CN104538562B - 一种oled器件及其封装方法和封装装置 - Google Patents
一种oled器件及其封装方法和封装装置 Download PDFInfo
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- CN104538562B CN104538562B CN201510020578.8A CN201510020578A CN104538562B CN 104538562 B CN104538562 B CN 104538562B CN 201510020578 A CN201510020578 A CN 201510020578A CN 104538562 B CN104538562 B CN 104538562B
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- oled
- graphene film
- copper foil
- roller bearing
- adhesive tape
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Abstract
本发明提供一种OLED器件及其封装方法和封装装置。该封装方法对形成在衬底基板上的OLED器件进行封装,包括:将形成在铜箔上的石墨烯薄膜与所铜箔分离,并采用石墨烯薄膜对OLED器件进行封装。该封装方法能够充分发挥石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧且易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点,将石墨烯薄膜引入到OLED器件的封装中,不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
Description
技术领域
本发明涉及显示技术领域,具体地,涉及一种OLED器件及其封装方法和封装装置。
背景技术
随着有机电致发光(OLED)技术的不断成熟,OLED设备的不断进化、对于OLED器件的封装方法和封装水平,一直是业内重点探讨的话题。
因为水和氧是有机材料的天敌,它们不但可以打开聚合物的不饱和键,让有机材料加速老化,也会对器件中的电极造成伤害。OLED器件的封装水平决定了器件的寿命和环境信赖性。
UV胶封装是实验室中比较常见的OLED器件的封装方法,它成本低,操作简单,但UV胶在紫外固化时会接触到器件,对器件造成不良影响,无法在实际的产业中应用。Frit(玻璃胶)封装法是一种用玻璃粉固化,从而将封装玻璃和基底相连的封装方法,是工业上比较成熟的封装方法,此方法的缺点是,无法控制玻璃粉的固化效果,在玻璃粉固化过程中会出现龟裂,从而影响封装效果,空气会从裂缝中进入器件,影响器件寿命。针对Frit封装的缺陷,薄膜封装的优势开始展现出来,薄膜封装是通过在OLED器件的阴极表面制备有机、无机交替的多层薄膜对OLED器件进行封装,但是这种方法的封装工艺过于复杂,而且工艺不成熟、生产率低。
发明内容
本发明针对现有技术中存在的上述技术问题,提供一种OLED器件及其封装方法和封装装置。该封装方法能够充分发挥石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧且易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点,将石墨烯薄膜引入到OLED器件的封装中,不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
本发明提供一种封装方法,对形成在衬底基板上的OLED器件进行封装,包括:将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装。
优选地,所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装具体包括:
步骤S10:将所述铜箔的未形成所述石墨烯薄膜的一侧通过双面胶粘结到固定衬底上;
步骤S11:将粘性聚合物加工成流体状态,浇筑到所述铜箔的形成有所述石墨烯薄膜的一侧;
步骤S12:待所述粘性聚合物固化后,用胶带粘住所述粘性聚合物,然后将所述石墨烯薄膜和所述粘性聚合物的复合膜从所述铜箔上剥离下来;
步骤S13:在所述OLED器件上形成钝化层,在钝化层上涂布透明胶,在所述透明胶固化前,将所述复合膜的所述石墨烯薄膜的一面粘贴到所述透明胶上;
步骤S14:固化所述透明胶。
优选地,在所述步骤S11中,采用熔融的方式将所述粘性聚合物加工成流体状态。
优选地,所述固定衬底采用玻璃、石英或硅片材料制成。
优选地,所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装具体包括:
步骤S20:在所述OLED器件上形成钝化层,在钝化层上涂布透明胶;
步骤S21:在所述透明胶固化前,将所述铜箔的形成有所述石墨烯薄膜的一面粘贴到所述透明胶上;
步骤S22:固化所述透明胶;
步骤S23:将完成步骤S22的所述OLED器件固定,用胶带粘住所述铜箔的未形成所述石墨烯薄膜的一面,将所述铜箔与所述石墨烯薄膜分离。
优选地,所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装具体包括:
步骤S30:在所述OLED器件上形成钝化层;
步骤S31:将所述铜箔的未形成所述石墨烯薄膜的一面贴附到能够加热的滚轴上;
步骤S32:将完成步骤S30的所述衬底基板固定到基台上,且所述OLED器件背向所述基台;
步骤S33:在所述衬底基板上所述OLED器件的第一侧滴注透明胶,并使所述滚轴上所述石墨烯薄膜的一侧边缘与所述透明胶相对应并接触;
步骤S34:加热所述滚轴使所述透明胶处于不完全固化状态,滚动所述滚轴至所述OLED器件的与所述第一侧相对的第二侧,所述透明胶在所述滚轴的牵引下涂布至所述钝化层上,且所述钝化层与所述石墨烯薄膜粘接在一起,同时,所述铜箔与所述石墨烯薄膜分离;
步骤S35:固化所述透明胶。
优选地,所述石墨烯薄膜的尺寸大于所述OLED器件的尺寸,且所述石墨烯薄膜覆盖所述OLED器件。
优选地,所述透明胶采用与所述粘性聚合物相同的材料制成;所述粘性聚合物包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种。
优选地,所述透明胶的固化温度小于等于所述OLED器件的热处理临界温度。
优选地,在所述铜箔与所述石墨烯薄膜分离之后,还包括在所述石墨烯薄膜上形成保护层。
优选地,所述保护层采用溶液旋涂法或化学气相沉积法形成;所述保护层采用透明有机绝缘材料或透明无机绝缘材料制成。
优选地,在所述步骤S32中,完成步骤S30的所述衬底基板通过胶贴法或真空吸附法固定到所述基台上。
优选地,所述钝化层采用低温化学气相沉积法、原子层沉积法或常温键合法形成;采用所述低温化学气相沉积法沉积所述钝化层的温度小于等于所述OLED器件的热处理临界温度;所述钝化层采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅材料制成。
本发明还提供一种OLED器件,所述OLED器件采用上述封装方法进行封装。
本发明还提供一种封装装置,用于对形成在衬底基板上的OLED器件进行封装,包括封装机构,所述封装机构用于将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装。
优选地,还包括基台,所述基台用于承载所述衬底基板以及所述OLED器件,所述衬底基板与所述基台的承载面贴合;
所述封装机构包括圆柱形滚轴、带动部和加热部,所述滚轴的圆柱面用于贴附形成有所述石墨烯薄膜的所述铜箔,所述铜箔的未形成所述石墨烯薄膜的一面与所述圆柱面贴合;
所述滚轴设置在所述基台上方,且所述滚轴在起始位置用于与所述衬底基板上所述OLED器件的第一侧相对应,所述滚轴与所述衬底基板之间形成有间隙,所述间隙用于容纳透明胶;
所述加热部设置在所述滚轴内部,用于加热所述滚轴的圆柱面,以使所述透明胶处于不完全固化状态;所述带动部与所述滚轴的端部连接,用于带动所述滚轴滚动至所述OLED器件的与所述第一侧相对的第二侧,所述滚轴在滚动时能牵引所述透明胶向所述滚轴的滚动方向延伸。
优选地,所述滚轴的延伸方向平行于与所述OLED器件的第一侧相对应的所述衬底基板的一侧边缘,且所述滚轴的长度大于等于所述衬底基板的一侧边缘的长度。
本发明的有益效果:本发明所提供的封装方法,通过将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装,能够充分发挥石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧且易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点,将石墨烯薄膜引入到OLED器件的封装中,不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
本发明所提供的OLED器件,通过采用上述封装方法进行封装,封装效果更加优良,从而能提高OLED器件的品质和寿命。
本发明所提供的封装装置,通过设置封装机构,能够实现石墨烯薄膜与铜箔的快速简便分离,同时还能使石墨烯薄膜对OLED器件进行封装,从而不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
附图说明
图1为本发明实施例1中铜箔与石墨烯薄膜的分离示意图;
图2为本发明实施例1中石墨烯薄膜对OLED器件进行封装的示意图;
图3为本发明实施例2中铜箔与石墨烯薄膜分离以及石墨烯薄膜对OLED器件进行封装的示意图;
图4为本发明实施例2中在石墨烯薄膜上形成保护层的示意图;
图5为本发明实施例3中铜箔与石墨烯薄膜分离以及石墨烯薄膜对OLED器件进行封装的示意图;
图6为本发明实施例5中封装装置对OLED器件进行封装的结构示意图。
其中的附图标记说明:
1.铜箔;2.石墨烯薄膜;3.双面胶;4.固定衬底;5.粘性聚合物;6.胶带;7.OLED器件;71.第一侧;72.第二侧;8.钝化层;9.透明胶;10.保护层;11.滚轴;12.衬底基板;13.基台;14.加热部;15.间隙。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案,下面结合附图和具体实施方式对本发明所提供的一种OLED器件及其封装方法和封装装置作进一步详细描述。
实施例1:
本实施例提供一种封装方法,对形成在衬底基板上的OLED器件进行封装,包括:将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装。
该封装方法能够充分发挥石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧且易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点,将石墨烯薄膜引入到OLED器件的封装中,不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
本实施例中,将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装具体包括:如图1和图2所示,
步骤S10:将铜箔1的未形成石墨烯薄膜2的一侧通过双面胶3粘结到固定衬底4上。
固定衬底4采用玻璃、石英或硅片材料制成,即固定衬底4通常采用硬质衬底,以便对铜箔1进行稳固的固定。固定衬底4的位置固定,该步骤用于对形成有石墨烯薄膜2的铜箔1进行固定,以便后续将石墨烯薄膜2与铜箔1分离开来。
步骤S11:将粘性聚合物5加工成流体状态,浇筑到铜箔1的形成有石墨烯薄膜2的一侧。
在该步骤中,采用熔融的方式将粘性聚合物5加工成流体状态。与将粘性聚合物5溶解在溶剂中的加工方式相比,避免了粘性聚合物5固化过程中溶剂蒸发不彻底所导致的不良后果。
步骤S12:待粘性聚合物5固化后,用胶带6粘住粘性聚合物5,然后将石墨烯薄膜2和粘性聚合物5的复合膜从铜箔1上剥离下来。
由于粘性聚合物5与石墨烯薄膜2之间的粘结作用力比石墨烯薄膜2与铜箔1之间的粘结作用力强,所以粘性聚合物5的设置能使石墨烯薄膜2与铜箔1很容易分离。在该步骤中,通过胶带6就能将石墨烯薄膜2从铜箔1上很容易地剥离下来,从而便于后续采用石墨烯薄膜2对OLED器件进行封装。
步骤S13:在OLED器件7上形成钝化层8,在钝化层8上涂布透明胶9,在透明胶9固化前,将复合膜的石墨烯薄膜2的一面粘贴到透明胶9上。
钝化层8能够将OLED器件7的电极与石墨烯薄膜2隔离开来,从而起到对OLED器件7的初步封装和保护作用。其中,钝化层8采用低温化学气相沉积法、常温键合法或原子层沉积法形成;采用低温化学气相沉积法沉积钝化层8的温度小于等于OLED器件的热处理临界温度(通常为90°)。钝化层8的这些制备方法均为现有的比较成熟的制备方法,具体不再赘述。钝化层8采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅等绝缘材料制成。另外,复合膜中的粘性聚合物5能够对石墨烯薄膜2形成很好的保护,还能对OLED器件7形成进一步的封装。
