TW201701371A - Mold for encapsulating electronic components, transfer molding machine and method for encapsulating electronic components - Google Patents
Mold for encapsulating electronic components, transfer molding machine and method for encapsulating electronic components Download PDFInfo
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- TW201701371A TW201701371A TW105102207A TW105102207A TW201701371A TW 201701371 A TW201701371 A TW 201701371A TW 105102207 A TW105102207 A TW 105102207A TW 105102207 A TW105102207 A TW 105102207A TW 201701371 A TW201701371 A TW 201701371A
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- Prior art keywords
- electronic component
- mold
- plunger
- molten resin
- cavity block
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- 238000001721 transfer moulding Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 15
- 239000011347 resin Substances 0.000 claims abstract description 111
- 229920005989 resin Polymers 0.000 claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims description 64
- 238000003825 pressing Methods 0.000 claims description 22
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 12
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 description 10
- 238000000465 moulding Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005381 potential energy Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009415 formwork Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明是關於一種用於電子零件之密封的電子零件密封模具、具備該電子零件密封模具之轉移成形機、及利用該電子零件密封模具之電子零件密封方法。 The present invention relates to an electronic component sealing mold for sealing electronic parts, a transfer molding machine including the electronic component sealing mold, and an electronic component sealing method using the electronic component sealing mold.
至今，作為用於電子零件之樹脂密封的電子零件密封模具，有著使用固定式腔室塊的電子零件密封模具。然而，使用固定式腔室塊的情況下，當鑄模間隙非常狹窄的時候，會容易捲入密封樹脂或空氣。因此，會因為捲入之密封樹脂或空氣，而在電子零件之表面上，發生熔接痕或空隙，且接合線會有容易損傷的問題。 Heretofore, as an electronic component sealing mold for resin sealing of electronic parts, there is an electronic component sealing mold using a fixed chamber block. However, in the case of using a fixed chamber block, when the mold gap is very narrow, it is easy to be entangled with the sealing resin or air. Therefore, a weld mark or a void may occur on the surface of the electronic component due to the encapsulating resin or air, and the bonding wire may be easily damaged.
為解決此問題，在專利文獻1所記載之半導體封裝的製造裝置中，如其圖2(b)所示，使釜14內的柱塞15上昇，以將熔融的樹脂18a壓送至腔室內，並將樹脂18a填充於腔 室凹部7內。其後，如圖3(a)所示，將推壓軸用塊10及推壓軸進行推壓，使上模具3內的可動腔室9進一步地稍微下降而進行壓縮成形。 In order to solve this problem, in the semiconductor package manufacturing apparatus described in Patent Document 1, as shown in FIG. 2(b), the plunger 15 in the kettle 14 is raised to press the molten resin 18a into the chamber. And filling the resin 18a into the cavity Inside the chamber recess 7. Thereafter, as shown in FIG. 3(a), the pressing shaft block 10 and the pressing shaft are pressed, and the movable chamber 9 in the upper mold 3 is further slightly lowered to be compression-molded.
專利文獻1：日本專利特開2008-277470號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-277470
然而，在前述製造裝置之成形模具1中，當熔融之樹脂18a填充於腔室凹部7內之後，利用推壓軸用塊10及押壓軸進一步進行壓縮成形。因此，成形模具1中，腔室凹部7內之內壓會變更高，因而樹脂18a會容易漏出。 However, in the molding die 1 of the above-described manufacturing apparatus, after the molten resin 18a is filled in the chamber recessed portion 7, the pressing shaft block 10 and the pressing shaft are further subjected to compression molding. Therefore, in the molding die 1, the internal pressure in the chamber recess 7 is changed to be high, and the resin 18a is likely to leak.
此外，在前述製造裝置之成形模具1中，有必要安裝推壓軸用塊10及推壓軸。因此，成形模具1的構造複雜，有著製造成本較高之問題點。 Further, in the molding die 1 of the above-described manufacturing apparatus, it is necessary to attach the pressing shaft block 10 and the pressing shaft. Therefore, the structure of the forming mold 1 is complicated, and there is a problem that the manufacturing cost is high.
有鑑於前述問題點，本發明之課題在於提供一種不會發生空隙、熔接痕，且接合線不會產生損傷，同時沒有樹脂外漏，且構造簡單、製造成本較低的電子零件密封模具。 In view of the above problems, an object of the present invention is to provide an electronic component sealing mold which does not cause voids and weld lines, and which does not cause damage to the bonding wires, and which has no resin leakage, and which has a simple structure and a low manufacturing cost.
本發明之第1態樣的電子零件密封模具，包含：下模腔室塊，用以載置於表面設置有電子零件之基板；上模腔室保持部，與前述下模腔室塊之上下移動連動而進行上下移動，且與前述下模腔室塊挾持前述基板； 上模棋座保持部(chess holder)，與前述上模腔室保持部之上下移動連動而進行上下移動，並具有貫穿孔；上模彈簧件，與前述上模棋座保持部之上下移動連動而進行伸縮；上模腔室塊，在前述上模腔室保持部內定位成可上下移動，並且與前述下模腔室塊之間形成腔室；及連結構件，可滑移地插通於前述上模棋座保持部之貫穿孔中，且固定於前述上模腔室塊之上表面，在前述下模腔室塊中設置可***柱塞之釜部，該柱塞用以在前述腔室內注入覆蓋前述電子零件之表面的熔融樹脂。 An electronic component sealing mold according to a first aspect of the present invention, comprising: a lower mold chamber block for placing a substrate on which an electronic component is disposed; an upper mold chamber holding portion, and a lower mold cavity block Moving up and down to move up and down, and holding the substrate with the aforementioned lower mold cavity block; The upper mold holder holder moves up and down in conjunction with the upper and lower mold holding portions to move up and down, and has a through hole; the upper mold spring member is interlocked with the upper mold holder holding portion And stretching; the upper mold cavity block is positioned to be movable up and down in the upper mold cavity holding portion, and a cavity is formed between the lower mold cavity block; and the connecting member is slidably inserted into the foregoing a through hole of the upper die holder holding portion and fixed to the upper surface of the upper mold cavity block, and a plug portion into which the plunger is inserted is disposed in the lower mold cavity block, the plunger being used in the cavity A molten resin covering the surface of the aforementioned electronic component is injected.
根據本發明之第1態樣的電子零件密封模具，直到熔融樹脂覆蓋電子零件的上表面為止，能以較低壓力將熔融樹脂注入較寬的鑄模間隙中。因此，不會捲入熔融樹脂或空氣，且可防止空隙、熔接痕的發生，並可同時防止接合線的損傷。 According to the electronic component sealing mold of the first aspect of the invention, the molten resin can be injected into the wider mold gap at a relatively low pressure until the molten resin covers the upper surface of the electronic component. Therefore, the molten resin or the air is not caught, and the occurrence of voids and weld lines can be prevented, and damage of the bonding wires can be prevented at the same time.
此外，不需要可產生較高壓力以將覆蓋前述電子零件之上表面的熔融樹脂薄薄地壓散開的新驅動機構。因此，可得到無樹脂外漏，構造簡單，且製造成本較低的電子零件密封模具。 Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, an electronic component sealing mold having no resin leakage, a simple structure, and a low manufacturing cost can be obtained.
本發明之第2態樣的轉移成形機，包含：本發明之第1態樣的電子零件密封模具；及可來回移動地***前述釜部之柱塞，該轉移成形機安裝有執行第1次注入步驟、推壓步驟、 及第2次注入步驟之程式，該第1次注入步驟是將前述柱塞移動到用前述熔融樹脂覆蓋前述電子零件之至少上表面的位置後停止；該推壓步驟是用前述上模腔室塊的下表面壓散開前述熔融樹脂，以覆蓋前述電子零件的上表面；該第2次注入步驟是用前述柱塞將前述熔融樹脂填充到前述腔室內所殘存的空間。 A transfer molding machine according to a second aspect of the present invention includes the electronic component sealing mold according to the first aspect of the present invention, and a plunger that can be inserted back and forth into the kettle portion, and the transfer molding machine is mounted for the first time. Injection step, push step, And a second injection step of stopping the plunger to a position covering at least the upper surface of the electronic component with the molten resin; the pressing step is using the upper mold chamber The lower surface of the block is pressed to melt the molten resin to cover the upper surface of the electronic component. In the second injection step, the molten resin is filled into the space remaining in the chamber by the plunger.
本發明之第3態樣的轉移成形機，包含：本發明之第1態樣的電子零件密封模具；及可來回移動地***於前述釜部之柱塞，該轉移成形機安裝有執行第1次注入步驟、推壓步驟、及第2次注入步驟之程式，該第1次注入步驟是將前述柱塞移動到用前述熔融樹脂覆蓋前述電子零件之至少上表面的位置後，在可上下移動之狀態下停止；該推壓步驟是用前述上模腔室塊之下表面壓散開覆蓋前述電子零件之上表面的前述熔融樹脂，並同時上下移動前述柱塞；該第2次注入步驟是用前述柱塞將前述熔融樹脂填充到前述腔室內所殘存之空間。 A transfer molding machine according to a third aspect of the present invention includes the electronic component sealing mold according to the first aspect of the present invention, and a plunger that can be inserted back and forth into the kettle portion, and the transfer molding machine is mounted with the first execution. a sub-injection step, a pressing step, and a second injection step of moving the plunger to a position where at least the upper surface of the electronic component is covered with the molten resin, and then moving up and down Stopping in the state; the pressing step is to spread the molten resin covering the upper surface of the electronic component by using the lower surface of the upper mold cavity block, and simultaneously move the plunger up and down; the second injection step is The plunger fills the molten resin into a space remaining in the chamber.
根據本發明之第2態樣的轉移成形機，直到熔融樹脂覆蓋電子零件的上表面為止，能以較低壓力將熔融樹脂注入較寬的鑄模間隙中。因此，不會捲入熔融樹脂或空氣，且可防止空隙、熔接痕的發生，並可同時防止接合線 的損傷。 According to the second aspect of the present invention, in the transfer molding machine, the molten resin can be injected into the wider mold gap at a relatively low pressure until the molten resin covers the upper surface of the electronic component. Therefore, it is not involved in the molten resin or air, and the occurrence of voids and weld lines can be prevented, and the bonding wire can be prevented at the same time. Damage.
此外，不需要可產生較高壓力以將覆蓋前述電子零件之上表面的熔融樹脂薄薄地壓散開的新驅動機構。因此，可以得到具有無樹脂外漏，模具之構造簡單，且製造成本較低之電子零件密封模具的轉移成形機。 Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, it is possible to obtain a transfer molding machine having an electronic component sealing mold which is free from resin leakage, has a simple mold structure, and has a low manufacturing cost.
再者，根據本發明之第3態樣的轉移成形機，與被樹脂密封之電子零件的高度尺寸相比，即使上模腔室塊的移動量較大，也可藉由柱塞的上下移動，而調整腔室內之樹脂壓力。因此，前述腔室內之樹脂壓力不會超過特定之壓力以上。其結果為，可得到無樹脂外漏，且尺寸精度更高之樹脂密封。 Further, according to the third aspect of the present invention, the transfer molding machine can be moved up and down by the plunger even if the amount of movement of the upper mold chamber block is larger than the height of the electronic component sealed by the resin. And adjust the resin pressure in the chamber. Therefore, the resin pressure in the aforementioned chamber does not exceed a certain pressure. As a result, a resin seal having no resin leakage and higher dimensional accuracy can be obtained.
在本發明之第2或第3態樣中，也可以在前述上模腔室塊與具備前述電子零件的前述基板之間，配置剝離薄膜。 In the second or third aspect of the invention, the release film may be disposed between the upper mold cavity block and the substrate including the electronic component.
根據本實施形態，藉由前述剝離薄膜可進一步有效地防止熔融樹脂之外漏。因此，相較於習知技術，模具構造變得簡單，可得到具備製造成本較低之電子零件密封模具的轉移成形機。 According to this embodiment, it is possible to further effectively prevent leakage of the molten resin by the release film. Therefore, compared with the prior art, the mold structure is simplified, and a transfer molding machine having an electronic component sealing mold having a low manufacturing cost can be obtained.
在本發明之第2或第3態樣中，也可在與前述連結構件之間，可交換地配置位置調整用墊片。 In the second or third aspect of the present invention, the position adjusting spacer may be exchangeably disposed between the connecting member and the connecting member.
根據本實施形態，即使因電子零件之容積而使得進行樹脂密封之樹脂部的厚度尺寸不一致，只要交換前述位置調整用墊片的話，就可調整前述上模腔室塊的位置。因此，不需要交換上模腔室塊之全體。其結果為，可得到通用性 之轉移成形機。 According to the present embodiment, even if the thickness of the resin portion to be resin-sealed is not uniform due to the volume of the electronic component, the position of the upper mold cavity block can be adjusted by exchanging the position adjustment spacer. Therefore, it is not necessary to exchange the entire upper mold cavity block. As a result, versatility is obtained Transfer molding machine.
在本發明之第2或第3態樣中，也可在從下方側支持前述下模腔室塊之下模腔室保持部，配置可調整前述下模腔室塊之上下位置的浮動構件。 In the second or third aspect of the invention, the mold chamber holding portion under the lower mold cavity block may be supported from the lower side, and the floating member capable of adjusting the upper and lower positions of the lower mold chamber block may be disposed.
根據本實施形態，藉由使浮動構件上下移動，而可使下模腔室塊進行上下移動。因此，即使基板的厚度尺寸不一致，由於可吸收誤差而成形，因此可得到成品率較佳之電子零件密封模具。 According to this embodiment, the lower mold cavity block can be moved up and down by moving the floating member up and down. Therefore, even if the thickness of the substrate is not uniform, it can be formed by absorption error, so that an electronic component sealing mold having a better yield can be obtained.
此外，根據本實施形態，即使是將厚度尺寸不同之基板進行樹脂密封的情況下，也可使浮動構件上下移動而進行樹脂密封。因此，可得到通用性之轉移成形機。 Further, according to the present embodiment, even when the substrate having different thicknesses is resin-sealed, the floating member can be moved up and down to perform resin sealing. Therefore, a versatile transfer molding machine can be obtained.
