MY190925A - Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method - Google Patents

Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Info

Publication number
MY190925A
MY190925A MYPI2017704846A MYPI2017704846A MY190925A MY 190925 A MY190925 A MY 190925A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY 190925 A MY190925 A MY 190925A
Authority
MY
Malaysia
Prior art keywords
mold
electronic
mold cavity
holder
cavity block
Prior art date
Application number
MYPI2017704846A
Inventor
Masuda Kosaku
Nishimoto Masakazu
Miyahara Hiroaki
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of MY190925A publication Critical patent/MY190925A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

An electronic-components sealing mold (2) is provided with: a lower-mold cavity block (53) for placing a substrate (91) with electronic-components mounted on a surface thereof; an upper-mold cavity holder (23) that vertically moves in conjunction with vertical movement of the lower-mold cavity block (53) and holds the substrate (91) with the lower-mold cavity block (53); an upper-mold chess holder (22) that vertically moves in conjunction with vertical movement of the upper-mold cavity holder (23) and has through-holes; an upper-mold spring (28) that expands/contracts in conjunction with vertical movement of the upper-mold chess holder (22); an upper-mold cavity block (27) that is positioned so as to be vertically movable inside the upper-mold cavity holder (23) and forms a cavity with the lower-mold cavity block (53); and joining members (25) that are inserted in the through-holes of the upper-mold chess holder (22) so as to be slidably movable and fixed to an upper face of the upper-mold cavity block (27). The lower-mold cavity block (53) is provided with a pot part in which a plunger for injecting a molten resin covering front faces of the electronic components into the cavity can be inserted. (Figure 2)
MYPI2017704846A 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method MY190925A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015124024A JP6020667B1 (en) 2015-06-19 2015-06-19 Transfer molding machine and method of manufacturing electronic component
PCT/JP2016/050550 WO2016203779A1 (en) 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding machine, and electronic-components sealing method

Publications (1)

Publication Number Publication Date
MY190925A true MY190925A (en) 2022-05-20

Family

ID=57216899

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704846A MY190925A (en) 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Country Status (6)

Country Link
JP (1) JP6020667B1 (en)
KR (1) KR102144610B1 (en)
CN (1) CN107708956B (en)
MY (1) MY190925A (en)
TW (1) TWI668769B (en)
WO (1) WO2016203779A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6296195B1 (en) * 2017-07-21 2018-03-20 第一精工株式会社 Resin sealing mold adjustment method and resin sealing mold
TWI787417B (en) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
JP7092513B2 (en) * 2018-02-09 2022-06-28 アピックヤマダ株式会社 Mold base for compression molding dies
JP6923502B2 (en) * 2018-11-21 2021-08-18 Ｔｏｗａ株式会社 Transfer drive mechanism, resin molding device and manufacturing method of resin molded products
CN110126177A (en) * 2019-05-30 2019-08-16 开平市盈光机电科技有限公司 A kind of moulding process for the cell phone rear cover embryo material including center adjusting active type chamber by spring
JP7160770B2 (en) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 Resin molding equipment
TWI711520B (en) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 Resin sealing forming device and resin sealing forming method
CN112976666B (en) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 Dynamic balance buffer mechanism applied to compression forming die
TWI822159B (en) * 2022-06-30 2023-11-11 萬潤科技股份有限公司 Pressing device and pressing equipment
KR102498076B1 (en) * 2022-08-22 2023-02-10 에스피반도체통신 주식회사 Mold for semicondeutor chip
CN115332095B (en) * 2022-10-12 2022-12-27 安徽大华半导体科技有限公司 QFN large substrate packaging mold and method
CN117790397B (en) * 2024-02-26 2024-05-10 湖南酷牛存储科技有限公司 Multilayer memory chip packaging equipment and working method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3524205B2 (en) * 1995-04-18 2004-05-10 株式会社サイネックス Semiconductor resin sealing device
JP3280634B2 (en) * 1999-03-26 2002-05-13 松下電工株式会社 Semiconductor package manufacturing method, mold for manufacturing semiconductor package, and semiconductor package
EP1393881B1 (en) * 1999-12-16 2009-03-11 Dai-Ichi Seiko Co. Ltd. Resin sealing method
JP3368242B2 (en) * 1999-12-16 2003-01-20 第一精工株式会社 Resin sealing method and resin sealing device
JP2002219740A (en) * 2001-01-26 2002-08-06 Nec Kansai Ltd Apparatus and method for resin molding
JP2003053791A (en) * 2001-08-22 2003-02-26 Mitsubishi Electric Corp Semiconductor manufacturing apparatus and semiconductor device manufactured thereby
JP3612063B2 (en) * 2003-02-24 2005-01-19 第一精工株式会社 Resin sealing mold, resin sealing method and resin sealing apparatus using the same
JP4243177B2 (en) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
KR101001096B1 (en) * 2006-09-19 2010-12-14 다이-이치 세이코 가부시키가이샤 Resin sealing device
JP5065747B2 (en) 2007-04-27 2012-11-07 アサヒ・エンジニアリング株式会社 Semiconductor package manufacturing method and manufacturing apparatus
JP5352896B2 (en) * 2008-01-19 2013-11-27 アピックヤマダ株式会社 Transfer molding method and transfer molding apparatus
JP6058431B2 (en) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 Resin molding apparatus and resin molding method

Also Published As

Publication number Publication date
JP2017011072A (en) 2017-01-12
TWI668769B (en) 2019-08-11
KR20180018573A (en) 2018-02-21
TW201701371A (en) 2017-01-01
CN107708956A (en) 2018-02-16
CN107708956B (en) 2020-06-09
KR102144610B1 (en) 2020-08-13
JP6020667B1 (en) 2016-11-02
WO2016203779A1 (en) 2016-12-22

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