SG143940A1 - Process for depositing composite coating on a surface - Google Patents

Process for depositing composite coating on a surface

Info

Publication number
SG143940A1
SG143940A1 SG200307671-8A SG2003076718A SG143940A1 SG 143940 A1 SG143940 A1 SG 143940A1 SG 2003076718 A SG2003076718 A SG 2003076718A SG 143940 A1 SG143940 A1 SG 143940A1
Authority
SG
Singapore
Prior art keywords
coating
substrate
power
composite coating
depositing composite
Prior art date
Application number
SG200307671-8A
Other languages
English (en)
Inventor
Zeng Xianting
Ding Xingzhao
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Priority to SG200307671-8A priority Critical patent/SG143940A1/en
Priority to US11/016,117 priority patent/US20050136656A1/en
Priority to JP2004367997A priority patent/JP2005248322A/ja
Publication of SG143940A1 publication Critical patent/SG143940A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
SG200307671-8A 2003-12-19 2003-12-19 Process for depositing composite coating on a surface SG143940A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200307671-8A SG143940A1 (en) 2003-12-19 2003-12-19 Process for depositing composite coating on a surface
US11/016,117 US20050136656A1 (en) 2003-12-19 2004-12-17 Process for depositing composite coating on a surface
JP2004367997A JP2005248322A (ja) 2003-12-19 2004-12-20 表面上への複合コーティングの蒸着プロセス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200307671-8A SG143940A1 (en) 2003-12-19 2003-12-19 Process for depositing composite coating on a surface

Publications (1)

Publication Number Publication Date
SG143940A1 true SG143940A1 (en) 2008-07-29

Family

ID=34676098

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200307671-8A SG143940A1 (en) 2003-12-19 2003-12-19 Process for depositing composite coating on a surface

Country Status (3)

Country Link
US (1) US20050136656A1 (ja)
JP (1) JP2005248322A (ja)
SG (1) SG143940A1 (ja)

Families Citing this family (22)

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Publication number Priority date Publication date Assignee Title
JP4931939B2 (ja) * 2006-03-09 2012-05-16 アプライド マテリアルズ インコーポレイテッド 半導体デバイスを形成する方法
US7678710B2 (en) * 2006-03-09 2010-03-16 Applied Materials, Inc. Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
US7645710B2 (en) 2006-03-09 2010-01-12 Applied Materials, Inc. Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
KR101216199B1 (ko) * 2006-03-09 2012-12-27 어플라이드 머티어리얼스, 인코포레이티드 낮은 에너지 플라즈마 시스템을 이용하여 하이 유전상수 트랜지스터 게이트를 제조하기 위한 방법 및 장치
US7837838B2 (en) 2006-03-09 2010-11-23 Applied Materials, Inc. Method of fabricating a high dielectric constant transistor gate using a low energy plasma apparatus
US20070209930A1 (en) * 2006-03-09 2007-09-13 Applied Materials, Inc. Apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
US20080100915A1 (en) * 2006-10-27 2008-05-01 Kuohua Wu Removal of oxidation layer from metal substrate and deposition of titanium adhesion layer on metal substrate
DE102007027335A1 (de) * 2007-06-14 2008-12-18 Mtu Aero Engines Gmbh Verschleißschutzbeschichtung und Bauteil mit einer Verschleißschutzbeschichtung
US7966909B2 (en) * 2007-07-25 2011-06-28 The Gillette Company Process of forming a razor blade
US8980066B2 (en) * 2008-03-14 2015-03-17 Applied Materials, Inc. Thin film metal oxynitride semiconductors
US7846824B2 (en) * 2008-03-18 2010-12-07 Applied Materials, Inc. Methods for forming a titanium nitride layer
JP5234925B2 (ja) * 2008-04-03 2013-07-10 株式会社神戸製鋼所 硬質皮膜およびその形成方法ならびに硬質皮膜被覆部材
TWI365562B (en) 2008-10-03 2012-06-01 Ind Tech Res Inst Positive electrode and method for manufacturing the same and lithium battery utilizing the same
CN101746083A (zh) * 2008-12-17 2010-06-23 鸿富锦精密工业（深圳）有限公司 具有多层膜结构的基板
US9341923B2 (en) * 2011-09-14 2016-05-17 Nikon Corporation Composite plastic member and method for producing the same
CN105112874B (zh) * 2015-09-24 2018-06-22 无锡市中捷减震器有限公司 磁控溅射微纳米膜的方法
US10927449B2 (en) 2017-01-25 2021-02-23 Applied Materials, Inc. Extension of PVD chamber with multiple reaction gases, high bias power, and high power impulse source for deposition, implantation, and treatment
CN109526193B (zh) * 2018-11-07 2020-07-28 深圳科诺桥科技股份有限公司 电磁波屏蔽膜及其制备方法
CN112962066A (zh) * 2021-02-04 2021-06-15 中国科学院兰州化学物理研究所 一种氧化铬宽温域自润滑自修复涂层的制备方法
CN114086123B (zh) * 2021-11-23 2023-07-25 吉林大学 一种超耐磨宽带吸收涂层及其制备方法
CN114632909B (zh) * 2022-01-17 2024-04-30 温州瑞明工业股份有限公司 一种压铸模具表面离子注入制备碳氧氮涂层的方法
CN115287587A (zh) * 2022-07-21 2022-11-04 厦门建霖健康家居股份有限公司 一种在塑料基材上镀拉丝膜的方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5830330A (en) * 1997-05-22 1998-11-03 Tokyo Electron Limited Method and apparatus for low pressure sputtering
US6365009B1 (en) * 1997-06-17 2002-04-02 Anelva Corporation Combined RF-DC magnetron sputtering method
WO2003097892A2 (en) * 2002-05-17 2003-11-27 Applied Films Corporation System and apparatus for control of sputter deposition process

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US3649502A (en) * 1969-08-14 1972-03-14 Precision Instr Co Apparatus for supported discharge sputter-coating of a substrate
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
US5338422A (en) * 1992-09-29 1994-08-16 The Boc Group, Inc. Device and method for depositing metal oxide films
US5789071A (en) * 1992-11-09 1998-08-04 Northwestern University Multilayer oxide coatings
JP3064769B2 (ja) * 1992-11-21 2000-07-12 アルバック成膜株式会社 位相シフトマスクおよびその製造方法ならびにその位相シフトマスクを用いた露光方法
US6117495A (en) * 1993-09-01 2000-09-12 Polymerit Method for forming a mold-release coating
US6309916B1 (en) * 1999-11-17 2001-10-30 Amkor Technology, Inc Method of molding plastic semiconductor packages
ITRM20010060A1 (it) * 2001-02-06 2001-05-07 Carlo Misiano Perfezionamento di un metodo e apparato per la deposizione di film sottili, soprattutto in condizioni reattive.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5830330A (en) * 1997-05-22 1998-11-03 Tokyo Electron Limited Method and apparatus for low pressure sputtering
US6365009B1 (en) * 1997-06-17 2002-04-02 Anelva Corporation Combined RF-DC magnetron sputtering method
WO2003097892A2 (en) * 2002-05-17 2003-11-27 Applied Films Corporation System and apparatus for control of sputter deposition process

Also Published As

Publication number Publication date
US20050136656A1 (en) 2005-06-23
JP2005248322A (ja) 2005-09-15

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