本發明之第4態樣的電子零件密封方法，是一種利用本發明之第1態樣的電子零件密封模具之電子零件密封方法，包含：第1次注入步驟，是將前述柱塞移動到用前述熔融樹脂覆蓋前述電子零件之至少上表面的位置後停止；壓散步驟，是用前述上模腔室塊之下表面壓散開覆蓋前述電子零件之上表面的前述熔融樹脂；及第2次注入步驟，是用前述柱塞將前述熔融樹脂填充到前述腔室內所殘存的空間。 An electronic component sealing method according to a fourth aspect of the present invention is the electronic component sealing method of the electronic component sealing mold according to the first aspect of the present invention, comprising: the first injection step of moving the plunger to use Stopping after the molten resin covers at least the upper surface of the electronic component; the step of dispersing is to melt the surface of the upper surface of the upper mold cavity block to cover the surface of the electronic component; and the second injection In the step, the molten resin is filled into the space remaining in the chamber by the plunger.
根據本發明之第4態樣的電子零件密封方法，直到熔融樹脂覆蓋電子零件的上表面為止，能以較低壓力將熔融樹脂注入較寬的鑄模間隙中。因此，不會捲入熔融樹脂或空氣，且可防止空隙、熔接痕的發生，並可同時防止 接合線的損傷。 According to the electronic component sealing method of the fourth aspect of the invention, the molten resin can be injected into the wider mold gap at a lower pressure until the molten resin covers the upper surface of the electronic component. Therefore, it does not get caught in the molten resin or air, and can prevent the occurrence of voids and weld lines, and can simultaneously prevent Damage to the bond wire.
此外，不需要可產生較高壓力以將覆蓋前述電子零件之上表面的熔融樹脂薄薄地壓散開的新驅動機構。因此，可得到無樹脂外漏，模具構造簡單，且製造成本較低的電子零件密封方法。 Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, an electronic component sealing method which is free from resin leakage, has a simple mold structure, and has a low manufacturing cost can be obtained.
本發明之第5態樣的電子零件密封方法，是一種使用本發明之第1態樣的電子零件密封模具之電子零件密封方法，包含：第1次注入步驟，是將前述柱塞移動到用前述熔融樹脂覆蓋前述電子零件之至少上表面的位置後，在可上下移動之狀態下停止；推壓步驟，是用前述上模腔室塊之下表面壓散開覆蓋前述電子零件之上表面的前述熔融樹脂，並同時上下移動前述柱塞；及第2次注入步驟，是用前述柱塞將前述熔融樹脂填充到前述腔室內所殘存之空間。 An electronic component sealing method according to a fifth aspect of the present invention is the electronic component sealing method using the electronic component sealing mold according to the first aspect of the present invention, comprising: the first injection step of moving the plunger to use After the molten resin covers at least the upper surface of the electronic component, it is stopped in a state of being movable up and down; and the pressing step is to press the lower surface of the upper mold cavity block to cover the upper surface of the electronic component. The resin is melted and simultaneously moved up and down; and in the second injection step, the molten resin is filled into the space remaining in the chamber by the plunger.
根據本發明之第5態樣的電子零件密封方法，直到熔融樹脂覆蓋電子零件的上表面為止，能以較低之壓力將熔融樹脂注入在較寬之鑄模間隙中。因此，不會捲入熔融樹脂或空氣，且可防止空隙、熔接痕之發生，且可同時防止接合線的損傷。 According to the electronic component sealing method of the fifth aspect of the invention, the molten resin can be injected into the wider mold gap at a lower pressure until the molten resin covers the upper surface of the electronic component. Therefore, the molten resin or the air is not caught, and the occurrence of voids and weld lines can be prevented, and the damage of the bonding wire can be prevented at the same time.
此外，不需要新的驅動機構來產生較高之壓力，以將覆蓋於前述電子零件之上表面的熔融樹脂薄薄地擴展開來。因此，可得到無樹脂外漏，模具之構造簡單，且製造成本 較低的電子零件密封方法。 In addition, a new drive mechanism is not required to generate a higher pressure to spread the molten resin covering the upper surface of the aforementioned electronic component thinly. Therefore, the resin-free leakage can be obtained, the structure of the mold is simple, and the manufacturing cost is obtained. Lower electronic part sealing method.
特別是，與被樹脂密封之電子零件的高度尺寸相比，即使上模腔室塊的移動量較大，也可藉由柱塞的上下移動，而調整腔室內之樹脂壓力。因此，前述腔室內之樹脂壓力不會超過特定之壓力以上。其結果為，可具有得到無樹脂外漏，且尺寸精度更高之樹脂密封的效果。 In particular, compared with the height dimension of the electronic component sealed by the resin, even if the amount of movement of the upper mold cavity block is large, the resin pressure in the chamber can be adjusted by the vertical movement of the plunger. Therefore, the resin pressure in the aforementioned chamber does not exceed a certain pressure. As a result, it is possible to obtain a resin sealing effect without resin leakage and higher dimensional accuracy.
1‧‧‧轉移成形機 1‧‧‧Transformation molding machine
10‧‧‧繫桿 10‧‧‧ tied
11‧‧‧固定定模板 11‧‧‧Fixed template
12‧‧‧上模座 12‧‧‧Upper mold base
13‧‧‧上模基座板 13‧‧‧Upper base plate
14‧‧‧上模保持塊 14‧‧‧Upper mold holding block
14a、18a‧‧‧突起部 14a, 18a‧‧‧ protrusion
15‧‧‧可動定模板 15‧‧‧ movable template
16‧‧‧下模座 16‧‧‧ lower mold base
17‧‧‧下模基座板 17‧‧‧Mold base plate
18‧‧‧下模保持塊 18‧‧‧Down mold holding block
19‧‧‧轉移單元 19‧‧‧Transfer unit
2‧‧‧電子零件密封模具 2‧‧‧Electronic parts sealing mould
20‧‧‧上模棋座 20‧‧‧上模棋座
21‧‧‧上模支持塊 21‧‧‧Upper support block
22‧‧‧上模棋座保持部 22‧‧‧Upper Chess Holder
22a、58、60、64、70‧‧‧貫穿孔 22a, 58, 60, 64, 70‧‧‧through holes
23‧‧‧上模腔室保持部 23‧‧‧Upper mold chamber holding unit
23a‧‧‧擷取部 23a‧‧‧Capture Department
24‧‧‧上模止擋塊 24‧‧‧Upper stop block
25‧‧‧連結棒 25‧‧‧Links
26‧‧‧上模後座板 26‧‧‧Upper mold back seat
27‧‧‧上模腔室塊 27‧‧‧Upper cavity block
27a‧‧‧腔室 27a‧‧‧室
28‧‧‧上模第1彈簧件 28‧‧‧Upper mold first spring parts
3‧‧‧上模具 3‧‧‧Upper mold
30‧‧‧上模後備板 30‧‧‧Upper formwork board
31‧‧‧上模銷板 31‧‧‧Upper die plate
32‧‧‧擷取部用頂銷 32‧‧‧Capture department for top selling
33‧‧‧凹部 33‧‧‧ recess
34‧‧‧上模螺栓 34‧‧‧Upper bolt
35‧‧‧上模防脫落環 35‧‧‧Top mold anti-shedding ring
36‧‧‧上模第2彈簧件 36‧‧‧Upper mold 2 spring parts
4‧‧‧下模具 4‧‧‧ Lower mold
40‧‧‧位置調整用墊片 40‧‧‧ Position adjustment gasket
50‧‧‧下模棋座 50‧‧‧The lower chess seat
51‧‧‧下模支持塊 51‧‧‧Mold support block
52‧‧‧下模棋座保持部 52‧‧‧The lower die holder
53‧‧‧下模腔室塊 53‧‧‧ Lower cavity block
55‧‧‧下模後座板 55‧‧‧ Lower mold rear seat plate
56‧‧‧下模銷板 56‧‧‧ Lower die plate
57‧‧‧成形品用頂銷 57‧‧‧Production for topping
59‧‧‧下模止擋塊 59‧‧‧Mold stop block
61‧‧‧下模螺栓 61‧‧‧Down bolt
62‧‧‧防脫落環 62‧‧‧Anti-falling ring
63‧‧‧下模彈簧件 63‧‧‧ Lower mold spring parts
65‧‧‧柱塞 65‧‧‧Plunger
66‧‧‧釜部 66‧‧‧ Kettle
71‧‧‧浮動構件 71‧‧‧ Floating components
91‧‧‧基板 91‧‧‧Substrate
92‧‧‧電子零件(半導體元件) 92‧‧‧Electronic components (semiconductor components)
93‧‧‧平板樹脂 93‧‧‧ flat resin
93a‧‧‧熔融樹脂 93a‧‧‧ molten resin
94‧‧‧成形品 94‧‧‧Formed products
95‧‧‧剝離薄膜 95‧‧‧Release film
S1~S9‧‧‧步驟 S1~S9‧‧‧Steps
圖1是本發明之第1實施形態的轉移成形機之概略圖。 Fig. 1 is a schematic view of a transfer molding machine according to a first embodiment of the present invention.
圖2是表示開啟圖1所示之電子零件密封模具之狀態的截面圖。 Fig. 2 is a cross-sectional view showing a state in which the electronic component sealing mold shown in Fig. 1 is opened.
圖3是圖2所示之電子零件密封模具的部分擴大截面圖。 Fig. 3 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 2;
圖4是表示利用本發明之第1實施形態的轉移成形機之電子零件密封方法的流程圖。 4 is a flow chart showing a method of sealing an electronic component by the transfer molding machine according to the first embodiment of the present invention.
圖5是表示在圖2所示之電子零件密封模具中，配置平板樹脂及基板之狀態的截面圖。 Fig. 5 is a cross-sectional view showing a state in which a flat plate resin and a substrate are placed in the electronic component sealing mold shown in Fig. 2;
圖6是表示圖5所示之電子零件密封模具的第1次閉模狀態之截面圖。 Fig. 6 is a cross-sectional view showing the first closed mold state of the electronic component sealing mold shown in Fig. 5;
圖7是表示在圖6所示之電子零件密封模具之腔室，透過柱塞而注入熔融樹脂之狀態的截面圖。 Fig. 7 is a cross-sectional view showing a state in which a molten resin is injected through a plunger in a chamber of the electronic component sealing mold shown in Fig. 6;
圖8是圖7所示之電子零件密封模具的部分擴大截面圖。 Fig. 8 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 7.
圖9是表示中途停止圖8所示之柱塞的動作之狀態的截 面圖。 Fig. 9 is a cross-sectional view showing a state in which the operation of the plunger shown in Fig. 8 is stopped in the middle. Surface map.
圖10是圖9所示之電子零件密封模具的部分擴大截面圖。 Fig. 10 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 9.
圖11是表示下降圖9所示之電子零件密封模具之上模腔室塊的第2次閉模狀態之截面圖。 Fig. 11 is a cross-sectional view showing the second closed state of the cavity block above the electronic component sealing mold shown in Fig. 9.
圖12是圖11所示之電子零件密封模具的部分擴大截面圖。 Fig. 12 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 11;
圖13是表示圖9所示之電子零件密封模具的柱塞再度上推，將熔融樹脂填充至腔室內之狀態的截面圖。 Fig. 13 is a cross-sectional view showing a state in which the plunger of the electronic component sealing mold shown in Fig. 9 is pushed up again to fill the molten resin into the chamber.
圖14是圖13所示之電子零件密封模具的部分擴大截面圖。 Figure 14 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Figure 13 .
圖15是表示開啟圖14所示之電子零件密封模具，且頂出成形品之狀態的截面圖。 Fig. 15 is a cross-sectional view showing a state in which the electronic component sealing mold shown in Fig. 14 is opened and the molded article is ejected.
圖16是表示本發明之第2實施形態的轉移成形機之截面圖。 Fig. 16 is a cross-sectional view showing a transfer molding machine according to a second embodiment of the present invention.
圖17是表示本發明之第3實施形態的轉移成形機之截面圖。 Fig. 17 is a cross-sectional view showing a transfer molding machine according to a third embodiment of the present invention.
圖18是圖17所示之電子零件密封模具的部分擴大截面圖。 Fig. 18 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 17;
圖19是表示本發明之第4實施形態的轉移成形機之截面圖。 Fig. 19 is a cross-sectional view showing a transfer molding machine in a fourth embodiment of the present invention.
圖20是表示本發明之第5實施形態的轉移成形機之截面圖。 Figure 20 is a cross-sectional view showing a transfer molding machine in a fifth embodiment of the present invention.
圖21是用以說明圖20所示之電子零件密封模具的填充 步驟之截面圖。 21 is a view for explaining filling of the electronic component sealing mold shown in FIG. A cross-sectional view of the steps.
圖22是圖21所示之電子零件密封模具的部分擴大截面圖。 Fig. 22 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 21;
圖23是用以說明圖20所示之電子零件密封模具的填充步驟之截面圖。 Figure 23 is a cross-sectional view for explaining a filling step of the electronic component sealing mold shown in Figure 20 .
圖24是圖23所示之電子零件密封模具的部分擴大截面圖。 Figure 24 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Figure 23 .
針對本發明之第1實施形態的轉移成形機1，參照圖1至圖14進行說明。 The transfer molding machine 1 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 14 .
(轉移成形機1的構成) (Configuration of Transfer Forming Machine 1)
轉移成形機1是將設置於基板91之表面的電子零件92(半導體元件、電容器、電阻器、電感器等)，利用平板樹脂93(參照圖5等)以進行樹脂密封。 The transfer molding machine 1 is an electronic component 92 (a semiconductor element, a capacitor, a resistor, an inductor, or the like) provided on the surface of the substrate 91, and is sealed with a resin by a flat plate resin 93 (see FIG. 5 and the like).
如圖1所示，轉移成形機1包含電子零件密封模具2、轉移單元19、及圖2等所示之柱塞65。電子零件密封模具2具有上模具3及下模具4。 As shown in Fig. 1, the transfer molding machine 1 includes an electronic component sealing mold 2, a transfer unit 19, and a plunger 65 shown in Fig. 2 and the like. The electronic component sealing mold 2 has an upper mold 3 and a lower mold 4.
上模具3具有上模座12與上模棋座20。上模棋座20是相對於紙面往垂直方向可滑移地組裝在上模座12的下方側。因此，可因應樹脂密封之製品，而交換上模棋座20之全體。上模棋座20是藉由圖未示之固定具而固定在上模座12上。 The upper mold 3 has an upper die holder 12 and an upper die holder 20. The upper die holder 20 is slidably assembled to the lower side of the upper die holder 12 with respect to the paper surface in the vertical direction. Therefore, the entire mold block 20 can be exchanged in response to the resin-sealed product. The upper die holder 20 is fixed to the upper die holder 12 by a fixture not shown.
下模具4具有下模座16與上模棋座50。上模棋座 50是在下模座16的上方側且相對於紙面往垂直方向可滑移地組裝在下模座16。因此，可因應樹脂密封之製品，而交換下模棋座50之全體。上模棋座20是藉由圖未示之固定具而固定在下模座16上。 The lower mold 4 has a lower die holder 16 and an upper die holder 50. Upper die chess 50 is assembled to the lower die holder 16 on the upper side of the lower die holder 16 and slidably movable in the vertical direction with respect to the paper surface. Therefore, the entire mold block 50 can be exchanged in response to the resin-sealed product. The upper die block 20 is fixed to the lower die holder 16 by a fixture not shown.
上模具3的上模座12是安裝在利用4個繫桿10所支持之固定定模板11的下表面。下模具4的下模座16安裝在可動定模板15的上表面，且可動定模板15被支持成可沿著繫桿10而上下移動。 The upper die holder 12 of the upper mold 3 is mounted on the lower surface of the fixed fixed platen 11 supported by the four tie bars 10. The lower die holder 16 of the lower mold 4 is mounted on the upper surface of the movable stationary die plate 15, and the movable stationary die plate 15 is supported to be movable up and down along the tie bar 10.
轉移單元19具備用以驅動可動定模板15、柱塞65等之油壓機器、馬達等(圖未示)。油壓機器與馬達各自連接至控制器(圖未示)，並依照儲存於控制器之記憶體中的程式而動作。 The transfer unit 19 includes a hydraulic device, a motor, and the like (not shown) for driving the movable fixed platen 15, the plunger 65, and the like. The hydraulic machine and the motor are each connected to a controller (not shown) and act in accordance with a program stored in the memory of the controller.
接著，針對電子零件密封模具1的上模具3與下模具4的構成進行說明。 Next, the configuration of the upper mold 3 and the lower mold 4 of the electronic component sealing mold 1 will be described.
(上模具3) (Upper mold 3)
上模座12. Upper mold base 12.
如圖2所示，上模座12具有固定於固定定模板11之下表面的上模基座板13、及固定於上模基座板13之下表面的上模保持塊14。在上模保持塊14的內側面設置有位置限制用的突起部14a。 As shown in FIG. 2, the upper die holder 12 has an upper die base plate 13 fixed to a lower surface of the fixed die plate 11, and an upper die holding block 14 fixed to a lower surface of the upper die base plate 13. A projection portion 14a for position restriction is provided on the inner side surface of the upper mold holding block 14.
上模棋座20. The upper chess house 20.
如圖2所示，上模棋座20是由與上模座12(上模基座板13及上模保持塊14)相異之構成零件所構成。上模棋座20的上模支持塊21配置於設置在上模保持塊14之突起部14a與下 述之上模後座板26之間，且位置限制於上下方向(模具之開閉方向)上。在上模支持塊21的下表面固定有截面略成ㄈ字形狀(或截面略成U字形狀)的上模棋座保持部22。在上模棋座保持部22的內周面固定有上模腔室保持部23，且上模棋座保持部22的上表面上固定有複數個上模止擋塊24。 As shown in Fig. 2, the upper die block 20 is constituted by components different from the upper die base 12 (the upper die base plate 13 and the upper die holding block 14). The upper mold support block 21 of the upper mold holder 20 is disposed on the protrusion 14a and the lower portion of the upper mold holding block 14 The upper mold rear seat plate 26 is described between the upper and lower sides (the opening and closing direction of the mold). The upper die holding portion 22 having a substantially U-shaped cross section (or a U-shaped cross section) is fixed to the lower surface of the upper mold supporting block 21. The upper mold chamber holding portion 23 is fixed to the inner peripheral surface of the upper mold holder holding portion 22, and a plurality of upper mold stoppers 24 are fixed to the upper surface of the upper mold holding portion 22.
藉此，上模支持塊21、上模棋座保持部22、上模腔室保持部23、及上模止擋塊24可一體地上下移動。 Thereby, the upper mold support block 21, the upper mold holder holding portion 22, the upper mold chamber holding portion 23, and the upper mold stopper 24 can be integrally moved up and down.
上模棋座保持部22上設置有複數個貫穿孔22a，且各個貫穿孔22a中可滑移地插通有連結棒25。連結棒25的上端固定有上模後座板26，且連結棒25的下端固定有上模腔室塊27。因此，上模後座板26與上模腔室塊27是透過連結棒25而成一體化，且，以特定之間隔彼此相對。再者，連結棒25是申請專利範圍之「連結構件」之其中一例。 The upper die holder holding portion 22 is provided with a plurality of through holes 22a, and the connecting bars 25 are slidably inserted into the respective through holes 22a. An upper mold rear seat plate 26 is fixed to the upper end of the connecting rod 25, and an upper mold chamber block 27 is fixed to the lower end of the connecting rod 25. Therefore, the upper mold rear seat plate 26 and the upper mold cavity block 27 are integrated by the connecting rod 25, and are opposed to each other at a specific interval. Further, the connecting rod 25 is an example of the "connecting member" of the patent application.
在上模後座板26與上模棋座保持部22之間，配置有上模第1彈簧件28。上模第1彈簧件28分別賦予上模後座板26與上模棋座保持部22朝外的勢能。 An upper mold first spring member 28 is disposed between the upper mold rear seat plate 26 and the upper mold holder holding portion 22. The upper mold first spring member 28 imparts potential energy to the outer mold rear seat panel 26 and the upper mold holder holding portion 22, respectively.
上模棋座20還具有上模後備板30與上模銷板31。在上模後備板30與上模銷板31設置有銷孔，且擷取(cull)部用頂銷32從上模後備板30側插通於該銷孔。藉此，上模後備板30與上模銷板31上下地成為一體化，且可防止擷取部用頂銷32脫落。藉此，上模後備板30、上模銷板31及擷取部用頂銷32可一體地上下移動。且，擷取部用頂銷32可進出上模腔室保持部23的擷取部23a。如圖2所示，成形模具開啟的狀態下，擷取部用頂銷32會沉入，而不會突出於擷 取部23a內。 The upper dieboard 20 also has an upper dieboard 30 and an upper dieboard 31. The upper die plate 30 and the upper die plate 31 are provided with pin holes, and the cull portion pin 32 is inserted into the pin hole from the upper die backup plate 30 side. Thereby, the upper die rest plate 30 and the upper die pin plate 31 are integrated up and down, and the pick-up portion top pin 32 can be prevented from coming off. Thereby, the upper die rest plate 30, the upper die pin plate 31, and the pick-up portion top pin 32 can be integrally moved up and down. Further, the picking portion can enter and exit the picking portion 23a of the upper mold cavity holding portion 23 by the top pin 32. As shown in Fig. 2, in the state where the forming mold is opened, the picking portion is sunk by the top pin 32 without protruding from the 撷. The inside of the portion 23a is taken.
