TW200618128A - Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like - Google Patents

Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like

Info

Publication number
TW200618128A
TW200618128A TW094131500A TW94131500A TW200618128A TW 200618128 A TW200618128 A TW 200618128A TW 094131500 A TW094131500 A TW 094131500A TW 94131500 A TW94131500 A TW 94131500A TW 200618128 A TW200618128 A TW 200618128A
Authority
TW
Taiwan
Prior art keywords
photoresist
dispensing pump
dispensing
wafer
supply line
Prior art date
Application number
TW094131500A
Other languages
English (en)
Inventor
Jong-Haw Lee
Jin-Jun Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200618128A publication Critical patent/TW200618128A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0031—Degasification of liquids by filtration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW094131500A 2004-10-13 2005-09-13 Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like TW200618128A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040081565A KR100643494B1 (ko) 2004-10-13 2004-10-13 반도체 제조용 포토레지스트의 디스펜싱장치

Publications (1)

Publication Number Publication Date
TW200618128A true TW200618128A (en) 2006-06-01

Family

ID=36129123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131500A TW200618128A (en) 2004-10-13 2005-09-13 Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like

Country Status (6)

Country Link
US (1) US7685963B2 (zh)
JP (1) JP2006114906A (zh)
KR (1) KR100643494B1 (zh)
CN (1) CN1766734A (zh)
DE (1) DE102005048262A1 (zh)
TW (1) TW200618128A (zh)

Cited By (3)

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TWI621472B (zh) * 2013-10-02 2018-04-21 東京威力科創股份有限公司 處理液供給裝置及處理液供給方法
TWI687594B (zh) * 2013-03-15 2020-03-11 美商泰勒達數位影像美國公司 具有一快換馬達驅動、自動式氣體移除與流體回收系統以及其遠端監測、觀察與控制的綜合式泵系統和方法
TWI732235B (zh) * 2018-06-29 2021-07-01 台灣積體電路製造股份有限公司 光阻劑分配系統及光阻劑的回收方法

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KR100766443B1 (ko) * 2006-05-23 2007-10-11 주식회사 케이씨텍 슬릿 노즐의 폭방향 토출 균일도 측정 장치 및 방법
KR100766444B1 (ko) * 2006-05-23 2007-10-11 주식회사 케이씨텍 슬릿 노즐의 폭방향 토출 균일도 측정 장치 및 방법
JP5060835B2 (ja) * 2006-07-26 2012-10-31 芝浦メカトロニクス株式会社 基板の処理装置
JP5257915B2 (ja) * 2006-09-29 2013-08-07 国立大学法人東北大学 膜塗布装置および膜塗布方法
US8865454B2 (en) * 2007-03-22 2014-10-21 Scandinavian Micro Biodevices Aps Flow through system, flow through device and a method of performing a test
CN101131541B (zh) * 2007-10-15 2010-08-18 彩虹集团电子股份有限公司 感光胶液体的供给装置
JP5355881B2 (ja) * 2007-12-05 2013-11-27 東京応化工業株式会社 塗布装置
JP4831061B2 (ja) * 2007-12-26 2011-12-07 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置の非常停止方法
JP5231028B2 (ja) * 2008-01-21 2013-07-10 東京エレクトロン株式会社 塗布液供給装置
US20090214782A1 (en) * 2008-02-21 2009-08-27 Forrest Stephen R Organic vapor jet printing system
CN101762984B (zh) * 2008-12-25 2012-08-22 中芯国际集成电路制造(上海)有限公司 光刻胶滴注***、光刻胶喷嘴及其使用方法
CN102274812B (zh) * 2011-06-30 2014-04-23 深圳市华星光电技术有限公司 一种涂胶***及其涂胶方法
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
US9656197B2 (en) * 2012-11-12 2017-05-23 Pall Corporation Systems and methods for conditioning a filter assembly
KR101456458B1 (ko) * 2013-06-19 2014-10-31 주식회사 나래나노텍 개선된 hmds 공급 장치 및 방법, 및 개선된 약액 공급 장치 및 방법
US10074547B2 (en) * 2013-12-19 2018-09-11 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist nozzle device and photoresist supply system
US9718082B2 (en) * 2014-01-26 2017-08-01 Tokyo Electron Limited Inline dispense capacitor
CN103910493B (zh) * 2014-03-21 2016-05-04 京东方科技集团股份有限公司 光刻胶回收装置，涂布***及涂布方法
CN103894312B (zh) * 2014-03-28 2016-04-13 郑州格兰高环境工程有限公司 智能移动式胶水补给***
CN105728243A (zh) * 2014-12-08 2016-07-06 沈阳芯源微电子设备有限公司 一种光刻胶喷头保湿装置及其保湿方法
SG11201804657QA (en) * 2015-12-09 2018-06-28 Acm Res Shanghai Inc Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
JP2016189493A (ja) * 2016-08-09 2016-11-04 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
US10403501B2 (en) * 2016-08-11 2019-09-03 Tokyo Electron Limited High-purity dispense system
US10354872B2 (en) 2016-08-11 2019-07-16 Tokyo Electron Limited High-precision dispense system with meniscus control
KR102394995B1 (ko) 2016-08-11 2022-05-04 도쿄엘렉트론가부시키가이샤 고순도 분배 유닛
CN106890768A (zh) * 2017-04-24 2017-06-27 桂林紫竹乳胶制品有限公司 一种避孕套润滑剂滴加装置
CN107121897A (zh) * 2017-05-25 2017-09-01 上海华力微电子有限公司 一种光刻胶管路设计
CN107899781A (zh) * 2017-11-16 2018-04-13 上海华力微电子有限公司 一种新型的实时监控光刻胶喷涂***及工作方法
US11273396B2 (en) * 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
KR102221258B1 (ko) * 2018-09-27 2021-03-02 세메스 주식회사 약액 토출 장치
CN109569081B (zh) 2018-12-04 2021-02-26 惠科股份有限公司 过滤装置和光阻涂布***
KR20200126552A (ko) 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的***与方法
CN114345644B (zh) * 2020-10-13 2023-10-20 中国科学院微电子研究所 光刻胶输送***
CN113187741B (zh) * 2021-04-29 2022-12-02 长鑫存储技术有限公司 液体回吸***及回吸方法
CN115487998A (zh) * 2021-06-17 2022-12-20 上海集成电路材料研究院有限公司 高通量光刻胶配胶曝光一体化设备及光刻工艺
KR20230051888A (ko) * 2021-10-12 2023-04-19 삼성전자주식회사 감광액 공급 시스템 및 이를 이용한 반도체 장치의 제조 방법
CN116273729B (zh) * 2023-01-28 2023-10-20 中山市美速光电技术有限公司 一种用于超微间距光纤阵列的点胶装置

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JP2803859B2 (ja) * 1989-09-29 1998-09-24 株式会社日立製作所 流動体供給装置およびその制御方法
US5585466A (en) * 1994-12-06 1996-12-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Crystals of serum albumin for use in genetic engineering and rational drug design
US5858466A (en) * 1996-06-24 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist supply system with air venting
US6171367B1 (en) * 1997-06-05 2001-01-09 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for delivering and recycling a bubble-free liquid chemical
US6616760B2 (en) * 1999-12-17 2003-09-09 Tokyo Electron Limited Film forming unit
US6848625B2 (en) * 2002-03-19 2005-02-01 Tokyo Electron Limited Process liquid supply mechanism and process liquid supply method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687594B (zh) * 2013-03-15 2020-03-11 美商泰勒達數位影像美國公司 具有一快換馬達驅動、自動式氣體移除與流體回收系統以及其遠端監測、觀察與控制的綜合式泵系統和方法
TWI621472B (zh) * 2013-10-02 2018-04-21 東京威力科創股份有限公司 處理液供給裝置及處理液供給方法
TWI732235B (zh) * 2018-06-29 2021-07-01 台灣積體電路製造股份有限公司 光阻劑分配系統及光阻劑的回收方法

Also Published As

Publication number Publication date
KR20060032674A (ko) 2006-04-18
KR100643494B1 (ko) 2006-11-10
US20060075965A1 (en) 2006-04-13
CN1766734A (zh) 2006-05-03
DE102005048262A1 (de) 2006-04-27
US7685963B2 (en) 2010-03-30
JP2006114906A (ja) 2006-04-27

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