本实施例提供一种高导热效率石墨复合片的制作方法,该石墨复合片包括表面与热源4 相接触的石墨片1、形成在石墨片1另一表面的粘结层3以及一端与粘结层3相接触且另一端延伸至穿过石墨片1的多片导热铜箔2,导热铜箔2的厚度与石墨片1的厚度相同;它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;导热铜箔2的厚度为20μm~2mm,直径为1~5mm;
(c)将所述导热铜箔填入所述通孔中即可;
(d)在所述石墨片另一表面粘贴形成粘结层,使得导热铜箔2的端部与粘结层相接触而不会掉落;制得的石墨复合片的垂直导热率达到150W/(m·k),拉伸强度为700(测试标准为ASTM F-152)。
实施例2
本实施例提供一种高导热效率石墨复合片的制作方法,石墨复合片的结构与实施例1中的基本一致,不同的是,它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;导热铜箔2的厚度为20μm~2mm,直径为1~5mm;
(c)将所述导热铜箔填入所述通孔中即可;
(d')步骤(c)得到的产品置于真空条件下,以30℃/h的速度升温至1000℃,随后保温10分钟,再以50℃/h的速度降至室温,制得的石墨复合片的垂直导热率达到250W/(m·k),拉伸强度为750(测试标准为ASTM F-152)。
实施例3
本实施例提供一种高导热效率石墨复合片的制作方法,石墨复合片的结构与实施例1中的基本一致,不同的是,它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;导热铜箔2的厚度为20μm~2mm,直径为1~5mm;
(c)将所述导热铜箔填入所述通孔中即可;
(d')步骤(c)得到的产品置于真空条件下,以50℃/h的速度升温至1080℃,随后保温 30分钟,再以100℃/h的速度降至室温,制得的石墨复合片的垂直导热率达到450W/(m·k),拉伸强度为850(测试标准为ASTM F-152)。
实施例4
本实施例提供一种高导热效率石墨复合片的制作方法,石墨复合片的结构与实施例1中的基本一致,不同的是,它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;导热铜箔2的厚度为20μm~2mm,直径为1~5mm;
(c)将所述导热铜箔填入所述通孔中即可;
(d')步骤(c)得到的产品置于真空条件下,以35℃/h的速度升温至1050℃,随后保温 25分钟,再以80℃/h的速度降至室温,制得的石墨复合片的垂直导热率达到350W/(m·k),拉伸强度为790(测试标准为ASTM F-152)。
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。
Claims (4)
1.一种高导热效率石墨复合片的制作方法,所述石墨复合片包括表面与热源相接触的石墨片以及贯穿所述石墨片的多片导热铜箔,所述导热铜箔的厚度与所述石墨片的厚度相同;其特征在于,它包括以下步骤:
(a)将石墨卷冲切成石墨片,并冲压形成多个通孔;
(b)将铜箔卷冲切成导热铜箔;
(c)将所述导热铜箔填入所述通孔中即可。
2.根据权利要求1所述的高导热效率石墨复合片的制作方法,其特征在于:它还包括步骤(d)在所述石墨片另一表面粘贴形成粘结层。
3.根据权利要求1所述的高导热效率石墨复合片的制作方法,其特征在于:它还包括步骤(d')将步骤(c)得到的产品置于1000~1080℃、真空条件下保温10~30分钟后降至室温。
4.根据权利要求3所述的高导热效率石墨复合片的制作方法,其特征在于:所述步骤(d')中,其升温速度为30~50℃/h,其降温速度为50~100℃/h。
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