TW200743772A - Heat treatment apparatus - Google Patents

Heat treatment apparatus

Info

Publication number
TW200743772A
TW200743772A TW095127678A TW95127678A TW200743772A TW 200743772 A TW200743772 A TW 200743772A TW 095127678 A TW095127678 A TW 095127678A TW 95127678 A TW95127678 A TW 95127678A TW 200743772 A TW200743772 A TW 200743772A
Authority
TW
Taiwan
Prior art keywords
heating chamber
front member
treatment apparatus
heat treatment
thickness direction
Prior art date
Application number
TW095127678A
Other languages
Chinese (zh)
Other versions
TWI410599B (en
Inventor
Yasushi Nagashima
Original Assignee
Koyo Thermo Sys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Thermo Sys Co Ltd filed Critical Koyo Thermo Sys Co Ltd
Publication of TW200743772A publication Critical patent/TW200743772A/en
Application granted granted Critical
Publication of TWI410599B publication Critical patent/TWI410599B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B27/00—Tempering or quenching glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Furnace Details (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

Heat deformation of a front side of a heating chamber in its thickness direction is prevented, and therefore a uniform temperature distribution within, and a low heat loss from, the heating chamber is enabled, by using a bimetal plate as at least a front portion of an inner surface of the heating chamber, without an increase in size and production cost of heat treatment apparatus and without involving complex design and complicated adjustment operations. A heating chamber 1 has an inner surface. A front member 41 of the inner surface includes a bimetal made of an outer material 411 with a high thermal expansion coefficient and an inner material 412 with a low thermal expansion coefficient. As an example, the outer material 411 is SUS304, and the inner material 412 is SUS430. This prevents the front member 41 from being deformed in a thickness direction thereof by a possible temperature gradient between the inner and outer sides of the front member 41.
TW095127678A 2006-05-26 2006-07-28 Heat treatment apparatus TWI410599B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006147227A JP5074707B2 (en) 2006-05-26 2006-05-26 Heating device

Publications (2)

Publication Number Publication Date
TW200743772A true TW200743772A (en) 2007-12-01
TWI410599B TWI410599B (en) 2013-10-01

Family

ID=38849722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127678A TWI410599B (en) 2006-05-26 2006-07-28 Heat treatment apparatus

Country Status (3)

Country Link
JP (1) JP5074707B2 (en)
KR (1) KR101285358B1 (en)
TW (1) TWI410599B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510750B (en) * 2009-10-09 2015-12-01 Koyo Thermo Sys Co Ltd Heat treatment apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301816B2 (en) * 2007-11-21 2013-09-25 光洋サーモシステム株式会社 Heat resistant vacuum insulation
JP5272486B2 (en) * 2008-04-09 2013-08-28 株式会社Ｉｈｉ Heat treatment furnace
CN106971020B (en) * 2017-02-22 2020-05-05 天津博迈科海洋工程有限公司 Method for optimizing thickness of fireproof coating of column inside closed module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63165596U (en) * 1987-04-20 1988-10-27
JPS6478697A (en) * 1987-09-21 1989-03-24 Ishikawajima Harima Heavy Ind Vacuum brazing method for aluminum
JPH08200956A (en) * 1995-01-23 1996-08-09 Sumitomo Electric Ind Ltd Sealing device
JPH10141864A (en) * 1996-11-05 1998-05-29 Kobe Steel Ltd Heat insulating device is not isotropic pressurizer
JPH10206033A (en) * 1997-01-20 1998-08-07 Tokyo Yogyo Co Ltd Method of execution refractories for lining induction furnace
JPH1194471A (en) * 1997-09-22 1999-04-09 Kakunenryo Cycle Kaihatsu Kiko Inner heating sintering furnace
JP3648589B2 (en) * 1998-12-01 2005-05-18 光洋サーモシステム株式会社 Heat treatment equipment
JP3590356B2 (en) * 2001-02-08 2004-11-17 株式会社不二越 Continuous vacuum carburizing furnace partition door
JP2003303666A (en) * 2002-04-10 2003-10-24 Koyo Thermo System Kk Heating device
JP2005114299A (en) * 2003-10-10 2005-04-28 Matsushita Electric Ind Co Ltd Microwave kiln
JP4297354B2 (en) * 2004-05-28 2009-07-15 第一高周波工業株式会社 Boiler panel heating apparatus and method
JP4373309B2 (en) * 2004-08-31 2009-11-25 京セラキンセキ株式会社 Package for electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510750B (en) * 2009-10-09 2015-12-01 Koyo Thermo Sys Co Ltd Heat treatment apparatus

Also Published As

Publication number Publication date
KR20070113942A (en) 2007-11-29
JP5074707B2 (en) 2012-11-14
TWI410599B (en) 2013-10-01
KR101285358B1 (en) 2013-07-11
JP2007315707A (en) 2007-12-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees