NO20075425L - Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt - Google Patents

Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt

Info

Publication number
NO20075425L
NO20075425L NO20075425A NO20075425A NO20075425L NO 20075425 L NO20075425 L NO 20075425L NO 20075425 A NO20075425 A NO 20075425A NO 20075425 A NO20075425 A NO 20075425A NO 20075425 L NO20075425 L NO 20075425L
Authority
NO
Norway
Prior art keywords
heat transfer
transfer layer
heat
radiator
heat generator
Prior art date
Application number
NO20075425A
Other languages
English (en)
Norwegian (no)
Inventor
Yoshiaki Hirose
Original Assignee
Toyo Tanso Vo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tanso Vo Ltd filed Critical Toyo Tanso Vo Ltd
Publication of NO20075425L publication Critical patent/NO20075425L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/21—After-treatment
    • C01B32/22—Intercalation
    • C01B32/225—Expansion; Exfoliation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Paper (AREA)
  • Fixing For Electrophotography (AREA)
NO20075425A 2005-03-31 2007-10-25 Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt NO20075425L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005100622A JP4299261B2 (ja) 2005-03-31 2005-03-31 伝熱シート、放熱構造体および伝熱シートの使用方法
PCT/JP2006/304865 WO2006112211A1 (ja) 2005-03-31 2006-03-13 伝熱シート、放熱構造体および伝熱シートの使用方法

Publications (1)

Publication Number Publication Date
NO20075425L true NO20075425L (no) 2007-10-25

Family

ID=37114943

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20075425A NO20075425L (no) 2005-03-31 2007-10-25 Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt

Country Status (7)

Country Link
US (1) US20090301697A1 (ja)
EP (1) EP1865552B1 (ja)
JP (2) JP4299261B2 (ja)
KR (3) KR101068416B1 (ja)
NO (1) NO20075425L (ja)
TW (1) TWI320844B (ja)
WO (1) WO2006112211A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299261B2 (ja) * 2005-03-31 2009-07-22 東洋炭素株式会社 伝熱シート、放熱構造体および伝熱シートの使用方法
JP5069861B2 (ja) * 2006-02-15 2012-11-07 株式会社カネカ グラファイトフィルム、およびそれを用いた熱拡散フィルム、ならびにそれを用いた熱拡散方法。
JP2008199039A (ja) * 2008-03-12 2008-08-28 Toyo Tanso Kk 放熱構造体および伝熱シートの使用方法
JP5818127B2 (ja) * 2010-02-04 2015-11-18 株式会社リコー 画像形成装置
TW201135429A (en) * 2010-04-07 2011-10-16 Hon Hai Prec Ind Co Ltd Heat sink
CN102130232A (zh) * 2010-12-29 2011-07-20 深圳市火天光电科技有限公司 发光芯片封装及发光芯片的封装方法
JP2013118313A (ja) * 2011-12-05 2013-06-13 Dexerials Corp 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
JP5978457B2 (ja) * 2012-03-19 2016-08-24 パナソニックＩｐマネジメント株式会社 熱伝導体
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
JP6043188B2 (ja) * 2013-01-08 2016-12-14 株式会社カネカ 層間熱接続部材および層間熱接続方法
JP6280875B2 (ja) * 2013-01-28 2018-02-14 株式会社村田製作所 はんだバンプの形成方法およびはんだバンプ
TWI601249B (zh) 2013-05-22 2017-10-01 Kaneka Corp Cooling structure
WO2015045641A1 (ja) 2013-09-26 2015-04-02 株式会社カネカ グラファイトシート、その製造方法、配線用積層板、グラファイト配線材料、および配線板の製造方法
KR20160002427U (ko) * 2013-11-05 2016-07-11 그라프텍 인터내셔널 홀딩스 인코포레이티드 흑연 물품
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
WO2015137257A1 (ja) * 2014-03-14 2015-09-17 株式会社カネカ 電子端末機器及びその組立方法
JP6635941B2 (ja) 2014-12-04 2020-01-29 株式会社カネカ 高真空用層間熱接合性グラファイトシート
WO2016167307A1 (ja) 2015-04-15 2016-10-20 株式会社カネカ イオンビーム荷電変換装置の荷電変換膜
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
JP7345088B2 (ja) * 2019-02-08 2023-09-15 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびこれを用いた電子機器
KR102183485B1 (ko) * 2020-07-30 2020-11-26 주식회사 엔티에스 폐흑연을 이용한 방열 시트의 제조 방법
JP7074270B1 (ja) 2022-01-19 2022-05-24 富士電機株式会社 半導体装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US3414381A (en) * 1966-04-04 1968-12-03 Dow Chemical Co Method for producing low density graphite structures
JPS5580711A (en) * 1978-12-02 1980-06-18 Teruhisa Kondo Production of flexible graphite product
US4471837A (en) * 1981-12-28 1984-09-18 Aavid Engineering, Inc. Graphite heat-sink mountings
FR2583864B1 (fr) * 1985-06-25 1989-04-07 Inst Francais Du Petrole Dispositif d'echange thermique du type echangeur a plaques perforees presentant une etancheite amelioree.
ES2021386B3 (es) * 1986-06-16 1991-11-01 Lorraine Carbone Contacto termico de gran coeficiente de transferencia y aplicaciones en el enfriamiento de una estructura sometida a un flujo termico intenso.
JPH0288415A (ja) * 1988-09-26 1990-03-28 Hitachi Chem Co Ltd 低密度黒鉛成形体
JPH0370754A (ja) * 1989-08-09 1991-03-26 Bando Chem Ind Ltd 高熱伝導性ゴム組成物
US5405171A (en) * 1989-10-26 1995-04-11 Union Oil Company Of California Dual gasket lined pipe connector
JPH06134917A (ja) * 1992-10-28 1994-05-17 Taenaka Kogyo Kk 膨張黒鉛ラミネートシート、膨張黒鉛シート複合材、その製造方法
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
JP2645800B2 (ja) * 1993-12-14 1997-08-25 日本ピラー工業株式会社 膨張黒鉛製シール素材およびその製造方法ならびにガスケット用シート
US5503717A (en) * 1994-06-13 1996-04-02 Kang; Feiyu Method of manufacturing flexible graphite
US5846459A (en) * 1997-06-26 1998-12-08 Ucar Carbon Technology Corporation Method of forming a flexible graphite sheet with decreased anisotropy
EP0971407B1 (en) * 1997-10-14 2004-07-21 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using same
DE19828789A1 (de) * 1998-06-27 1999-12-30 Sgl Technik Gmbh Packungsgarn aus Graphit- und Plastikfolie
JP2000169125A (ja) * 1998-12-04 2000-06-20 Matsushita Electric Ind Co Ltd グラファイト材料およびその製造方法
DE10003927A1 (de) * 2000-01-29 2001-08-02 Sgl Technik Gmbh Verfahren zum Herstellen von expandierbaren Graphiteinlagerungsverbindungen unter Verwendung von Phosphorsäuren
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
JP2002088171A (ja) * 2000-09-13 2002-03-27 Polymatech Co Ltd 熱伝導性シートおよびその製造方法ならびに放熱装置
JP2003008263A (ja) * 2001-06-27 2003-01-10 Sony Corp 熱伝導部材および熱伝導部材を有する電子機器
KR100642923B1 (ko) * 2002-06-18 2006-11-03 도요탄소 가부시키가이샤 가요성을 갖는 고순도 팽창 흑연시트와 그 제조방법, 및상기 시트를 이용한 카본 도가니의 내층
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
FR2849651B1 (fr) * 2003-01-08 2008-02-15 Carbone Lorraine Composants Structures isolante comprenant des couches en particules de graphite expanse comprimees a des densites differentes, elements isolants thermiques realises a partir de ces structures
JP4380226B2 (ja) * 2003-06-06 2009-12-09 パナソニック株式会社 熱伝導性シートとこれを用いた放熱構造体
DE10341255B4 (de) * 2003-09-04 2005-06-16 Sgl Carbon Ag Wärmeleitplatten aus expandiertem Graphit sowie Verfahren zu ihrer Herstellung
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
US20060070720A1 (en) * 2004-09-17 2006-04-06 Capp Joseph P Heat riser
JP4299261B2 (ja) * 2005-03-31 2009-07-22 東洋炭素株式会社 伝熱シート、放熱構造体および伝熱シートの使用方法

Also Published As

Publication number Publication date
TW200638018A (en) 2006-11-01
KR101068416B1 (ko) 2011-09-29
JP2006286684A (ja) 2006-10-19
KR20100017859A (ko) 2010-02-16
KR20070118099A (ko) 2007-12-13
JP2008153704A (ja) 2008-07-03
WO2006112211A1 (ja) 2006-10-26
EP1865552A1 (en) 2007-12-12
JP4299261B2 (ja) 2009-07-22
TWI320844B (en) 2010-02-21
KR101052752B1 (ko) 2011-07-29
JP5114255B2 (ja) 2013-01-09
EP1865552A4 (en) 2008-07-02
US20090301697A1 (en) 2009-12-10
EP1865552B1 (en) 2022-06-15
KR20100017858A (ko) 2010-02-16
KR101061805B1 (ko) 2011-09-05

Similar Documents

Publication Publication Date Title
NO20075425L (no) Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt
TW200717753A (en) Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
WO2007001317A3 (en) Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
TW200626059A (en) Systems to cool multiple electrical components
NO20073040L (no) Anordninger, systemer og fremgangsmater for kjoling
WO2006025929A3 (en) Thermal device, system, and method, for fluid processing device
WO2009074788A3 (en) Apparatus for hot and cold processing
TW200702975A (en) Extendable cooling apparatus
FR2934709B1 (fr) Structure d'echange thermique et dispositif de refroidissement comportant une telle structure.
GB0618893D0 (en) Impingement cooling of components in an electronic system
HK1138901A1 (en) Heat exchange element, method of producing the heat exchange element, heat exchanger, and heat exchange and ventilation device
WO2006055099A3 (en) Thermal component temperature management system and method
TW200725210A (en) LED with temperature control function
SG145670A1 (en) Thin film structure with controlled lateral thermal spreading in the thin film
MY149481A (en) Hybrid heat exchanger
SG146676A1 (en) Method and apparatus for thermal dissipation in an information handling system
WO2009142463A3 (en) Air source heat exchange system and method utilizing temperature gradient and water
SG158072A1 (en) Secondary circulation cooling system
DE60210822D1 (de) Isolation eines selbstkühlenden getränkefasses
CN204421706U (zh) 一种用于热管散热装置的蒸发器
FR3059152B1 (fr) Dispositif de transfert thermique, de connexion electrique et dispositif electronique
WO2009082786A3 (en) Heat exchanger
CN203280179U (zh) 可制冷制热的保温水杯套
DE10343502A1 (de) Verfahren zum Herstellen einer wärmeleitenden Verbindung und Baugruppe mit einer wärmeleitenden Verbindung
TWI265268B (en) Heat dissipating device incorporating heat pipe

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application