PL3316320T3 - System urządzeń wykorzystujący fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED przez walcowanie tandemowe - Google Patents
System urządzeń wykorzystujący fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED przez walcowanie tandemoweInfo
- Publication number
- PL3316320T3 PL3316320T3 PL15901630T PL15901630T PL3316320T3 PL 3316320 T3 PL3316320 T3 PL 3316320T3 PL 15901630 T PL15901630 T PL 15901630T PL 15901630 T PL15901630 T PL 15901630T PL 3316320 T3 PL3316320 T3 PL 3316320T3
- Authority
- PL
- Poland
- Prior art keywords
- bond
- silicone resin
- equipment system
- organic silicone
- tandem rolling
- Prior art date
Links
- 238000005096 rolling process Methods 0.000 title 1
- 229920002050 silicone resin Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510508190.2A CN106469767B (zh) | 2015-08-18 | 2015-08-18 | 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备*** |
PCT/CN2015/097902 WO2017028428A1 (zh) | 2015-08-18 | 2015-12-18 | 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备*** |
EP15901630.2A EP3316320B1 (en) | 2015-08-18 | 2015-12-18 | Equipment system using organic silicone resin photoconverter to bond-package led by tandem rolling |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3316320T3 true PL3316320T3 (pl) | 2020-03-31 |
Family
ID=58050716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15901630T PL3316320T3 (pl) | 2015-08-18 | 2015-12-18 | System urządzeń wykorzystujący fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED przez walcowanie tandemowe |
Country Status (7)
Country | Link |
---|---|
US (1) | US10328679B2 (pl) |
EP (1) | EP3316320B1 (pl) |
JP (1) | JP6680808B2 (pl) |
KR (1) | KR102026843B1 (pl) |
CN (1) | CN106469767B (pl) |
PL (1) | PL3316320T3 (pl) |
WO (1) | WO2017028428A1 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106469767B (zh) | 2015-08-18 | 2017-12-01 | 江苏诚睿达光电有限公司 | 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备*** |
CN106469780B (zh) * | 2015-08-18 | 2018-02-13 | 江苏诚睿达光电有限公司 | 一种基于串联滚压的有机硅树脂光转换体贴合封装led的工艺方法 |
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JP2873842B2 (ja) * | 1989-12-07 | 1999-03-24 | 三菱レイヨン株式会社 | フイルム状熱硬化性樹脂の製造方法 |
JP2006316078A (ja) * | 2003-10-17 | 2006-11-24 | Lintec Corp | 接着テープの剥離方法及び剥離装置 |
US7465368B2 (en) * | 2003-12-24 | 2008-12-16 | Intel Corporation | Die molding for flip chip molded matrix array package using UV curable tape |
US20070090387A1 (en) * | 2004-03-29 | 2007-04-26 | Articulated Technologies, Llc | Solid state light sheet and encapsulated bare die semiconductor circuits |
JP4749062B2 (ja) * | 2004-07-16 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 薄膜集積回路を封止する装置及びicチップの作製方法 |
US7591863B2 (en) | 2004-07-16 | 2009-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip |
CN100530575C (zh) * | 2004-07-30 | 2009-08-19 | 株式会社半导体能源研究所 | 层压***、ic薄片、ic薄片卷、以及ic芯片的制造方法 |