上模後備板30與上模銷板31內設置有凹部33，且上模螺栓34插通於該凹部33中。凹部33內收納有上模第2彈簧件36。上模螺栓34的下端部螺合於上模棋座保持部22的上表面而成為一體化。且，上模防脫落環35卡合於上模螺栓34的頭部，因此，可防止收納於凹部33內之上模第2彈簧件36脫落。 A recess 33 is provided in the upper die plate 30 and the upper die plate 31, and the upper die bolt 34 is inserted into the recess 33. The upper mold second spring member 36 is housed in the recess 33. The lower end portion of the upper die bolt 34 is screwed to the upper surface of the upper die holding portion 22 to be integrated. Further, since the upper mold fall prevention ring 35 is engaged with the head portion of the upper mold bolt 34, it is possible to prevent the second spring member 36 of the upper mold stored in the concave portion 33 from coming off.
在上模後備板30及上模銷板31設置有複數個貫穿孔，且該等貫穿孔中，插通有貫穿上模棋座保持部22之貫穿孔22a的連結棒25，並且同時插通有上模止擋塊24及上模第1彈簧件28。且，上模後備板30及上模銷板31，可在上模後座板26與上模棋座保持部22之間上下地移動。上模後備板30及上模銷板31，可透過上模螺栓34及上模第2彈簧件36，而朝上模棋座保持部22側被賦予勢能。 The upper mold backup plate 30 and the upper die plate 31 are provided with a plurality of through holes, and the connecting rods 25 penetrating through the through holes 22a of the upper die holding portion 22 are inserted into the through holes, and simultaneously inserted. There is an upper die stop 24 and an upper die first spring member 28. Further, the upper mold backup plate 30 and the upper die pin plate 31 are vertically movable between the upper mold rear seat plate 26 and the upper mold holding portion 22. The upper mold backup plate 30 and the upper die pin plate 31 are permeable to the upper mold bolt 34 and the upper mold second spring member 36, and are provided with potential energy toward the upper mold holder holding portion 22.
再者，圖2中，圖示了利用圖未示之上限固定止擋塊與下限可變止擋塊將上模後備板30及上模銷板31限制位置的狀態。 Further, in Fig. 2, a state in which the upper mold backup plate 30 and the upper die plate 31 are restricted by the upper limit fixed stopper and the lower limit variable stopper, which are not shown, are illustrated.
(下模具4) (lower mold 4)
下模座16. Lower die holder 16.
如圖2所示，下模座16具有固定於可動定模板15之上表面的下模基座板17、及固定於下模基座板17之上表面的下模保持塊18。在下模保持塊18之內側面設置有位置限制用的突起部18a。 As shown in FIG. 2, the lower die holder 16 has a lower die base plate 17 fixed to the upper surface of the movable stationary die plate 15, and a lower die holding block 18 fixed to the upper surface of the lower die base plate 17. A projection 18a for position restriction is provided on the inner side surface of the lower mold holding block 18.
下模棋座50. Lower die chess 50.
如圖2所示，下模棋座50是由與下模座16(下模基座板17及下模保持塊18)相異之構成零件所構成。也就是說，下模棋座50的下模支持塊51配置於設置在下模保持塊18之突起部18a與下模基座板17之間，且位置限制於上下方向(模具之開閉方向)上。在下模支持塊51的上表面固定有截面略成ㄈ字形狀(或是截面略成U字形狀)之下模棋座保持部52。在下模棋座保持部52的內周面固定有下模腔室塊53上。 As shown in Fig. 2, the lower die block 50 is constituted by components different from the lower die base 16 (the lower die base plate 17 and the lower die holding block 18). That is, the lower mold supporting block 51 of the lower mold holder 50 is disposed between the protruding portion 18a of the lower mold holding block 18 and the lower mold base plate 17, and the position is restricted to the up and down direction (the opening and closing direction of the mold). . On the upper surface of the lower mold supporting block 51, a mold holder holding portion 52 having a slightly U-shaped cross section (or a U-shaped cross section) is fixed. The lower mold cavity block 53 is fixed to the inner peripheral surface of the lower mold holder holding portion 52.
且，下模支持塊51、下模棋座保持部52、及下模腔室塊53雖成一體化，但其等不會上下移動。 Further, although the lower mold supporting block 51, the lower mold holding portion 52, and the lower mold chamber block 53 are integrated, they do not move up and down.
下模棋座50具有下模後座板55與下模銷板56。在下模銷板56設置有銷孔，且成形品用頂銷57從下模後座板55側插通於該銷孔。藉此，前述下模後座板55與下模銷板56成為一體化，且可防止成形品用頂銷57脫落。成形品用頂銷57設置成可從下模腔室塊53之上表面進出。 The lower die block 50 has a lower die rear seat plate 55 and a lower die pin plate 56. A pin hole is provided in the lower die plate 56, and the molded product pin 57 is inserted into the pin hole from the side of the lower die rear seat plate 55. Thereby, the lower mold rear seat plate 55 and the lower mold pin plate 56 are integrated, and the molded article pin 57 can be prevented from coming off. The molded article is provided with a top pin 57 so as to be able to enter and exit from the upper surface of the lower mold cavity block 53.
在下模後座板55及下模銷板56設置有貫穿孔58，且該貫穿孔58***通。下模止擋塊59固定於下模基座板17的上表面。藉此，下模後座板55、下模銷板56及成形品用頂銷57可一體地上下移動。 A through hole 58 is provided in the lower mold rear seat plate 55 and the lower die pin plate 56, and the through hole 58 is inserted. The lower mold stopper 59 is fixed to the upper surface of the lower mold base plate 17. Thereby, the lower mold rear seat plate 55, the lower mold pin plate 56, and the molded article top pin 57 can be integrally moved up and down.
在下模後座板55及下模銷板56設置有截面略成T字形狀之貫穿孔60，且下模螺栓61插通於該貫穿孔60內。下模螺栓61的軸部螺合於下模棋座保持部52的下表面而成為一體化。此外，下模螺栓61之頭部透過防脫落環62而卡合於下模銷板56。且，如圖2所示，成形模具在開啟的狀態下，成形品用推針57會沉入，而不會從下模腔室塊53的上 表面突出。 The lower mold rear seat plate 55 and the lower mold pin plate 56 are provided with a through hole 60 having a T-shaped cross section, and the lower mold bolt 61 is inserted into the through hole 60. The shaft portion of the lower die bolt 61 is screwed to the lower surface of the lower die holding portion 52 to be integrated. Further, the head of the lower die bolt 61 is engaged with the lower die pin plate 56 through the fall-prevention ring 62. Further, as shown in Fig. 2, in the state in which the forming mold is opened, the molded article push-up needle 57 is sunk without being applied from the lower mold chamber block 53. The surface is prominent.
在下模棋座保持部52與下模銷板56之間配置有下模彈簧件63。下模彈簧件63分別賦予下模棋座保持部52與下模銷板56朝外的勢能。 A lower mold spring 63 is disposed between the lower die holding portion 52 and the lower die plate 56. The lower die spring members 63 respectively impart potential energy to the lower die holder holding portion 52 and the lower die pin plate 56.
