SG151199A1 - Heating apparatus - Google Patents

Heating apparatus

Info

Publication number
SG151199A1
SG151199A1 SG200806670-6A SG2008066706A SG151199A1 SG 151199 A1 SG151199 A1 SG 151199A1 SG 2008066706 A SG2008066706 A SG 2008066706A SG 151199 A1 SG151199 A1 SG 151199A1
Authority
SG
Singapore
Prior art keywords
ceramic base
heating apparatus
heating
temperature adjusting
adjusting member
Prior art date
Application number
SG200806670-6A
Other languages
English (en)
Inventor
Ikuhisa Morioka
Hideyoshi Tsuruta
Yasufumi Aihara
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Publication of SG151199A1 publication Critical patent/SG151199A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
SG200806670-6A 2007-09-10 2008-09-10 Heating apparatus SG151199A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007234485 2007-09-10

Publications (1)

Publication Number Publication Date
SG151199A1 true SG151199A1 (en) 2009-04-30

Family

ID=40386295

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200806670-6A SG151199A1 (en) 2007-09-10 2008-09-10 Heating apparatus

Country Status (8)

Country Link
US (1) US20090159588A1 (ja)
EP (1) EP2045834B1 (ja)
JP (1) JP5107186B2 (ja)
KR (2) KR20090026727A (ja)
CN (1) CN101389161B (ja)
DE (1) DE602008004806D1 (ja)
SG (1) SG151199A1 (ja)
TW (1) TWI459851B (ja)

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US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
US10319739B2 (en) 2017-02-08 2019-06-11 Applied Materials, Inc. Accommodating imperfectly aligned memory holes
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
US11276590B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Multi-zone semiconductor substrate supports
US11276559B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Semiconductor processing chamber for multiple precursor flow
US10497579B2 (en) 2017-05-31 2019-12-03 Applied Materials, Inc. Water-free etching methods
US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
US10541246B2 (en) 2017-06-26 2020-01-21 Applied Materials, Inc. 3D flash memory cells which discourage cross-cell electrical tunneling
US10727080B2 (en) 2017-07-07 2020-07-28 Applied Materials, Inc. Tantalum-containing material removal
US10541184B2 (en) 2017-07-11 2020-01-21 Applied Materials, Inc. Optical emission spectroscopic techniques for monitoring etching
US10043674B1 (en) 2017-08-04 2018-08-07 Applied Materials, Inc. Germanium etching systems and methods
US10297458B2 (en) 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
US10903054B2 (en) 2017-12-19 2021-01-26 Applied Materials, Inc. Multi-zone gas distribution systems and methods
US11328909B2 (en) 2017-12-22 2022-05-10 Applied Materials, Inc. Chamber conditioning and removal processes
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US10964512B2 (en) 2018-02-15 2021-03-30 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus and methods
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US11682560B2 (en) 2018-10-11 2023-06-20 Applied Materials, Inc. Systems and methods for hafnium-containing film removal
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US11437242B2 (en) 2018-11-27 2022-09-06 Applied Materials, Inc. Selective removal of silicon-containing materials
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US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
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CN110556319B (zh) * 2019-09-10 2022-10-21 北京北方华创微电子装备有限公司 加热器、半导体加工腔室及加工设备
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Also Published As

Publication number Publication date
TW200934281A (en) 2009-08-01
US20090159588A1 (en) 2009-06-25
JP5107186B2 (ja) 2012-12-26
KR20130139213A (ko) 2013-12-20
TWI459851B (zh) 2014-11-01
CN101389161A (zh) 2009-03-18
EP2045834A2 (en) 2009-04-08
DE602008004806D1 (de) 2011-03-17
EP2045834B1 (en) 2011-02-02
KR20090026727A (ko) 2009-03-13
EP2045834A3 (en) 2009-04-15
JP2009087932A (ja) 2009-04-23
CN101389161B (zh) 2013-11-06

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