SG11202004215XA - Additive manufacturing technology (amt) low profile radiator - Google Patents
Additive manufacturing technology (amt) low profile radiatorInfo
- Publication number
- SG11202004215XA SG11202004215XA SG11202004215XA SG11202004215XA SG11202004215XA SG 11202004215X A SG11202004215X A SG 11202004215XA SG 11202004215X A SG11202004215X A SG 11202004215XA SG 11202004215X A SG11202004215X A SG 11202004215XA SG 11202004215X A SG11202004215X A SG 11202004215XA
- Authority
- SG
- Singapore
- Prior art keywords
- amt
- additive manufacturing
- manufacturing technology
- low profile
- profile radiator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/106—Microstrip slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/001—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems for modifying the directional characteristic of an aerial
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762584264P | 2017-11-10 | 2017-11-10 | |
US201762584300P | 2017-11-10 | 2017-11-10 | |
PCT/US2018/059240 WO2019094337A1 (en) | 2017-11-10 | 2018-11-05 | Additive manufacturing technology (amt) low profile radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004215XA true SG11202004215XA (en) | 2020-06-29 |
Family
ID=64572477
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004215XA SG11202004215XA (en) | 2017-11-10 | 2018-11-05 | Additive manufacturing technology (amt) low profile radiator |
SG11202004211WA SG11202004211WA (en) | 2017-11-10 | 2018-11-07 | Low profile phased array |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004211WA SG11202004211WA (en) | 2017-11-10 | 2018-11-07 | Low profile phased array |
Country Status (7)
Country | Link |
---|---|
US (3) | US11121474B2 (zh) |
EP (3) | EP4235951A3 (zh) |
JP (3) | JP6976433B2 (zh) |
KR (2) | KR102545915B1 (zh) |
CN (2) | CN111602299B (zh) |
SG (2) | SG11202004215XA (zh) |
WO (2) | WO2019094337A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10707549B2 (en) * | 2018-04-10 | 2020-07-07 | The Boeing Company | Microstrip to waveguide transition systems and methods |
CN111697315B (zh) * | 2019-03-15 | 2022-04-12 | 华为技术有限公司 | 一种可折叠终端设备 |
KR102176235B1 (ko) * | 2019-03-28 | 2020-11-09 | 코나엠 주식회사 | 양방향 통신이 가능한 메탈 카드 및 메탈 카드 제조 방법 |
US11145977B2 (en) * | 2019-06-14 | 2021-10-12 | Raytheon Company | Interlocking modular beamformer |
US11145952B2 (en) | 2019-11-14 | 2021-10-12 | Raytheon Company | Advanced communications array |
KR102305663B1 (ko) * | 2020-09-04 | 2021-09-28 | 주식회사 넥스웨이브 | 트렌치 구조를 이용한 안테나 패키지 및 이의 검사방법 |
CN113571902B (zh) * | 2021-09-26 | 2021-12-17 | 四川安迪科技实业有限公司 | 基于双频漏波结构的相控阵天线 |
Family Cites Families (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4647878A (en) | 1984-11-14 | 1987-03-03 | Itt Corporation | Coaxial shielded directional microwave coupler |
JPH0812887B2 (ja) | 1985-04-13 | 1996-02-07 | 富士通株式会社 | 高速集積回路パツケ−ジ |
JP3241139B2 (ja) | 1993-02-04 | 2001-12-25 | 三菱電機株式会社 | フィルムキャリア信号伝送線路 |
US5401175A (en) | 1993-06-25 | 1995-03-28 | M/A-Com, Inc. | Magnetic coaxial connector |
JP2605653B2 (ja) | 1995-02-28 | 1997-04-30 | 日本電気株式会社 | プリント基板間の同軸線路接続構造 |
JP4195731B2 (ja) | 1996-07-25 | 2008-12-10 | 富士通株式会社 | 多層プリント板及びこれを利用した高周波回路装置 |
US5857858A (en) | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
JPH10200311A (ja) | 1997-01-14 | 1998-07-31 | Nec Corp | 裏面接地導体付きコプレーナウエーブガイド線路 |
JP3687041B2 (ja) | 1997-04-16 | 2005-08-24 | 大日本印刷株式会社 | 配線基板、配線基板の製造方法、および半導体パッケージ |
US6000120A (en) | 1998-04-16 | 1999-12-14 | Motorola, Inc. | Method of making coaxial transmission lines on a printed circuit board |
US6137453A (en) | 1998-11-19 | 2000-10-24 | Wang Electro-Opto Corporation | Broadband miniaturized slow-wave antenna |
SE9904256D0 (sv) * | 1999-02-10 | 1999-11-24 | Allgon Ab | An antenna device and a radio communication device including an antenna device |
JP3282608B2 (ja) | 1999-03-23 | 2002-05-20 | 日本電気株式会社 | 多層基板 |
JP3710652B2 (ja) | 1999-08-03 | 2005-10-26 | 三菱電機株式会社 | ストリップライン給電装置 |
US6614325B1 (en) | 2000-08-31 | 2003-09-02 | Northrop Grumman Corporation | RF/IF signal distribution network utilizing broadside coupled stripline |
JP3487283B2 (ja) | 2000-10-31 | 2004-01-13 | 三菱電機株式会社 | 差動ストリップ線路垂直変換器および光モジュール |
KR100461768B1 (ko) * | 2000-11-28 | 2004-12-14 | 주식회사 마이크로페이스 | 아이엠티2000용 마이크로스트립 패치 어레이 안테나 |
US6651322B1 (en) | 2000-12-28 | 2003-11-25 | Unisys Corporation | Method of reworking a multilayer printed circuit board assembly |
JP2002271133A (ja) * | 2001-03-09 | 2002-09-20 | Sharp Corp | 高周波アンテナおよび高周波通信装置 |
US6429819B1 (en) * | 2001-04-06 | 2002-08-06 | Tyco Electronics Logistics Ag | Dual band patch bowtie slot antenna structure |
US6421018B1 (en) * | 2001-05-31 | 2002-07-16 | Andrew Corporation | Bowtie inductive coupler |
US7183995B2 (en) * | 2001-08-16 | 2007-02-27 | Raytheon Company | Antenna configurations for reduced radar complexity |
US6762729B2 (en) * | 2001-09-03 | 2004-07-13 | Houkou Electric Co., Ltd. | Slotted bow tie antenna with parasitic element, and slotted bow tie array antenna with parasitic element |
US6624787B2 (en) | 2001-10-01 | 2003-09-23 | Raytheon Company | Slot coupled, polarized, egg-crate radiator |
US6747217B1 (en) | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
US20030188889A1 (en) | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
JP4159378B2 (ja) | 2002-04-25 | 2008-10-01 | 三菱電機株式会社 | 高周波装置とその製造方法 |
JP2004087656A (ja) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | プリント配線板の製造方法 |
JP4059085B2 (ja) | 2003-01-14 | 2008-03-12 | 松下電器産業株式会社 | 高周波積層部品およびその製造方法 |
DE10309075A1 (de) | 2003-03-03 | 2004-09-16 | Robert Bosch Gmbh | Planare Antennenanordnung |
JP4054270B2 (ja) * | 2003-03-24 | 2008-02-27 | 峰光電子株式会社 | デュアルバンドスロットボウタイアンテナ、及び、その構成方法 |
US6937120B2 (en) | 2003-04-02 | 2005-08-30 | Harris Corporation | Conductor-within-a-via microwave launch |
US6891446B2 (en) | 2003-04-29 | 2005-05-10 | Raytheon Company | Compact broadband balun |
KR100574014B1 (ko) * | 2003-09-30 | 2006-04-26 | (주)에이스톤테크놀로지 | 광대역 슬롯 배열 안테나 |
JP2005236672A (ja) * | 2004-02-19 | 2005-09-02 | National Institute Of Information & Communication Technology | ボータイ型スロットアンテナ |
FI118748B (fi) * | 2004-06-28 | 2008-02-29 | Pulse Finland Oy | Pala-antenni |
US7315223B2 (en) | 2004-06-30 | 2008-01-01 | Emag Technologies, Inc. | Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias |
US7893886B2 (en) * | 2004-08-10 | 2011-02-22 | Spx Corporation | Circularly polarized broadcast panel system and method using a parasitic dipole |
US20060044083A1 (en) | 2004-08-27 | 2006-03-02 | Maksim Kuzmenka | Circuit board and method for producing a circuit board |
US8514031B2 (en) * | 2004-12-17 | 2013-08-20 | Ems Technologies, Inc. | Integrated circulators sharing a continuous circuit |
US7301422B2 (en) | 2005-06-02 | 2007-11-27 | Andrew Corporation | Variable differential phase shifter having a divider wiper arm |
US7388550B2 (en) * | 2005-10-11 | 2008-06-17 | Tdk Corporation | PxM antenna with improved radiation characteristics over a broad frequency range |
JP4498258B2 (ja) | 2005-10-13 | 2010-07-07 | 富士通オプティカルコンポーネンツ株式会社 | コイルパッケージ |
US7405477B1 (en) | 2005-12-01 | 2008-07-29 | Altera Corporation | Ball grid array package-to-board interconnect co-design apparatus |
JP2007193999A (ja) | 2006-01-17 | 2007-08-02 | Sony Chemical & Information Device Corp | 伝送ケーブル |
US7372409B2 (en) * | 2006-02-21 | 2008-05-13 | Harris Corporation | Slit loaded tapered slot patch antenna |
JP4363409B2 (ja) * | 2006-03-06 | 2009-11-11 | 三菱電機株式会社 | Rfidタグ及びその製造方法 |
US9172145B2 (en) | 2006-09-21 | 2015-10-27 | Raytheon Company | Transmit/receive daughter card with integral circulator |
US7671696B1 (en) | 2006-09-21 | 2010-03-02 | Raytheon Company | Radio frequency interconnect circuits and techniques |
US7532163B2 (en) * | 2007-02-13 | 2009-05-12 | Raytheon Company | Conformal electronically scanned phased array antenna and communication system for helmets and other platforms |
DE102007028799A1 (de) | 2007-06-19 | 2008-12-24 | Technische Universität Ilmenau | Impedanzkontrolliertes koplanares Wellenleitersystem zur dreidimensionalen Verteilung von Signalen hoher Bandbreite |
KR100850217B1 (ko) | 2007-07-05 | 2008-08-04 | 삼성전자주식회사 | 임피던스 매칭된 분기 스트립 전송라인을 갖는 프린트배선기판 |
JP5397225B2 (ja) | 2007-10-25 | 2014-01-22 | 日本電気株式会社 | 高周波基板および、これを用いた高周波モジュール |
US20090295500A1 (en) | 2008-05-30 | 2009-12-03 | Ives Fred H | Radio frequency power splitter/combiner, and method of making same |
KR100999529B1 (ko) | 2008-09-04 | 2010-12-08 | 삼성전기주식회사 | 마이크로 스트립 라인을 구비한 인쇄회로기판, 스트립라인을 구비한 인쇄회로기판 및 그들의 제조 방법 |
US8134086B2 (en) | 2009-02-17 | 2012-03-13 | Lockheed Martin Corporation | Electrical isolating structure for conductors in a substrate |
KR101119267B1 (ko) | 2010-04-13 | 2012-03-16 | 고려대학교 산학협력단 | 매칭 기판을 이용한 유전체 공진기 안테나 |
CN201845850U (zh) | 2010-09-30 | 2011-05-25 | 安徽博微长安电子有限公司 | 多路微波大功率分配合成器 |
CN102088133A (zh) * | 2010-12-13 | 2011-06-08 | 上海大学 | 金属吊顶环境下室内覆盖平面天线 |
US8773323B1 (en) * | 2011-03-18 | 2014-07-08 | The Boeing Company | Multi-band antenna element with integral faraday cage for phased arrays |
US8749446B2 (en) * | 2011-07-29 | 2014-06-10 | The Boeing Company | Wide-band linked-ring antenna element for phased arrays |
JP5864203B2 (ja) | 2011-10-20 | 2016-02-17 | 荻野工業株式会社 | 可変動弁機構 |
US20130154773A1 (en) | 2011-12-15 | 2013-06-20 | Infineon Technologies Ag | Waveguide |
WO2013124886A1 (ja) * | 2012-02-21 | 2013-08-29 | 三菱電機株式会社 | 部分放電センサー |
JP2013187731A (ja) * | 2012-03-08 | 2013-09-19 | Mitsubishi Electric Corp | アンテナ装置 |
EP2757635A1 (en) * | 2013-01-17 | 2014-07-23 | CMC Electronics Inc. | Low profile antenna |
KR101585598B1 (ko) * | 2013-02-18 | 2016-01-14 | 대산전자(주) | 안테나 모듈의 제조 방법, 그리고 사출 성형물 속에 안테나 방사체가 내장된 전자기기용 내장형 안테나의 제조방법 |
US9130252B2 (en) | 2013-02-26 | 2015-09-08 | Raytheon Company | Symmetric baluns and isolation techniques |
KR20160010469A (ko) | 2013-04-24 | 2016-01-27 | 가부시키가이샤 쇼난 고세이쥬시 세이사쿠쇼 | 신호 전송용 플랫 케이블 |
KR101393280B1 (ko) * | 2013-05-08 | 2014-05-09 | 주식회사 에이스테크놀로지 | 이중대역 패치 안테나 |
US9374910B2 (en) | 2013-12-31 | 2016-06-21 | International Business Machines Corporation | Printed circuit board copper plane repair |
CN103779654B (zh) * | 2014-01-14 | 2016-02-03 | 西安电子科技大学 | 一种采用自相似馈电技术的双频宽带领结天线 |
JP2015185550A (ja) | 2014-03-20 | 2015-10-22 | 三菱電機株式会社 | 多層高周波基板、アンテナ装置 |
US10033080B2 (en) | 2014-05-07 | 2018-07-24 | Alcatel Lucent | Electrochromic cell for radio-frequency applications |
US10086432B2 (en) | 2014-12-10 | 2018-10-02 | Washington State University | Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces |
JP6493788B2 (ja) | 2015-02-24 | 2019-04-03 | 日立金属株式会社 | アンテナ装置 |
US9893426B2 (en) | 2015-10-26 | 2018-02-13 | Verizon Patent And Licensing Inc. | PCB embedded radiator antenna with exposed tuning stub |
US10144635B2 (en) | 2016-09-20 | 2018-12-04 | Kris Vossough | Integrated multi-sensing systems |
WO2017111956A1 (en) | 2015-12-22 | 2017-06-29 | Intel Corporation | Semiconductor package with electromagnetic interference shielding |
CN106936521B (zh) | 2017-01-12 | 2020-04-28 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 紧凑型天线馈电校准网络 |
US10505255B2 (en) | 2017-01-30 | 2019-12-10 | Infineon Technologies Ag | Radio frequency device packages and methods of formation thereof |
CN107240767A (zh) * | 2017-03-29 | 2017-10-10 | 深圳市科卫泰实业发展有限公司 | 一种小平板天线 |
CN206742473U (zh) | 2017-05-31 | 2017-12-12 | 中国电子科技集团公司第十三研究所 | 抗电磁干扰的微波功率分配器 |
US10813210B2 (en) | 2017-11-10 | 2020-10-20 | Raytheon Company | Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion |
CN111788737B (zh) | 2017-11-10 | 2022-11-15 | 雷神公司 | 毫米波传输线架构 |
AU2019228500B2 (en) | 2018-02-28 | 2023-07-20 | Raytheon Company | Snap-RF interconnections |
WO2019226635A1 (en) | 2018-05-22 | 2019-11-28 | Raytheon Company | Millimeter wave phased array |
-
2018
- 2018-11-05 CN CN201880072294.5A patent/CN111602299B/zh active Active
- 2018-11-05 WO PCT/US2018/059240 patent/WO2019094337A1/en unknown
- 2018-11-05 KR KR1020207016337A patent/KR102545915B1/ko active IP Right Grant
- 2018-11-05 SG SG11202004215XA patent/SG11202004215XA/en unknown
- 2018-11-05 US US16/180,936 patent/US11121474B2/en active Active
- 2018-11-05 EP EP23174882.3A patent/EP4235951A3/en active Pending
- 2018-11-05 EP EP18812445.7A patent/EP3707777B1/en active Active
- 2018-11-05 JP JP2020525916A patent/JP6976433B2/ja active Active
- 2018-11-07 WO PCT/US2018/059602 patent/WO2019094452A1/en unknown
- 2018-11-07 CN CN201880072787.9A patent/CN111566874B/zh active Active
- 2018-11-07 JP JP2020526003A patent/JP7014907B2/ja active Active
- 2018-11-07 SG SG11202004211WA patent/SG11202004211WA/en unknown
- 2018-11-07 EP EP18836682.7A patent/EP3707778B1/en active Active
- 2018-11-07 US US16/183,116 patent/US11158955B2/en active Active
- 2018-11-07 KR KR1020207016415A patent/KR102332713B1/ko active IP Right Grant
-
2021
- 2021-10-26 US US17/511,153 patent/US12021306B2/en active Active
-
2022
- 2022-01-20 JP JP2022007004A patent/JP7365436B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7014907B2 (ja) | 2022-02-01 |
US12021306B2 (en) | 2024-06-25 |
JP2021502768A (ja) | 2021-01-28 |
EP3707778A1 (en) | 2020-09-16 |
WO2019094337A8 (en) | 2020-05-28 |
SG11202004211WA (en) | 2020-06-29 |
CN111566874A (zh) | 2020-08-21 |
EP3707777B1 (en) | 2023-05-24 |
JP6976433B2 (ja) | 2021-12-08 |
CN111602299B (zh) | 2023-04-14 |
WO2019094337A1 (en) | 2019-05-16 |
CN111602299A (zh) | 2020-08-28 |
KR20200079320A (ko) | 2020-07-02 |
JP2022058679A (ja) | 2022-04-12 |
JP7365436B2 (ja) | 2023-10-19 |
EP3707777A1 (en) | 2020-09-16 |
US11158955B2 (en) | 2021-10-26 |
US11121474B2 (en) | 2021-09-14 |
KR102332713B1 (ko) | 2021-12-02 |
JP2021502763A (ja) | 2021-01-28 |
US20190148837A1 (en) | 2019-05-16 |
EP3707778B1 (en) | 2023-07-19 |
KR20200076745A (ko) | 2020-06-29 |
EP4235951A3 (en) | 2023-09-06 |
EP4235951A2 (en) | 2023-08-30 |
WO2019094452A1 (en) | 2019-05-16 |
KR102545915B1 (ko) | 2023-06-22 |
US20190148828A1 (en) | 2019-05-16 |
CN111566874B (zh) | 2023-06-27 |
US20220052460A1 (en) | 2022-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3573817A4 (en) | SYSTEM FOR GENERATIVE MANUFACTURING | |
EP3325253A4 (en) | GENERATIVE MANUFACTURING WITH COOLANT SYSTEM | |
SG11202004215XA (en) | Additive manufacturing technology (amt) low profile radiator | |
GB201907373D0 (en) | Additive manufacturing | |
GB201614505D0 (en) | Additive manufacturing | |
GB2566805B (en) | Component produced by additive manufacturing | |
EP3551458C0 (en) | ADDITIVE MANUFACTURING | |
EP3487681A4 (en) | GENERATIVE MANUFACTURING | |
GB201713737D0 (en) | Additive manufacture system | |
GB201508289D0 (en) | Additive manufacturing | |
EP3668702A4 (en) | ADDITIVE MANUFACTURING TEMPERATURE | |
EP3558643A4 (en) | GENERATIVE MANUFACTURING | |
EP3397399A4 (en) | METHOD FOR CONTINUOUS GENERATIVE MANUFACTURING | |
GB201614503D0 (en) | Additive manufacturing | |
IL266475A (en) | Production in 3D technology | |
GB201513415D0 (en) | Finned coaxial cooler | |
GB2579276B (en) | Additive manufacturing | |
GB201604662D0 (en) | Additive manufacturing | |
GB2577772B (en) | Additive Manufacturing | |
EP3554796A4 (en) | GENERATIVE MANUFACTURING | |
GB2548672B (en) | Additive manufacturing method | |
GB201818385D0 (en) | Additive manufacturing | |
GB201703238D0 (en) | Additive manufacturing | |
GB201608360D0 (en) | Additive manufacturing systems | |
EP3245041A4 (en) | Additive manufacturing |