TWI372192B - Verfahren und vorrichtung zur herstellung von halbleiterscheiben aus silicium - Google Patents

Verfahren und vorrichtung zur herstellung von halbleiterscheiben aus silicium

Info

Publication number
TWI372192B
TWI372192B TW096146837A TW96146837A TWI372192B TW I372192 B TWI372192 B TW I372192B TW 096146837 A TW096146837 A TW 096146837A TW 96146837 A TW96146837 A TW 96146837A TW I372192 B TWI372192 B TW I372192B
Authority
TW
Taiwan
Prior art keywords
halbleiterscheiben
zur herstellung
vorrichtung zur
herstellung von
verfahren und
Prior art date
Application number
TW096146837A
Other languages
English (en)
Other versions
TW200829733A (en
Inventor
Martin Weber
Herbert Schmidt
Ammon Wilfried Von
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of TW200829733A publication Critical patent/TW200829733A/zh
Application granted granted Critical
Publication of TWI372192B publication Critical patent/TWI372192B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/30—Mechanisms for rotating or moving either the melt or the crystal
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B30/00—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions
    • C30B30/04—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions using magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1016—Apparatus with means for treating single-crystal [e.g., heat treating]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032—Seed pulling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW096146837A 2006-12-20 2007-12-07 Verfahren und vorrichtung zur herstellung von halbleiterscheiben aus silicium TWI372192B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006060359A DE102006060359B4 (de) 2006-12-20 2006-12-20 Verfahren und Vorrichtung zur Herstellung von Halbleiterscheiben aus Silicium

Publications (2)

Publication Number Publication Date
TW200829733A TW200829733A (en) 2008-07-16
TWI372192B true TWI372192B (en) 2012-09-11

Family

ID=39431467

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146837A TWI372192B (en) 2006-12-20 2007-12-07 Verfahren und vorrichtung zur herstellung von halbleiterscheiben aus silicium

Country Status (7)

Country Link
US (1) US8172941B2 (zh)
JP (1) JP4814207B2 (zh)
KR (1) KR100945757B1 (zh)
CN (1) CN101240444A (zh)
DE (1) DE102006060359B4 (zh)
SG (1) SG144051A1 (zh)
TW (1) TWI372192B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710247B2 (ja) * 2004-05-19 2011-06-29 株式会社Ｓｕｍｃｏ 単結晶製造装置及び方法
JP2006069841A (ja) * 2004-09-02 2006-03-16 Sumco Corp 磁場印加式シリコン単結晶の引上げ方法
DE102009051010B4 (de) * 2009-10-28 2012-02-23 Siltronic Ag Vorrichtung zur Herstellung eines Einkristalls aus Silizium durch Umschmelzen von Granulat
DE102009057593A1 (de) * 2009-12-09 2011-06-16 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010005100B4 (de) 2010-01-20 2016-07-14 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben aus Silizium mit einem Durchmesser von mindestens 450 mm
DE102010023101B4 (de) * 2010-06-09 2016-07-07 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben aus Silizium
CN103103606A (zh) * 2013-02-25 2013-05-15 天津市环欧半导体材料技术有限公司 一种制备8寸低氧单晶的方法
CN103114328B (zh) * 2013-02-25 2015-10-07 天津市环欧半导体材料技术有限公司 8寸＜110＞磁场直拉单晶的制备方法
CN104711674B (zh) * 2013-12-09 2017-06-06 有研半导体材料有限公司 一种减少直拉单晶硅内部微气孔密度的方法
DE102016219605A1 (de) * 2016-10-10 2018-04-12 Siltronic Ag Verfahren zum Ziehen eines Einkristalls aus Halbleitermaterial aus einer Schmelze, die in einem Tiegel enthalten ist
CN106222737A (zh) * 2016-10-17 2016-12-14 宁夏协鑫晶体科技发展有限公司 缩短单晶炉熔料时间装置及方法
CN108588830B (zh) * 2018-07-26 2019-08-06 江苏金晖光伏有限公司 提纯太阳能级多晶硅的装置
CN109056063A (zh) * 2018-08-29 2018-12-21 孟静 太阳能电池用多晶硅片的制备方法
CN109537045B (zh) * 2018-12-29 2024-05-10 徐州晶睿半导体装备科技有限公司 用于硅晶锭生长的换热器、硅晶锭的生长炉和制备硅晶锭的方法
DE102019213236A1 (de) * 2019-09-02 2021-03-04 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben aus einkristallinem Silizium
KR20240037364A (ko) * 2019-09-13 2024-03-21 글로벌웨이퍼스 씨오., 엘티디. 연속 쵸크랄스키 방법을 사용하여 질소 도핑된 단결정 실리콘 잉곳을 성장시키기 위한 방법들 및 이 방법에 의해 성장되는 단결정 실리콘 잉곳
CN112349583A (zh) * 2020-10-27 2021-02-09 西安奕斯伟硅片技术有限公司 硅片刻蚀方法、dosd检测方法及硅片刻蚀装置
EP4137613A1 (de) * 2021-08-18 2023-02-22 Siltronic AG Verfahren zur herstellung einer epitaktisch beschichteten hableiterscheibe aus einkristallinem silizium
CN113832537B (zh) * 2021-09-30 2022-08-26 西安奕斯伟材料科技有限公司 石英坩埚及拉晶炉

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222984A (ja) 1985-03-28 1986-10-03 Toshiba Corp 単結晶の製造装置
DE19503357A1 (de) 1995-02-02 1996-08-08 Wacker Siltronic Halbleitermat Vorrichtung zur Herstellung eines Einkristalls
JP3085146B2 (ja) * 1995-05-31 2000-09-04 住友金属工業株式会社 シリコン単結晶ウェーハおよびその製造方法
DE19711922A1 (de) * 1997-03-21 1998-09-24 Wacker Siltronic Halbleitermat Vorrichtung und Verfahren zum Ziehen eines Einkristalls
JP3228173B2 (ja) * 1997-03-27 2001-11-12 住友金属工業株式会社 単結晶製造方法
JP2992988B2 (ja) * 1997-11-06 1999-12-20 日本電気株式会社 シリコン単結晶育成方法
JP2000239097A (ja) * 1999-02-22 2000-09-05 Sumitomo Metal Ind Ltd 半導体用シリコン単結晶の引上げ方法
DE10102126A1 (de) * 2001-01-18 2002-08-22 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Herstellen eines Einkristalls aus Silicium
JP4236243B2 (ja) * 2002-10-31 2009-03-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 シリコンウェーハの製造方法
DE10339792B4 (de) * 2003-03-27 2014-02-27 Siltronic Ag Verfahren und Vorrichtung zur Herstellung eines Einkristalls aus Silicium
KR100588425B1 (ko) * 2003-03-27 2006-06-12 실트로닉 아게 실리콘 단결정, 결정된 결함분포를 가진 실리콘 단결정 및 실리콘 반도체 웨이퍼의 제조방법
JP4710247B2 (ja) 2004-05-19 2011-06-29 株式会社Ｓｕｍｃｏ 単結晶製造装置及び方法
US7223304B2 (en) * 2004-12-30 2007-05-29 Memc Electronic Materials, Inc. Controlling melt-solid interface shape of a growing silicon crystal using a variable magnetic field
US7819972B2 (en) * 2005-06-20 2010-10-26 Sumco Corporation Method for growing silicon single crystal and method for manufacturing silicon wafer
US8152921B2 (en) * 2006-09-01 2012-04-10 Okmetic Oyj Crystal manufacturing
DE102007005346B4 (de) * 2007-02-02 2015-09-17 Siltronic Ag Halbleiterscheiben aus Silicium und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
US20080153261A1 (en) 2008-06-26
DE102006060359A1 (de) 2008-06-26
JP2008156225A (ja) 2008-07-10
DE102006060359B4 (de) 2013-09-05
SG144051A1 (en) 2008-07-29
JP4814207B2 (ja) 2011-11-16
KR20080058177A (ko) 2008-06-25
KR100945757B1 (ko) 2010-03-08
CN101240444A (zh) 2008-08-13
TW200829733A (en) 2008-07-16
US8172941B2 (en) 2012-05-08

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MM4A Annulment or lapse of patent due to non-payment of fees