SG144051A1 - Method and device for producing semiconductor wafers of silicon - Google Patents
Method and device for producing semiconductor wafers of siliconInfo
- Publication number
- SG144051A1 SG144051A1 SG200718453-4A SG2007184534A SG144051A1 SG 144051 A1 SG144051 A1 SG 144051A1 SG 2007184534 A SG2007184534 A SG 2007184534A SG 144051 A1 SG144051 A1 SG 144051A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafers
- single crystal
- silicon
- melt
- producing semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 239000013078 crystal Substances 0.000 abstract 5
- 239000000155 melt Substances 0.000 abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/30—Mechanisms for rotating or moving either the melt or the crystal
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B30/00—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions
- C30B30/04—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions using magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1016—Apparatus with means for treating single-crystal [e.g., heat treating]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006060359A DE102006060359B4 (de) | 2006-12-20 | 2006-12-20 | Verfahren und Vorrichtung zur Herstellung von Halbleiterscheiben aus Silicium |
Publications (1)
Publication Number | Publication Date |
---|---|
SG144051A1 true SG144051A1 (en) | 2008-07-29 |
Family
ID=39431467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200718453-4A SG144051A1 (en) | 2006-12-20 | 2007-12-07 | Method and device for producing semiconductor wafers of silicon |
Country Status (7)
Country | Link |
---|---|
US (1) | US8172941B2 (de) |
JP (1) | JP4814207B2 (de) |
KR (1) | KR100945757B1 (de) |
CN (1) | CN101240444A (de) |
DE (1) | DE102006060359B4 (de) |
SG (1) | SG144051A1 (de) |
TW (1) | TWI372192B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4710247B2 (ja) * | 2004-05-19 | 2011-06-29 | 株式会社Sumco | 単結晶製造装置及び方法 |
JP2006069841A (ja) * | 2004-09-02 | 2006-03-16 | Sumco Corp | 磁場印加式シリコン単結晶の引上げ方法 |
DE102009051010B4 (de) * | 2009-10-28 | 2012-02-23 | Siltronic Ag | Vorrichtung zur Herstellung eines Einkristalls aus Silizium durch Umschmelzen von Granulat |
DE102009057593A1 (de) * | 2009-12-09 | 2011-06-16 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
DE102010005100B4 (de) | 2010-01-20 | 2016-07-14 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben aus Silizium mit einem Durchmesser von mindestens 450 mm |
DE102010023101B4 (de) * | 2010-06-09 | 2016-07-07 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben aus Silizium |
CN103103606A (zh) * | 2013-02-25 | 2013-05-15 | 天津市环欧半导体材料技术有限公司 | 一种制备8寸低氧单晶的方法 |
CN103114328B (zh) * | 2013-02-25 | 2015-10-07 | 天津市环欧半导体材料技术有限公司 | 8寸<110>磁场直拉单晶的制备方法 |
CN104711674B (zh) * | 2013-12-09 | 2017-06-06 | 有研半导体材料有限公司 | 一种减少直拉单晶硅内部微气孔密度的方法 |
DE102016219605A1 (de) * | 2016-10-10 | 2018-04-12 | Siltronic Ag | Verfahren zum Ziehen eines Einkristalls aus Halbleitermaterial aus einer Schmelze, die in einem Tiegel enthalten ist |
CN106222737A (zh) * | 2016-10-17 | 2016-12-14 | 宁夏协鑫晶体科技发展有限公司 | 缩短单晶炉熔料时间装置及方法 |
CN108588830B (zh) * | 2018-07-26 | 2019-08-06 | 江苏金晖光伏有限公司 | 提纯太阳能级多晶硅的装置 |
CN109056063A (zh) * | 2018-08-29 | 2018-12-21 | 孟静 | 太阳能电池用多晶硅片的制备方法 |
CN109537045B (zh) * | 2018-12-29 | 2024-05-10 | 徐州晶睿半导体装备科技有限公司 | 用于硅晶锭生长的换热器、硅晶锭的生长炉和制备硅晶锭的方法 |