步骤S14:固化透明胶9。
在该步骤中,透明胶9的固化温度小于等于OLED器件7的热处理临界温度,从而避免较高的固化温度对OLED器件7的性能造成破坏。通常,OLED器件7的热处理临界温度为90°,因此,透明胶9的固化温度通常小于等于90°。透明胶9采用与粘性聚合物5相同的材料制成,鉴于粘性聚合物5与石墨烯薄膜2的粘结作用力较强,所以透明胶9能与石墨烯薄膜2牢固地粘结在一起,从而使石墨烯薄膜2对OLED器件7形成很好的封装。
至此,便完成了采用石墨烯薄膜2对OLED器件7的封装。
本实施例中,石墨烯薄膜2的尺寸大于OLED器件7的尺寸,且石墨烯薄膜2覆盖OLED器件7。从而使石墨烯薄膜2能够对OLED器件7形成很好的封装。
本实施例中,粘性聚合物5包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种的混合物。
本实施例所提供的封装方法,通过采用物理剥离的方式将铜箔1上的石墨烯薄膜2转移到粘性聚合物5上,再将石墨烯薄膜2与粘性聚合物5的复合膜通过透明胶9与OLED器件7上的钝化层8进行粘结,从而完成了对OLED器件7的封装。该封装方法工艺简单,操作起来非常便捷,能够提高生产效率。但需要说明的是,石墨烯薄膜2和粘性聚合物5的复合膜对OLED器件7进行封装时,可能会因为操作不当导致复合膜覆盖到OLED器件7上后不平整。另外,当衬底基板以及OLED器件7的尺寸变大时,会增大石墨烯薄膜2与铜箔1的分离难度。
实施例2:
本实施例提供一种封装方法,与实施例1不同的是,将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装具体包括:如图3和图4所示,
步骤S20:在OLED器件7上形成钝化层8,在钝化层8上涂布透明胶9。
透明胶9的材质与实施例1中相同。钝化层8的材质及形成方法与实施例1中相同。
步骤S21:在透明胶9固化前,将铜箔1的形成有石墨烯薄膜2的一面粘贴到透明胶9上。
步骤S22:固化透明胶9。
透明胶9的固化温度与实施例1中相同。
步骤S23:将完成步骤S22的OLED器件7固定,用胶带6粘住铜箔1的未形成石墨烯薄膜2的一面,将铜箔1与石墨烯薄膜2分离。
其中,石墨烯薄膜2的尺寸与实施例1中相同。
至此,便完成了采用石墨烯薄膜2对OLED器件7的封装。
需要说明的是,步骤S22和步骤S23也可以互换,即先将铜箔1与石墨烯薄膜2分离,再固化透明胶9。但这时需要确保在透明胶9还未固化的情况下,铜箔1与石墨烯薄膜2也能顺利分离开来,即在透明胶9还未固化的情况下,要确保石墨烯薄膜2与透明胶9之间的粘结作用力比石墨烯薄膜2与铜箔1之间的粘结作用力强。
本实施例中,在铜箔1与石墨烯薄膜2分离之后,还包括在石墨烯薄膜2上形成保护层10。保护层10能对石墨烯薄膜2形成保护,以使石墨烯薄膜2免受损坏,从而使石墨烯薄膜2对OLED器件7形成很好的封装和保护。
其中,保护层10采用溶液旋涂法或化学气相沉积法形成。溶液旋涂法即将形成保护层10的有机绝缘材料溶解于溶剂中形成溶液,然后将溶液涂布于石墨烯薄膜2上形成保护层10。化学气相沉积法则是将无机绝缘材料以化学气相沉积的形式制备于石墨烯薄膜2上形成保护层10。本实施例中,保护层10采用透明有机绝缘材料或透明无机绝缘材料制成。
本实施例所提供的封装方法,先将铜箔1的形成有石墨烯薄膜2的一面粘贴到透明胶9上,再将石墨烯薄膜2与铜箔1分离,从而完成对OLED器件7的封装。该封装方法相比于实施例1,工艺更加简单,操作起来也更加方便快捷,能进一步提高生产效率。本实施例中的封装方法相比于实施例1中的封装方法,能大大减少因操作不当导致的石墨烯薄膜2覆盖到OLED器件7上后的不平整,当衬底基板以及OLED器件7的尺寸变大时,还能进一步降低石墨烯薄膜2与铜箔1的分离难度。
实施例3:
本实施例提供一种封装方法,与实施例1-2不同的是,将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装具体包括:如图5所示,
步骤S30:在OLED器件7上形成钝化层8。
钝化层8的材质及形成方法与实施例1中相同。
步骤S31:将铜箔1的未形成石墨烯薄膜2的一面贴附到能够加热的滚轴11上。
滚轴11内部设置有加热装置,加热装置能对滚轴11的轴面加热。
步骤S32:将完成步骤S30的衬底基板12固定到基台13上,且OLED器件7背向基台13。
该步骤中,完成步骤S30的衬底基板12通过胶贴法或真空吸附法固定到基台13上,以方便后续对OLED器件7的封装。
步骤S33:在衬底基板12上OLED器件7的第一侧71滴注透明胶9,并使滚轴11上石墨烯薄膜2的一侧边缘与透明胶9相对应并接触。
透明胶9的材质与实施例1中相同。
步骤S34:加热滚轴11使透明胶9处于不完全固化状态,滚动滚轴11至OLED器件7的与第一侧71相对的第二侧72,透明胶9在滚轴11的牵引下涂布至钝化层8上,且钝化层8与石墨烯薄膜2粘接在一起,同时,铜箔1与石墨烯薄膜2分离。
在该步骤中,石墨烯薄膜2的尺寸与实施例1中相同。滚轴11从OLED器件7的第一侧71滚动至第二侧72的过程中,能够同时完成石墨烯薄膜2对OLED器件7的封装和铜箔1与石墨烯薄膜2的分离,从而使OLED器件7的封装更加快捷简便。
步骤S35:固化透明胶9。
透明胶9的固化温度与实施例1中相同。
至此,便完成了采用石墨烯薄膜2对OLED器件7的封装。
本实施例中,在铜箔1与石墨烯薄膜2分离之后,还包括在石墨烯薄膜2上形成保护层。保护层能对石墨烯薄膜2形成保护,以使石墨烯薄膜2免受损坏,从而使石墨烯薄膜2对OLED器件7形成很好的封装和保护。其中,保护层的材质及形成方法与实施例2中相同。
本实施例所提供的封装方法,能够在一步中同时完成石墨烯薄膜2对OLED器件7的封装和铜箔1与石墨烯薄膜2的分离,从而使OLED器件7的封装更加快捷简便。本实施例中的封装方法相比于实施例1-2任意一个中的封装方法,能够避免石墨烯薄膜2覆盖到OLED器件7上后出现不平整现象,且本实施例中的封装方法能使石墨烯薄膜2与铜箔1的分离难度更进一步降低。
另外,本实施例中的封装方法不受衬底基板12以及OLED器件7的尺寸的限制,即无论衬底基板12和OLED器件7尺寸有多大,都能够通过使滚轴11滚过相应的面积而实现OLED器件7的封装,只要确保石墨烯薄膜2的尺寸大于OLED器件7的尺寸,能够将OLED器件7完全覆盖即可。
实施例1-3的有益效果:实施例1-3中所提供的封装方法,通过将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装,能够充分发挥石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧且易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点,将石墨烯薄膜引入到OLED器件的封装中,不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
实施例4:
本实施例提供一种OLED器件,该OLED器件采用实施例1-3任意一个中的封装方法进行封装。
通过采用实施例1-3任意一个中的封装方法封装而成的OLED器件,封装效果更加优良,从而能提高OLED器件的品质和寿命。
实施例5:
本实施例提供一种封装装置,用于对形成在衬底基板上的OLED器件进行封装,包括封装机构,封装机构用于将形成在铜箔上的石墨烯薄膜与铜箔分离,并采用石墨烯薄膜对OLED器件进行封装。
封装机构的设置,能够实现石墨烯薄膜与铜箔的快速简便分离,同时还能使石墨烯薄膜对OLED器件进行封装,从而不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
如图6所示,该封装装置还包括基台13,基台13用于承载衬底基板12以及OLED器件7,衬底基板12与基台13的承载面贴合。封装机构包括圆柱形滚轴11、带动部(图6中未示出)和加热部14,滚轴11的圆柱面用于贴附形成有石墨烯薄膜2的铜箔1,铜箔1的未形成石墨烯薄膜2的一面与圆柱面贴合。
滚轴11设置在基台13上方,且滚轴11在起始位置用于与衬底基板12上OLED器件7的第一侧71相对应,滚轴11与衬底基板12之间形成有间隙15,间隙15用于容纳透明胶9。
加热部14设置在滚轴11内部,用于加热滚轴11的圆柱面,以使透明胶9处于不完全固化状态;带动部与滚轴11的端部连接,用于带动滚轴11滚动至OLED器件7的与第一侧71相对的第二侧72,滚轴11在滚动时能牵引透明胶9向滚轴11的滚动方向延伸。
如此设置,能使封装装置按照实施例3中的封装方法对OLED器件7进行封装。从而大大简化了OLED器件的封装工艺,并提高了生产效率。
本实施例中,滚轴11的延伸方向平行于与OLED器件7的第一侧71相对应的衬底基板12的一侧边缘,且滚轴11的长度大于等于衬底基板12的一侧边缘的长度。如此设置,使滚轴11滚过整个衬底基板12后能实现对整个OLED器件7的完全覆盖,从而完成对OLED器件7的良好封装。
