SE0002619L - Förfarande, anordning och användning - Google Patents
Förfarande, anordning och användningInfo
- Publication number
- SE0002619L SE0002619L SE0002619A SE0002619A SE0002619L SE 0002619 L SE0002619 L SE 0002619L SE 0002619 A SE0002619 A SE 0002619A SE 0002619 A SE0002619 A SE 0002619A SE 0002619 L SE0002619 L SE 0002619L
- Authority
- SE
- Sweden
- Prior art keywords
- jetting
- add
- substrate
- viscous medium
- predetermined
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ink Jet (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
EP01950142A EP1314342B1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
PCT/SE2001/001567 WO2002005608A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
JP2002508879A JP5198709B2 (ja) | 2000-07-11 | 2001-07-06 | 粘性媒体を基板に塗布する方法、装置および使用 |
DE60135467T DE60135467D1 (de) | 2000-07-11 | 2001-07-06 | Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat |
AT01950142T ATE406085T1 (de) | 2000-07-11 | 2001-07-06 | Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat |
AU2001271170A AU2001271170A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
US09/901,592 US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
US11/502,477 US7600548B2 (en) | 2000-07-11 | 2006-08-11 | Method and apparatus for applying viscous medium onto a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0002619D0 SE0002619D0 (sv) | 2000-07-11 |
SE0002619L true SE0002619L (sv) | 2002-03-08 |
SE518640C2 SE518640C2 (sv) | 2002-11-05 |
Family
ID=20280455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
Country Status (8)
Country | Link |
---|---|
US (2) | US7757391B2 (sv) |
EP (1) | EP1314342B1 (sv) |
JP (1) | JP5198709B2 (sv) |
AT (1) | ATE406085T1 (sv) |
AU (1) | AU2001271170A1 (sv) |
DE (1) | DE60135467D1 (sv) |
SE (1) | SE518640C2 (sv) |
WO (1) | WO2002005608A1 (sv) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE518642C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
JP4618085B2 (ja) * | 2005-09-30 | 2011-01-26 | 株式会社日立プラントテクノロジー | はんだペースト印刷システム |
CN101356425B (zh) | 2005-11-14 | 2011-01-26 | 麦德塔自动化股份有限公司 | 喷射装置和改善喷射装置性能的方法 |
JP4869776B2 (ja) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | 印刷検査装置及び印刷装置 |
US7823762B2 (en) * | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
KR100807090B1 (ko) * | 2007-03-28 | 2008-02-26 | 에스엔유 프리시젼 주식회사 | 기판 지지장치와 이를 이용한 엘씨디 셀의 씰패턴 검사장치 |
DE102009053575B4 (de) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste |
US9398697B2 (en) | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
JP6359541B2 (ja) * | 2013-08-07 | 2018-07-18 | 株式会社Fuji | 電子部品装着機、および転写確認方法 |
JP6155468B2 (ja) * | 2013-12-06 | 2017-07-05 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
JP2015109397A (ja) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
DE102014202170A1 (de) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Vorrichtung und Verfahren zum Bedrucken von Substraten |
US11076490B2 (en) | 2014-09-09 | 2021-07-27 | Mycronic AB | Method and device for applying solder paste flux |
JP6681397B2 (ja) * | 2014-11-20 | 2020-04-15 | コー・ヤング・テクノロジー・インコーポレーテッド | 検査装置及びそれを有する部品実装システム |
DE102016116201B4 (de) * | 2016-08-31 | 2018-06-21 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker |
US11544836B2 (en) * | 2021-03-18 | 2023-01-03 | Inventec (Pudong) Technology Corporation | Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof |
Family Cites Families (51)
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US3580462A (en) * | 1967-12-14 | 1971-05-25 | Louis Vanyi | Soldering apparatus |
GB1270926A (en) * | 1968-04-05 | 1972-04-19 | Johnson Matthey Co Ltd | Improvements in and relating to a method of making metal articles |
US3738760A (en) * | 1971-10-13 | 1973-06-12 | Plastic Kote Co | Paint touch-up container |
US3962487A (en) * | 1975-02-03 | 1976-06-08 | Texas Instruments Incorporated | Method of making ceramic semiconductor elements with ohmic contact surfaces |
US4239827A (en) * | 1979-01-15 | 1980-12-16 | Union Carbide Corporation | Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate |
FR2552345B1 (fr) * | 1983-09-27 | 1985-12-20 | Sames Sa | Appareillage de peinture electrostatique a pulverisateur pneumatique sur support mobile, reglable en fonctionnement |
JPH07109935B2 (ja) | 1989-01-27 | 1995-11-22 | オムロン株式会社 | 半田不良の自動修正方法およびその装置 |
SE465713B (sv) * | 1990-02-12 | 1991-10-21 | Mydata Automation Ab | Anordning foer att utlaegga pastor och lim |
JPH03297102A (ja) * | 1990-04-17 | 1991-12-27 | Cmk Corp | プリント配線板におけるカーボン抵抗体の形成方法 |
JPH04239797A (ja) | 1991-01-23 | 1992-08-27 | Sharp Corp | スクリーン印刷装置 |
US5097516A (en) * | 1991-02-28 | 1992-03-17 | At&T Bell Laboratories | Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging |
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
US5108024A (en) * | 1991-06-03 | 1992-04-28 | Motorola, Inc. | Method of inspecting solder joints |
US5159171A (en) * | 1991-09-03 | 1992-10-27 | Motorola, Inc. | Method and apparatus for solder laser printing |
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JPH05183263A (ja) * | 1992-01-07 | 1993-07-23 | Matsushita Electric Ind Co Ltd | クリーム半田供給工法 |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
JPH06334321A (ja) * | 1993-05-20 | 1994-12-02 | Mitsubishi Electric Corp | クリームはんだの供給方法 |
JP3288128B2 (ja) * | 1993-05-21 | 2002-06-04 | 松下電器産業株式会社 | 印刷装置および印刷方法 |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
DE69322775T2 (de) * | 1993-08-12 | 1999-07-22 | International Business Machines Corp., Armonk, N.Y. | Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls |
JP3034438B2 (ja) * | 1994-03-31 | 2000-04-17 | キヤノン株式会社 | カラーフィルタの製造装置 |
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JP3241251B2 (ja) * | 1994-12-16 | 2001-12-25 | キヤノン株式会社 | 電子放出素子の製造方法及び電子源基板の製造方法 |
DE69629864T2 (de) * | 1995-04-03 | 2004-07-15 | Canon K.K. | Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes |
US6026176A (en) * | 1995-07-25 | 2000-02-15 | Cognex Corporation | Machine vision methods and articles of manufacture for ball grid array inspection |
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US5639010A (en) * | 1995-08-31 | 1997-06-17 | Ford Motor Company | Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices |
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JP3310540B2 (ja) * | 1996-05-22 | 2002-08-05 | 松下電器産業株式会社 | スクリーン印刷方法とその装置 |
JPH09326551A (ja) * | 1996-06-04 | 1997-12-16 | Mitsubishi Electric Corp | 半導体装置の製造方法及び半導体装置 |
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DE59711263D1 (de) * | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
SE513527C2 (sv) * | 1998-06-11 | 2000-09-25 | Mydata Automation Ab | Anordning och förfarande för utskjutning av små droppar |
JP2000156215A (ja) * | 1998-11-19 | 2000-06-06 | Mitsubishi Plastics Ind Ltd | シリコーン樹脂被覆金属複合体及びその製造方法 |
SE514859C2 (sv) | 1999-01-18 | 2001-05-07 | Mydata Automation Ab | Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa |
JP3403677B2 (ja) * | 1999-09-06 | 2003-05-06 | マイクロ・テック株式会社 | 半田ボール形成方法 |
US6271060B1 (en) * | 1999-09-13 | 2001-08-07 | Vishay Intertechnology, Inc. | Process of fabricating a chip scale surface mount package for semiconductor device |
US6541063B1 (en) * | 1999-11-04 | 2003-04-01 | Speedline Technologies, Inc. | Calibration of a dispensing system |
US6411545B1 (en) * | 1999-11-19 | 2002-06-25 | John Millard And Pamela Ann Caywood 1989 Revokable Living Trust | Non-volatile latch |
US6613240B2 (en) * | 1999-12-06 | 2003-09-02 | Epion Corporation | Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
JP3758463B2 (ja) * | 2000-05-09 | 2006-03-22 | 松下電器産業株式会社 | スクリーン印刷の検査方法 |
SE518642C2 (sv) * | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
-
2000
- 2000-07-11 SE SE0002619A patent/SE518640C2/sv unknown
-
2001
- 2001-07-06 EP EP01950142A patent/EP1314342B1/en not_active Expired - Lifetime
- 2001-07-06 AT AT01950142T patent/ATE406085T1/de not_active IP Right Cessation
- 2001-07-06 JP JP2002508879A patent/JP5198709B2/ja not_active Expired - Lifetime
- 2001-07-06 DE DE60135467T patent/DE60135467D1/de not_active Expired - Lifetime
- 2001-07-06 AU AU2001271170A patent/AU2001271170A1/en not_active Abandoned
- 2001-07-06 WO PCT/SE2001/001567 patent/WO2002005608A1/en active Application Filing
- 2001-07-11 US US09/901,592 patent/US7757391B2/en not_active Expired - Fee Related
-
2006
- 2006-08-11 US US11/502,477 patent/US7600548B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7757391B2 (en) | 2010-07-20 |
US20070137558A1 (en) | 2007-06-21 |
US7600548B2 (en) | 2009-10-13 |
AU2001271170A1 (en) | 2002-01-21 |
JP5198709B2 (ja) | 2013-05-15 |
SE518640C2 (sv) | 2002-11-05 |
SE0002619D0 (sv) | 2000-07-11 |
JP2004502539A (ja) | 2004-01-29 |
EP1314342B1 (en) | 2008-08-20 |
ATE406085T1 (de) | 2008-09-15 |
EP1314342A1 (en) | 2003-05-28 |
DE60135467D1 (de) | 2008-10-02 |
US20020015780A1 (en) | 2002-02-07 |
WO2002005608A1 (en) | 2002-01-17 |
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