DE102019213236A1 (de) * | 2019-09-02 | 2021-03-04 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben aus einkristallinem Silizium |
KR20240037364A (ko) * | 2019-09-13 | 2024-03-21 | 글로벌웨이퍼스 씨오., 엘티디. | 연속 쵸크랄스키 방법을 사용하여 질소 도핑된 단결정 실리콘 잉곳을 성장시키기 위한 방법들 및 이 방법에 의해 성장되는 단결정 실리콘 잉곳 |
CN112349583A (zh) * | 2020-10-27 | 2021-02-09 | 西安奕斯伟硅片技术有限公司 | 硅片刻蚀方法、dosd检测方法及硅片刻蚀装置 |
EP4137613A1 (de) * | 2021-08-18 | 2023-02-22 | Siltronic AG | Verfahren zur herstellung einer epitaktisch beschichteten hableiterscheibe aus einkristallinem silizium |
CN113832537B (zh) * | 2021-09-30 | 2022-08-26 | 西安奕斯伟材料科技有限公司 | 石英坩埚及拉晶炉 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61222984A (ja) | 1985-03-28 | 1986-10-03 | Toshiba Corp | 単結晶の製造装置 |
DE19503357A1 (de) | 1995-02-02 | 1996-08-08 | Wacker Siltronic Halbleitermat | Vorrichtung zur Herstellung eines Einkristalls |
JP3085146B2 (ja) * | 1995-05-31 | 2000-09-04 | 住友金属工業株式会社 | シリコン単結晶ウェーハおよびその製造方法 |
DE19711922A1 (de) * | 1997-03-21 | 1998-09-24 | Wacker Siltronic Halbleitermat | Vorrichtung und Verfahren zum Ziehen eines Einkristalls |
JP3228173B2 (ja) * | 1997-03-27 | 2001-11-12 | 住友金属工業株式会社 | 単結晶製造方法 |
JP2992988B2 (ja) * | 1997-11-06 | 1999-12-20 | 日本電気株式会社 | シリコン単結晶育成方法 |
JP2000239097A (ja) * | 1999-02-22 | 2000-09-05 | Sumitomo Metal Ind Ltd | 半導体用シリコン単結晶の引上げ方法 |
DE10102126A1 (de) * | 2001-01-18 | 2002-08-22 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Herstellen eines Einkristalls aus Silicium |
JP4236243B2 (ja) * | 2002-10-31 | 2009-03-11 | Sumco Techxiv株式会社 | シリコンウェーハの製造方法 |
DE10339792B4 (de) * | 2003-03-27 | 2014-02-27 | Siltronic Ag | Verfahren und Vorrichtung zur Herstellung eines Einkristalls aus Silicium |
KR100588425B1 (ko) * | 2003-03-27 | 2006-06-12 | 실트로닉 아게 | 실리콘 단결정, 결정된 결함분포를 가진 실리콘 단결정 및 실리콘 반도체 웨이퍼의 제조방법 |
JP4710247B2 (ja) | 2004-05-19 | 2011-06-29 | 株式会社Sumco | 単結晶製造装置及び方法 |
US7223304B2 (en) * | 2004-12-30 | 2007-05-29 | Memc Electronic Materials, Inc. | Controlling melt-solid interface shape of a growing silicon crystal using a variable magnetic field |
US7819972B2 (en) * | 2005-06-20 | 2010-10-26 | Sumco Corporation | Method for growing silicon single crystal and method for manufacturing silicon wafer |
US8152921B2 (en) * | 2006-09-01 | 2012-04-10 | Okmetic Oyj | Crystal manufacturing |
DE102007005346B4 (de) * | 2007-02-02 | 2015-09-17 | Siltronic Ag | Halbleiterscheiben aus Silicium und Verfahren zu deren Herstellung |
-
2006
- 2006-12-20 DE DE102006060359A patent/DE102006060359B4/de not_active Expired - Fee Related
-
2007
- 2007-11-23 CN CNA2007101936606A patent/CN101240444A/zh active Pending
- 2007-11-30 KR KR1020070124005A patent/KR100945757B1/ko not_active IP Right Cessation
- 2007-12-07 TW TW096146837A patent/TWI372192B/zh not_active IP Right Cessation
- 2007-12-07 SG SG200718453-4A patent/SG144051A1/en unknown
- 2007-12-19 US US12/002,881 patent/US8172941B2/en not_active Expired - Fee Related
- 2007-12-20 JP JP2007328958A patent/JP4814207B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080153261A1 (en) | 2008-06-26 |
DE102006060359A1 (de) | 2008-06-26 |
JP2008156225A (ja) | 2008-07-10 |
DE102006060359B4 (de) | 2013-09-05 |
JP4814207B2 (ja) | 2011-11-16 |
KR20080058177A (ko) | 2008-06-25 |
KR100945757B1 (ko) | 2010-03-08 |
CN101240444A (zh) | 2008-08-13 |
TWI372192B (en) | 2012-09-11 |
TW200829733A (en) | 2008-07-16 |
US8172941B2 (en) | 2012-05-08 |
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