本实施例中的封装装置,通过封装机构的设置,能够实现石墨烯薄膜与铜箔的快速简便分离,同时还能使石墨烯薄膜对OLED器件进行封装,从而不仅提高了OLED器件的封装效果,而且简化了OLED器件的封装工艺,并提高了生产效率。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。
Claims (11)
1.一种封装方法,对形成在衬底基板上的OLED器件进行封装,其特征在于,包括:将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装;
所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离,并采用所述石墨烯薄膜对所述OLED器件进行封装具体包括:
步骤S30:在所述OLED器件上形成钝化层;
步骤S31:将所述铜箔的未形成所述石墨烯薄膜的一面贴附到能够加热的滚轴上;
步骤S32:将完成步骤S30的所述衬底基板固定到基台上,且所述OLED器件背向所述基台;
步骤S33:在所述衬底基板上所述OLED器件的第一侧滴注透明胶,并使所述滚轴上所述石墨烯薄膜的一侧边缘与所述透明胶相对应并接触;
步骤S34:加热所述滚轴使所述透明胶处于不完全固化状态,滚动所述滚轴至所述OLED器件的与所述第一侧相对的第二侧,所述透明胶在所述滚轴的牵引下涂布至所述钝化层上,且所述钝化层与所述石墨烯薄膜粘接在一起,同时,所述铜箔与所述石墨烯薄膜分离;
步骤S35:固化所述透明胶。
2.根据权利要求1所述的封装方法,其特征在于,所述石墨烯薄膜的尺寸大于所述OLED器件的尺寸,且所述石墨烯薄膜覆盖所述OLED器件。
3.根据权利要求1所述的封装方法,其特征在于,所述透明胶采用的材料包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种。
4.根据权利要求1所述的封装方法,其特征在于,所述透明胶的固化温度小于等于所述OLED器件的热处理临界温度。
5.根据权利要求1所述的封装方法,其特征在于,在所述铜箔与所述石墨烯薄膜分离之后,还包括在所述石墨烯薄膜上形成保护层。
6.根据权利要求5所述的封装方法,其特征在于,所述保护层采用溶液旋涂法或化学气相沉积法形成;所述保护层采用透明有机绝缘材料或透明无机绝缘材料制成。
7.根据权利要求1所述的封装方法,其特征在于,在所述步骤S32中,完成步骤S30的所述衬底基板通过胶贴法或真空吸附法固定到所述基台上。
8.根据权利要求1所述的封装方法,其特征在于,所述钝化层采用低温化学气相沉积法、原子层沉积法或常温键合法形成;采用所述低温化学气相沉积法沉积所述钝化层的温度小于等于所述OLED器件的热处理临界温度;所述钝化层采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅材料制成。
9.一种OLED器件,其特征在于,所述OLED器件采用权利要求1-8任意一项所述的封装方法进行封装。
10.一种封装装置,用于对形成在衬底基板上的OLED器件进行封装,其特征在于,包括封装机构,所述封装机构用于将形成在铜箔上的石墨烯薄膜与所述铜箔分离,同时采用所述石墨烯薄膜对所述OLED器件进行封装;
还包括基台,所述基台用于承载所述衬底基板以及所述OLED器件,所述衬底基板与所述基台的承载面贴合;
所述封装机构包括圆柱形滚轴、带动部和加热部,所述滚轴的圆柱面用于贴附形成有所述石墨烯薄膜的所述铜箔,所述铜箔的未形成所述石墨烯薄膜的一面与所述圆柱面贴合;
所述滚轴设置在所述基台上方,且所述滚轴在起始位置用于与所述衬底基板上所述OLED器件的第一侧相对应,所述滚轴与所述衬底基板之间形成有间隙,所述间隙用于容纳透明胶;
所述加热部设置在所述滚轴内部,用于加热所述滚轴的圆柱面,以使所述透明胶处于不完全固化状态;所述带动部与所述滚轴的端部连接,用于带动所述滚轴滚动至所述OLED器件的与所述第一侧相对的第二侧,所述滚轴在滚动时能牵引所述透明胶向所述滚轴的滚动方向延伸。
11.根据权利要求10所述的封装装置,其特征在于,所述滚轴的延伸方向平行于与所述OLED器件的第一侧相对应的所述衬底基板的一侧边缘,且所述滚轴的长度大于等于所述衬底基板的一侧边缘的长度。
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