PL3340319T3 - System urządzeń wykorzystujący fotokonwerter z żywicy termoplastycznej do pakowania wiązanego prowadzonego przez walcowanie - Google Patents
System urządzeń wykorzystujący fotokonwerter z żywicy termoplastycznej do pakowania wiązanego prowadzonego przez walcowanieInfo
- Publication number
- PL3340319T3 PL3340319T3 PL15901620T PL15901620T PL3340319T3 PL 3340319 T3 PL3340319 T3 PL 3340319T3 PL 15901620 T PL15901620 T PL 15901620T PL 15901620 T PL15901620 T PL 15901620T PL 3340319 T3 PL3340319 T3 PL 3340319T3
- Authority
- PL
- Poland
- Prior art keywords
- rolling
- bond
- thermoplastic resin
- equipment system
- package led
- Prior art date
Links
- 238000005096 rolling process Methods 0.000 title 1
- 229920005992 thermoplastic resin Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/222—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/464—Rollers the rollers having specific surface features having projections or knives, e.g. for cutting-out or for forming local depressions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510509656.0A CN106469774B (zh) | 2015-08-18 | 一种基于滚压式的热塑性树脂光转换体贴合封装led的装备*** | |
PCT/CN2015/097626 WO2017028418A1 (zh) | 2015-08-18 | 2015-12-16 | 一种基于滚压式的热塑性树脂光转换体贴合封装led的装备*** |
EP15901620.3A EP3340319B1 (en) | 2015-08-18 | 2015-12-16 | Equipment system using thermoplastic resin photoconverter to bond-package led by rolling |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3340319T3 true PL3340319T3 (pl) | 2020-03-31 |
Family
ID=58051742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15901620T PL3340319T3 (pl) | 2015-08-18 | 2015-12-16 | System urządzeń wykorzystujący fotokonwerter z żywicy termoplastycznej do pakowania wiązanego prowadzonego przez walcowanie |
Country Status (6)
Country | Link |
---|---|
US (1) | US10665763B2 (pl) |
EP (1) | EP3340319B1 (pl) |
JP (1) | JP6731005B2 (pl) |
KR (1) | KR101989042B1 (pl) |
PL (1) | PL3340319T3 (pl) |
WO (1) | WO2017028418A1 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017028418A1 (zh) | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | 一种基于滚压式的热塑性树脂光转换体贴合封装led的装备*** |
US10926452B2 (en) * | 2017-05-25 | 2021-02-23 | Magic Leap, Inc. | Double-sided imprinting |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB997071A (en) * | 1964-01-16 | 1965-06-30 | Millville Mfg Co | Method and apparatus for processing a web of cloth |
US20050008821A1 (en) * | 2003-07-07 | 2005-01-13 | Pricone Robert M. | Process and apparatus for fabricating precise microstructures and polymeric molds for making same |
CA2560701C (en) * | 2004-03-29 | 2016-10-18 | Articulated Technologies, Llc | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
US7456104B2 (en) * | 2005-05-31 | 2008-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7319246B2 (en) * | 2005-06-23 | 2008-01-15 | Lumination Llc | Luminescent sheet covering for LEDs |
JP5162979B2 (ja) * | 2007-06-28 | 2013-03-13 | 日亜化学工業株式会社 | 発光装置 |
JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ledランプの製造方法 |
EP2264652B1 (en) * | 2009-06-09 | 2016-06-01 | Ricoh Company, Ltd. | Reversible thermosensitive recording medium and method for producing the same |
DE102009034370A1 (de) * | 2009-07-23 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optischen Elements für ein optoelektronisches Bauteil |
JP5424116B2 (ja) * | 2010-01-21 | 2014-02-26 | コニカミノルタ株式会社 | 光学素子シートの同時両面形成方法、およびその光学素子シート形成装置 |
WO2011105185A1 (ja) | 2010-02-26 | 2011-09-01 | コニカミノルタオプト株式会社 | 光学半導体素子モジュールの製造方法 |
CN101872828B (zh) | 2010-06-21 | 2012-07-25 | 深圳雷曼光电科技股份有限公司 | 一种倒装led芯片的封装方法 |
KR101769356B1 (ko) * | 2011-03-25 | 2017-08-18 | 삼성전자주식회사 | 발광소자에 형광체층을 형성하는 방법 및 장치 |
KR20120109737A (ko) * | 2011-03-25 | 2012-10-09 | 삼성전자주식회사 | 발광 소자 패키지 및 그 제조 방법 |
US8828759B2 (en) * | 2011-12-06 | 2014-09-09 | Cooledge Lighting Inc. | Formation of uniform phosphor regions for broad-area lighting systems |
TWI545349B (zh) * | 2012-02-21 | 2016-08-11 | 鴻海精密工業股份有限公司 | 柱狀透鏡式立體顯示裝置及其製造方法 |
EP2837040A4 (en) * | 2012-04-12 | 2015-10-14 | Saint Gobain Performance Plast | METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE |
KR101328073B1 (ko) * | 2012-06-28 | 2013-11-13 | 서종욱 | 횡형 발광소자 및 이를 적용하는 발광 시트 |
JP6354159B2 (ja) * | 2012-06-28 | 2018-07-11 | 東レ株式会社 | 半導体発光素子の製造方法 |
US20140001949A1 (en) * | 2012-06-29 | 2014-01-02 | Nitto Denko Corporation | Phosphor layer-covered led, producing method thereof, and led device |
TW201441006A (zh) * | 2013-04-29 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | 擠壓成型裝置 |
WO2017028418A1 (zh) | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | 一种基于滚压式的热塑性树脂光转换体贴合封装led的装备*** |
-
2015
- 2015-12-16 WO PCT/CN2015/097626 patent/WO2017028418A1/zh active Application Filing
- 2015-12-16 KR KR1020187002284A patent/KR101989042B1/ko active IP Right Grant
- 2015-12-16 JP JP2017567793A patent/JP6731005B2/ja active Active
- 2015-12-16 EP EP15901620.3A patent/EP3340319B1/en active Active
- 2015-12-16 PL PL15901620T patent/PL3340319T3/pl unknown
- 2015-12-16 US US15/750,790 patent/US10665763B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN106469774A (zh) | 2017-03-01 |
WO2017028418A1 (zh) | 2017-02-23 |
KR20180022848A (ko) | 2018-03-06 |
US20180248085A1 (en) | 2018-08-30 |
JP2018533194A (ja) | 2018-11-08 |
EP3340319B1 (en) | 2019-07-31 |
KR101989042B1 (ko) | 2019-06-13 |
EP3340319A4 (en) | 2018-08-22 |
JP6731005B2 (ja) | 2020-07-29 |
EP3340319A1 (en) | 2018-06-27 |
US10665763B2 (en) | 2020-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2529305B (en) | Bicycle control system | |
HK1248640A1 (zh) | 模擬器騎乘設備 | |
AU361615S (en) | Exercise equipment | |
GB201708187D0 (en) | Facial exercise system | |
GB201700857D0 (en) | System for distance to stop | |
GB2517593B (en) | Bicycle safety system | |
SG11201610462WA (en) | Resin plating method | |
KR101677440B9 (ko) | 자전거 운동장치 | |
GB201411976D0 (en) | Improvements to exercise equipment | |
GB201515903D0 (en) | Rowing telemetrics system | |
PL3300127T3 (pl) | Sposób procesowy z zastosowaniem fotokonwertera z żywicy termoplastycznej do pakietu wiązanego LED przez walcowanie | |
PL3009171T3 (pl) | Trenażer rowerowy | |
GB2531051B (en) | Carbon fibre-containing prepregs | |
HUE045376T2 (hu) | LED összeállítás | |
PL3210244T3 (pl) | Układ LED | |
KR101503650B9 (ko) | 자전거 운동기구 | |
PL3321980T3 (pl) | System urządzeń wykorzystujący odkształcalny fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED | |
SG11201705166WA (en) | Thermoplastic vulcanizate including a block composite | |
PL3340319T3 (pl) | System urządzeń wykorzystujący fotokonwerter z żywicy termoplastycznej do pakowania wiązanego prowadzonego przez walcowanie | |
PL3009170T3 (pl) | Trenażer rowerowy | |
PL3316320T3 (pl) | System urządzeń wykorzystujący fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED przez walcowanie tandemowe | |
GB2531644B (en) | Composite part forming system | |
PL3087213T3 (pl) | Instalacja przelotowa | |
SG11201703230PA (en) | Rehabilitation exercise system | |
GB2522776B (en) | Exercise equipment |