下模基座板17、下模後座板55、下模銷板56、下模棋座保持部52、及下模腔室塊53設置有沿著同一軸心而貫穿該等之貫穿孔64。釜部66形成於貫穿孔64內，且柱塞65可來回移動地收納於該釜部66中。 The lower die base plate 17, the lower die rear seat plate 55, the lower die pin plate 56, the lower die holder holding portion 52, and the lower mold cavity block 53 are provided through the through holes 64 along the same axis. . The kettle portion 66 is formed in the through hole 64, and the plunger 65 is housed in the kettle portion 66 so as to be movable back and forth.
(轉移成形機1的動作) (Operation of Transfer Forming Machine 1)
接著，說明關於轉移成形機1的動作。 Next, the operation of the transfer molding machine 1 will be described.
轉移成形機1是依照儲存於轉移單元19之記憶體中的程式(電子零件密封方法)而作動。如圖4所示，該電子零件密封方法包含以下之步驟S1至步驟S9。 The transfer molding machine 1 is operated in accordance with a program (electronic component sealing method) stored in the memory of the transfer unit 19. As shown in FIG. 4, the electronic component sealing method includes the following steps S1 to S9.
在步驟S1中，如圖5所示，將表面設置有電子零件92之基板91配置於下模腔室塊53。在步驟S2中，如圖5所示，將平板樹脂93投入釜部66內。 In step S1, as shown in FIG. 5, the substrate 91 on which the electronic component 92 is provided is disposed in the lower mold cavity block 53. In step S2, as shown in FIG. 5, the flat plate resin 93 is put into the kettle portion 66.
在步驟S3中，如圖6所示，驅動轉移單元19使可動定模板15(圖1)上昇，而使下模棋座50抵接於上模棋座20。此時，基板91僅透過上模第1彈簧件28之彈簧力，而挾持於上模腔室保持部23與下模腔室塊53之間(第1次閉模狀態)。藉此，在上模具3與下模具4之間形成腔室27a。此時，連結棒25所支持之上模腔室塊27，不會從原本之位置移位。 In step S3, as shown in FIG. 6, the drive transfer unit 19 raises the movable fixed platen 15 (FIG. 1) to bring the lower die block 50 into contact with the upper die block 20. At this time, the substrate 91 is only held between the upper mold chamber holding portion 23 and the lower mold chamber block 53 by the spring force of the upper mold first spring member 28 (the first closed mold state). Thereby, the chamber 27a is formed between the upper mold 3 and the lower mold 4. At this time, the upper mold cavity block 27 supported by the connecting rod 25 is not displaced from the original position.
在步驟S4中，如圖7所示，驅動轉移單元19而將柱塞65上推。藉此，柱塞65相對於擷取部23a推壓平板樹脂 93，一邊加壓且一邊促使對平板樹脂93之加熱。被加壓之平板樹脂93開始熔融，且熔融之平板樹脂(以下，稱為熔融樹脂)93a注入於擷取部23a內(圖7，圖8)，並注入於腔室27a內。 In step S4, as shown in Fig. 7, the transfer unit 19 is driven to push up the plunger 65. Thereby, the plunger 65 pushes the plate resin with respect to the scooping portion 23a. 93, while heating, promotes heating of the flat plate resin 93. The pressed flat plate resin 93 starts to melt, and the molten flat plate resin (hereinafter referred to as molten resin) 93a is injected into the scooping portion 23a (FIG. 7, FIG. 8) and injected into the chamber 27a.
在步驟S3、S4中，連結棒25所支持之上模腔室塊27不會從原本的位置移位，因此可使電子零件92的上表面與上模腔室塊27的下表面之間的腔室間隙變大。因此，熔融樹脂93a不會滯留，而圓滑地覆蓋電子零件92的表面。 In steps S3, S4, the upper mold cavity block 27 supported by the connecting rod 25 is not displaced from the original position, so that the upper surface of the electronic component 92 and the lower surface of the upper mold cavity block 27 can be The chamber gap becomes larger. Therefore, the molten resin 93a does not stay, and smoothly covers the surface of the electronic component 92.
在步驟S5中，使柱塞65停止於熔融樹脂93a之填充結束前的特定位置上(圖9，圖10)。此時的柱塞65的推壓量較佳為總行程之75%以上且為85%以下。藉由將推壓量設為總行程之75%以上，可提供充分的熔融樹脂93a至膜腔27a內，藉此充分地覆蓋電子零件92的上表面，可抑制因第2次之柱塞65的填充作業所產生之空隙、熔接痕等。此外，藉由將推壓量設為總行程之85%以下，在下壓上模膜腔塊27時，可抑制作用於注入至腔室27a內之熔融樹脂的壓力變大，而可防止壓縮成形。 In step S5, the plunger 65 is stopped at a specific position before the filling of the molten resin 93a is completed (Fig. 9, Fig. 10). The pressing amount of the plunger 65 at this time is preferably 75% or more and 85% or less of the total stroke. By setting the pressing amount to 75% or more of the total stroke, a sufficient molten resin 93a can be supplied into the inside of the film chamber 27a, thereby sufficiently covering the upper surface of the electronic component 92, and the second plunger 65 can be suppressed. The voids, weld lines, etc. generated by the filling operation. Further, by setting the pressing amount to 85% or less of the total stroke, when the upper mold cavity block 27 is pressed down, the pressure acting on the molten resin injected into the chamber 27a can be suppressed from becoming large, and compression molding can be prevented. .
在步驟S6中，如圖11所示，使可動定模板15再度上昇而成為第2次閉模狀態。在第2閉模狀態下，下模座16之下模基座板17上推，且下模棋座50之下模腔室塊53透過基板91而上推上模棋座20之上模腔室保持部23，而使上模第1彈簧件28壓縮。因此，電子零件92的上表面接近於上模腔室塊27的下表面。其結果為，覆蓋電子零件92的上表面之熔融樹脂93a被上模腔室塊27的下表面壓散開而變薄。此 時，熔融樹脂93a沒有完全地填充在腔室27a內。 In step S6, as shown in FIG. 11, the movable fixed platen 15 is raised again to become the second closed mode state. In the second closed mode state, the lower die base plate 17 is pushed up by the lower mold base 16, and the lower mold block block 53 passes through the substrate 91 and pushes up the upper mold cavity 20 The upper holding portion 23 compresses the upper mold first spring member 28. Therefore, the upper surface of the electronic component 92 is close to the lower surface of the upper mold cavity block 27. As a result, the molten resin 93a covering the upper surface of the electronic component 92 is crushed and thinned by the lower surface of the upper mold cavity block 27. this At this time, the molten resin 93a is not completely filled in the chamber 27a.
再者，根據第1實施形態，在步驟S3之第1次閉模狀態至步驟S6之第2次閉模狀態之間，基板91受到上模第1彈簧件28之彈簧力挾持，另一方面，腔室27a內之樹脂壓力不會大於特定之壓力以上。因此，可防止熔融樹脂93a從上模具3與下模具4之接合面外漏。 According to the first embodiment, the substrate 91 is held by the spring force of the first spring member 28 of the upper mold between the first mold closing state in the step S3 and the second mold closing state in the step S6. The resin pressure in the chamber 27a is not greater than a specific pressure. Therefore, it is possible to prevent the molten resin 93a from leaking from the joint surface of the upper mold 3 and the lower mold 4.