JP4749074B2 (ja) * | 2004-07-30 | 2011-08-17 | 株式会社半導体エネルギー研究所 | Icチップの作製方法及び装置 |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7556405B2 (en) * | 2005-07-28 | 2009-07-07 | Velcro Industries B.V. | Mounting light emitting diodes |
KR101010990B1 (ko) * | 2006-10-17 | 2011-01-26 | 닛토덴코 가부시키가이샤 | 광학 부재 부착방법 및 그것을 이용한 장치 |
CN101306565A (zh) * | 2007-05-16 | 2008-11-19 | 鑫昌机械工业股份有限公司 | 亲油性橡胶薄制品压延生产方法 |
KR101093653B1 (ko) * | 2007-10-22 | 2011-12-15 | 가부시키가이샤 아무쿠루 | 면발광체 및 이것을 조립하여 이루어지는 내조식 간판 |
JP2009194064A (ja) * | 2008-02-13 | 2009-08-27 | Takatori Corp | 基板への接着フィルム貼付け装置及び貼付け方法 |
JP5093049B2 (ja) * | 2008-10-27 | 2012-12-05 | コニカミノルタホールディングス株式会社 | 有機エレクトロニクス素子、その製造方法、及び製造装置 |
WO2011105185A1 (ja) * | 2010-02-26 | 2011-09-01 | コニカミノルタオプト株式会社 | 光学半導体素子モジュールの製造方法 |
TW201216526A (en) * | 2010-08-20 | 2012-04-16 | Koninkl Philips Electronics Nv | Lamination process for LEDs |
JP2012142364A (ja) * | 2010-12-28 | 2012-07-26 | Nitto Denko Corp | 封止部材、封止方法、および、光半導体装置の製造方法 |
KR101769356B1 (ko) * | 2011-03-25 | 2017-08-18 | 삼성전자주식회사 | 발광소자에 형광체층을 형성하는 방법 및 장치 |
KR20120109737A (ko) * | 2011-03-25 | 2012-10-09 | 삼성전자주식회사 | 발광 소자 패키지 및 그 제조 방법 |
CN102881780B (zh) * | 2011-07-15 | 2015-04-01 | 展晶科技(深圳)有限公司 | 发光模组及其制造方法 |
EP2837040A4 (en) * | 2012-04-12 | 2015-10-14 | Saint Gobain Performance Plast | METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE |
DE102012207777A1 (de) | 2012-05-10 | 2013-11-14 | Voith Patent Gmbh | Verfahren zur Herstellung einer Verpackungsmaterialbahn auf Basis mehrerer Faserstoffbahnen |
JP6354159B2 (ja) * | 2012-06-28 | 2018-07-11 | 東レ株式会社 | 半導体発光素子の製造方法 |
JP2015082580A (ja) * | 2013-10-23 | 2015-04-27 | 日東電工株式会社 | 半導体装置およびその製造方法 |
JP6275471B2 (ja) | 2013-12-17 | 2018-02-07 | 日本山村硝子株式会社 | 固体発光装置および蛍光体分散有機−無機ハイブリッドプレポリマー組成物 |
CN104538562B (zh) * | 2015-01-15 | 2017-04-26 | 京东方科技集团股份有限公司 | 一种oled器件及其封装方法和封装装置 |
CN104821362A (zh) * | 2015-03-31 | 2015-08-05 | 长治虹源光电科技有限公司 | 一种基于铁基板的led封装工艺流程 |
CN106469767B (zh) | 2015-08-18 | 2017-12-01 | 江苏诚睿达光电有限公司 | 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备*** |
-
2015
- 2015-08-18 CN CN201510508190.2A patent/CN106469767B/zh active Active
- 2015-12-18 EP EP15901630.2A patent/EP3316320B1/en active Active
- 2015-12-18 KR KR1020187002437A patent/KR102026843B1/ko active IP Right Grant
- 2015-12-18 PL PL15901630T patent/PL3316320T3/pl unknown
- 2015-12-18 JP JP2017567797A patent/JP6680808B2/ja active Active
- 2015-12-18 US US15/750,317 patent/US10328679B2/en active Active
- 2015-12-18 WO PCT/CN2015/097902 patent/WO2017028428A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN106469767B (zh) | 2017-12-01 |
EP3316320B1 (en) | 2019-07-17 |
EP3316320A4 (en) | 2018-07-18 |
JP6680808B2 (ja) | 2020-04-15 |
US10328679B2 (en) | 2019-06-25 |
CN106469767A (zh) | 2017-03-01 |
KR20180022863A (ko) | 2018-03-06 |
US20180229487A1 (en) | 2018-08-16 |
KR102026843B1 (ko) | 2019-09-30 |
EP3316320A1 (en) | 2018-05-02 |
WO2017028428A1 (zh) | 2017-02-23 |
JP2018527745A (ja) | 2018-09-20 |
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