TWI265268B - Heat dissipating device incorporating heat pipe - Google Patents

Heat dissipating device incorporating heat pipe

Info

Publication number
TWI265268B
TWI265268B TW94130336A TW94130336A TWI265268B TW I265268 B TWI265268 B TW I265268B TW 94130336 A TW94130336 A TW 94130336A TW 94130336 A TW94130336 A TW 94130336A TW I265268 B TWI265268 B TW I265268B
Authority
TW
Taiwan
Prior art keywords
base
heat
heat pipe
lateral side
groove
Prior art date
Application number
TW94130336A
Other languages
Chinese (zh)
Other versions
TW200712405A (en
Inventor
Wan-Lin Xia
Tao Li
Min-Qi Xiao
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94130336A priority Critical patent/TWI265268B/en
Application granted granted Critical
Publication of TWI265268B publication Critical patent/TWI265268B/en
Publication of TW200712405A publication Critical patent/TW200712405A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device incorporating heat pipe is adapted for a heat-generating electronic device such as a central processor unit (CPU). The heat dissipation device includes a base, a heat pipe, a first fin unit and a second fin unit. The base has a first face defining a bent groove therein, and a second face opposite to the first face. The first and second fin units are respectively arranged on the first and second faces of the base. The bent grooves includes a first section near a lateral side of the base and perpendicular to the first fin unit, a second section remote from the lateral side of the base and a third section connecting the first and second sections. The heat pipe is substantially identical to the groove of the base and is embedded in the groove. The heat dissipation device has a great heat dissipating capacity by virtue of great heat-transfer capacity of the heat pipe and low temperature airflow at the lateral side of the base.
TW94130336A 2005-09-05 2005-09-05 Heat dissipating device incorporating heat pipe TWI265268B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94130336A TWI265268B (en) 2005-09-05 2005-09-05 Heat dissipating device incorporating heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94130336A TWI265268B (en) 2005-09-05 2005-09-05 Heat dissipating device incorporating heat pipe

Publications (2)

Publication Number Publication Date
TWI265268B true TWI265268B (en) 2006-11-01
TW200712405A TW200712405A (en) 2007-04-01

Family

ID=38122155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130336A TWI265268B (en) 2005-09-05 2005-09-05 Heat dissipating device incorporating heat pipe

Country Status (1)

Country Link
TW (1) TWI265268B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398212B (en) * 2007-12-31 2013-06-01 Foxconn Tech Co Ltd Heat sink
TWI414232B (en) * 2007-12-31 2013-11-01 Foxconn Tech Co Ltd Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398212B (en) * 2007-12-31 2013-06-01 Foxconn Tech Co Ltd Heat sink
TWI414232B (en) * 2007-12-31 2013-11-01 Foxconn Tech Co Ltd Heat sink

Also Published As

Publication number Publication date
TW200712405A (en) 2007-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees