TWI265268B - Heat dissipating device incorporating heat pipe - Google Patents
Heat dissipating device incorporating heat pipeInfo
- Publication number
- TWI265268B TWI265268B TW94130336A TW94130336A TWI265268B TW I265268 B TWI265268 B TW I265268B TW 94130336 A TW94130336 A TW 94130336A TW 94130336 A TW94130336 A TW 94130336A TW I265268 B TWI265268 B TW I265268B
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- heat
- heat pipe
- lateral side
- groove
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation device incorporating heat pipe is adapted for a heat-generating electronic device such as a central processor unit (CPU). The heat dissipation device includes a base, a heat pipe, a first fin unit and a second fin unit. The base has a first face defining a bent groove therein, and a second face opposite to the first face. The first and second fin units are respectively arranged on the first and second faces of the base. The bent grooves includes a first section near a lateral side of the base and perpendicular to the first fin unit, a second section remote from the lateral side of the base and a third section connecting the first and second sections. The heat pipe is substantially identical to the groove of the base and is embedded in the groove. The heat dissipation device has a great heat dissipating capacity by virtue of great heat-transfer capacity of the heat pipe and low temperature airflow at the lateral side of the base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130336A TWI265268B (en) | 2005-09-05 | 2005-09-05 | Heat dissipating device incorporating heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130336A TWI265268B (en) | 2005-09-05 | 2005-09-05 | Heat dissipating device incorporating heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI265268B true TWI265268B (en) | 2006-11-01 |
TW200712405A TW200712405A (en) | 2007-04-01 |
Family
ID=38122155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94130336A TWI265268B (en) | 2005-09-05 | 2005-09-05 | Heat dissipating device incorporating heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI265268B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI398212B (en) * | 2007-12-31 | 2013-06-01 | Foxconn Tech Co Ltd | Heat sink |
TWI414232B (en) * | 2007-12-31 | 2013-11-01 | Foxconn Tech Co Ltd | Heat sink |
-
2005
- 2005-09-05 TW TW94130336A patent/TWI265268B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI398212B (en) * | 2007-12-31 | 2013-06-01 | Foxconn Tech Co Ltd | Heat sink |
TWI414232B (en) * | 2007-12-31 | 2013-11-01 | Foxconn Tech Co Ltd | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TW200712405A (en) | 2007-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |