SG11202101302TA - Sputtering target, magnetic film, and perpendicular magnetic recording medium - Google Patents
Sputtering target, magnetic film, and perpendicular magnetic recording mediumInfo
- Publication number
- SG11202101302TA SG11202101302TA SG11202101302TA SG11202101302TA SG11202101302TA SG 11202101302T A SG11202101302T A SG 11202101302TA SG 11202101302T A SG11202101302T A SG 11202101302TA SG 11202101302T A SG11202101302T A SG 11202101302TA SG 11202101302T A SG11202101302T A SG 11202101302TA
- Authority
- SG
- Singapore
- Prior art keywords
- recording medium
- sputtering target
- magnetic recording
- magnetic film
- perpendicular magnetic
- Prior art date
Links
- 238000005477 sputtering target Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
- G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
- G11B5/656—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing Co
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
- G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
- G11B5/658—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing oxygen, e.g. molecular oxygen or magnetic oxide
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/68—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent
- G11B5/70—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent on a base layer
- G11B5/706—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent on a base layer characterised by the composition of the magnetic material
- G11B5/70605—Record carriers characterised by the selection of the material comprising one or more layers of magnetisable material homogeneously mixed with a bonding agent on a base layer characterised by the composition of the magnetic material metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/10—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/405—Iron group metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/408—Noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018150675 | 2018-08-09 | ||
PCT/JP2019/020556 WO2020031460A1 (fr) | 2018-08-09 | 2019-05-23 | Cible de pulvérisation, film magnétique et support d'enregistrement magnétique perpendiculaire |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202101302TA true SG11202101302TA (en) | 2021-03-30 |
Family
ID=69414607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202101302TA SG11202101302TA (en) | 2018-08-09 | 2019-05-23 | Sputtering target, magnetic film, and perpendicular magnetic recording medium |
Country Status (6)
Country | Link |
---|---|
US (2) | US11618944B2 (fr) |
JP (1) | JP7076555B2 (fr) |
CN (1) | CN112585295B (fr) |
SG (1) | SG11202101302TA (fr) |
TW (1) | TWI780331B (fr) |
WO (1) | WO2020031460A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI727322B (zh) * | 2018-08-09 | 2021-05-11 | 日商Jx金屬股份有限公司 | 濺鍍靶及磁性膜 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60228637A (ja) * | 1984-04-25 | 1985-11-13 | Toshiba Corp | 磁気記録媒体用Co基合金 |
JP3259844B2 (ja) * | 1990-03-27 | 2002-02-25 | 株式会社豊田中央研究所 | 異方性ナノ複合材料およびその製造方法 |
JPH04218906A (ja) * | 1990-03-29 | 1992-08-10 | Mitsui Petrochem Ind Ltd | 光磁気記録媒体 |
JPH05275233A (ja) * | 1992-03-30 | 1993-10-22 | Toshiba Corp | 軟磁性薄膜 |
JP2001256631A (ja) * | 2000-01-05 | 2001-09-21 | Naruse Atsushi | 磁気記録媒体およびその製造方法 |
JP2002358616A (ja) * | 2000-06-12 | 2002-12-13 | Toshiba Corp | 磁気記録媒体および磁気記録装置 |
JP4221484B2 (ja) * | 2003-09-09 | 2009-02-12 | Dowaエレクトロニクス株式会社 | 金属磁性粉末およびその製造法 |
JP2006155861A (ja) * | 2004-10-29 | 2006-06-15 | Showa Denko Kk | 垂直磁気記録媒体及びその製造方法並びに磁気記録再生装置 |
KR101494250B1 (ko) | 2006-08-21 | 2015-02-17 | 인터디지탈 테크날러지 코포레이션 | Lte에서의 가변 데이터율 서비스를 위한 동적 자원 할당, 스케쥴링 및 시그널링 |
JP2009087501A (ja) * | 2007-10-03 | 2009-04-23 | Showa Denko Kk | 垂直磁気記録媒体および磁気記録再生装置 |
JP2011081873A (ja) | 2009-10-07 | 2011-04-21 | Ulvac Japan Ltd | 垂直磁気記録媒体用記録層、垂直磁気記録媒体、及び強磁性金属膜の作製方法 |
JP2011174174A (ja) | 2010-01-26 | 2011-09-08 | Mitsubishi Materials Corp | 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法 |
JP2011175725A (ja) | 2010-01-26 | 2011-09-08 | Mitsubishi Materials Corp | 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法 |
JP5375707B2 (ja) | 2010-03-28 | 2013-12-25 | 三菱マテリアル株式会社 | 磁気記録膜形成用スパッタリングターゲットおよびその製造方法 |
CN103038388B (zh) | 2010-09-03 | 2015-04-01 | 吉坤日矿日石金属株式会社 | 强磁性材料溅射靶 |
JP2012117147A (ja) | 2010-11-12 | 2012-06-21 | Jx Nippon Mining & Metals Corp | コバルト酸化物が残留したスパッタリングターゲット |
MY156203A (en) | 2010-12-22 | 2016-01-29 | Jx Nippon Mining & Metals Corp | Sintered compact sputtering target |
WO2014141737A1 (fr) * | 2013-03-12 | 2014-09-18 | Jx日鉱日石金属株式会社 | Cible de pulvérisation |
CN105934532B (zh) | 2013-10-29 | 2019-09-20 | 田中贵金属工业株式会社 | 磁控溅射用靶 |
JP6260517B2 (ja) * | 2014-11-20 | 2018-01-17 | 富士電機株式会社 | 磁気記録媒体およびその製造方法 |
JP6284126B2 (ja) * | 2014-12-15 | 2018-02-28 | 昭和電工株式会社 | 垂直記録媒体、垂直記録再生装置 |
JP6042520B1 (ja) * | 2015-11-05 | 2016-12-14 | デクセリアルズ株式会社 | Mn−Zn−O系スパッタリングターゲット及びその製造方法 |
CN109923610B (zh) * | 2016-11-01 | 2021-01-29 | 田中贵金属工业株式会社 | 磁记录介质用溅射靶 |
-
2019
- 2019-05-23 CN CN201980054069.3A patent/CN112585295B/zh active Active
- 2019-05-23 WO PCT/JP2019/020556 patent/WO2020031460A1/fr active Application Filing
- 2019-05-23 US US17/266,896 patent/US11618944B2/en active Active
- 2019-05-23 JP JP2020536336A patent/JP7076555B2/ja active Active
- 2019-05-23 SG SG11202101302TA patent/SG11202101302TA/en unknown
- 2019-05-24 TW TW108118104A patent/TWI780331B/zh active
-
2023
- 2023-03-02 US US18/177,244 patent/US11939663B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW202009311A (zh) | 2020-03-01 |
US20210310114A1 (en) | 2021-10-07 |
JPWO2020031460A1 (ja) | 2021-10-07 |
US11618944B2 (en) | 2023-04-04 |
US20230227964A1 (en) | 2023-07-20 |
US11939663B2 (en) | 2024-03-26 |
CN112585295B (zh) | 2023-04-04 |
CN112585295A (zh) | 2021-03-30 |
WO2020031460A1 (fr) | 2020-02-13 |
JP7076555B2 (ja) | 2022-05-27 |
TWI780331B (zh) | 2022-10-11 |
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