在步驟S7中，如圖13所示，使柱塞65再度上昇，將殘留在釜部66內之熔融樹脂93a從擷取部23a壓出至腔室27a內。在步驟S8中，將熔融樹脂93a完全地填充至腔室27a後(圖14)，以特定時間、特定壓力進行保壓保持，而使熔融樹脂93a硬化。 In step S7, as shown in Fig. 13, the plunger 65 is again raised, and the molten resin 93a remaining in the kettle portion 66 is pushed out from the scooping portion 23a into the chamber 27a. In step S8, after the molten resin 93a is completely filled into the chamber 27a (FIG. 14), the molten resin 93a is hardened by holding and holding at a specific pressure for a specific time.
在步驟S9中，使可動定模板15下降，而使下模棋座50離開上模棋座20。藉此，解除圖未示之下限可變止擋塊。因此，圖未示之上模頂桿，將上模後備板30及上模銷板31朝下方側下壓。其結果為，擷取部用頂銷32頂出成形品，而將成形品94從上模腔室塊27分離(圖15)。於此同時，圖未示之下模頂桿將下模後座板55及下模銷板56朝上方上推。因此，成形品用頂銷57頂出成形品94，而從下模腔室塊53分離出成形品94。 In step S9, the movable platen 15 is lowered, and the lower die block 50 is moved away from the upper die block 20. Thereby, the lower limit variable stopper shown in the figure is released. Therefore, the upper mold top bar is not shown, and the upper mold backup plate 30 and the upper mold pin plate 31 are pressed downward toward the lower side. As a result, the scooping portion ejects the molded product by the top pin 32, and the molded product 94 is separated from the upper mold cavity block 27 (FIG. 15). At the same time, the lower ejector pin 55 pushes the lower die rear seat plate 55 and the lower die pin plate 56 upward as shown. Therefore, the molded article push-out of the molded article 94 by the top pin 57, and the molded article 94 is separated from the lower mold cavity block 53.
之後，藉由重覆同樣的動作，而可連續地進行樹脂密封作業。 Thereafter, the resin sealing operation can be continuously performed by repeating the same operation.
(其他的實施形態) (Other embodiments)
接著，說明關於本發明之其他實施形態的轉移成形機。 Next, a transfer molding machine according to another embodiment of the present invention will be described.
第2實施形態之轉移成形機1中，如圖16所示，在使可動定模板15上昇而使下模棋座50抵接於上模棋座20的步驟S3(圖6)之前，在上模腔室塊27與下模腔室塊53之間設置剝離薄膜95。剝離薄膜95中，矽氧樹脂(silicone)等之脫模材料被塗布於薄膜上。由於第2實施形態之其他構成與第1實施形態相同，因此在圖16中使用與圖1至圖15相同之標號，並省略說明。 In the transfer molding machine 1 of the second embodiment, as shown in Fig. 16, before the movable fixed die plate 15 is raised to bring the lower die block 50 into contact with the upper die pad 20 (Fig. 6), A release film 95 is disposed between the cavity block 27 and the lower die cavity block 53. In the release film 95, a release material such as silicone is applied to the film. The other configuration of the second embodiment is the same as that of the first embodiment. Therefore, the same reference numerals as in Figs. 1 to 15 are used in Fig. 16, and the description thereof is omitted.
根據第2實施形態，藉由使用剝離薄膜95，可有效地防止樹脂外漏，並具有成形品94變得更容易從上模腔室塊27脫模的優點。 According to the second embodiment, by using the release film 95, it is possible to effectively prevent the resin from leaking out, and it is advantageous in that the molded article 94 is more easily released from the upper mold cavity block 27.
第3實施形態之轉移成形機1中，如圖17、圖18所示，連結棒25之下端面與上模腔室塊27之間配置位置調整用墊片40。位置調整用墊片40是設置成可在相對於紙面往垂直方向滑移，並可因應電子零件92而交換。由於第3實施形態之其他構成與第1實施形態相同，因此在圖17、圖18中使用與圖1到圖15相同之標號，並省略說明。 In the transfer molding machine 1 of the third embodiment, as shown in Figs. 17 and 18, a position adjusting spacer 40 is disposed between the lower end surface of the connecting rod 25 and the upper mold chamber block 27. The position adjusting spacer 40 is provided to be slidable in the vertical direction with respect to the paper surface, and can be exchanged in response to the electronic component 92. The other configuration of the third embodiment is the same as that of the first embodiment. Therefore, the same reference numerals as in Figs. 1 to 15 are used in Figs. 17 and 18, and the description thereof is omitted.
根據第3實施形態，即使電子零件92之厚度尺寸或樹脂部之厚度尺寸相異，也可藉由交換位置調整用墊片40，而調整上模腔室塊27的位置。因此，不需要交換上模腔室塊27全體。其結果為，具有可得到通用性之轉移成形機1的優點。 According to the third embodiment, even if the thickness dimension of the electronic component 92 or the thickness dimension of the resin portion is different, the position of the upper mold cavity block 27 can be adjusted by exchanging the position adjusting pad 40. Therefore, it is not necessary to exchange the entire upper mold cavity block 27. As a result, there is an advantage that the transfer molding machine 1 having versatility can be obtained.
第4實施形態之轉移成形機1中，如圖19所示，在下模棋座保持部52設置有貫穿孔70，且浮動構件71可沿著軸心方向(上下方向)來回移動地配置於該貫穿孔70中。浮動 構件71是藉由圖未示之油壓機器、彈簧件及栓(cotter)等來驅動。關於第4實施形態之其他構成是與第1實施形態相同，因此在圖19中使用與圖1至圖15相同之標號，並省略說明。 In the transfer molding machine 1 of the fourth embodiment, as shown in FIG. 19, the lower die holder holding portion 52 is provided with a through hole 70, and the floating member 71 is disposed to be movable back and forth along the axial direction (vertical direction). Through the hole 70. float The member 71 is driven by a hydraulic machine, a spring member, a cotter, etc., which are not shown. The other configuration of the fourth embodiment is the same as that of the first embodiment. Therefore, in FIG. 19, the same reference numerals as those in FIGS. 1 to 15 are used, and the description thereof is omitted.
根據第4實施形態，藉由使浮動構件71在軸心方向上來回移動，而可調整下模腔室塊53之位置。此外，根據第4實施形態，藉由使浮動構件71上下移動，而使下模腔室塊53可上下移動。因此，即使基板91的厚度尺寸不一致，也可吸收誤差並成形，因而可得到成品率優良之轉移成形機。此外，根據第4實施形態，即使將厚度尺寸相異之基板91進行樹脂密封的情況下，也可使浮動構件71上下移動來進行樹脂密封。因此，具有可得到通用性之轉移成形機1的優點。 According to the fourth embodiment, the position of the lower mold cavity block 53 can be adjusted by moving the floating member 71 back and forth in the axial direction. Further, according to the fourth embodiment, the lower mold chamber block 53 can be moved up and down by moving the floating member 71 up and down. Therefore, even if the thickness of the substrate 91 does not match, the error can be absorbed and formed, and a transfer molding machine excellent in yield can be obtained. Further, according to the fourth embodiment, even when the substrate 91 having different thicknesses is resin-sealed, the floating member 71 can be moved up and down to perform resin sealing. Therefore, there is an advantage of the transfer molding machine 1 which is versatile.
第5實施形態之轉移成形機1中，如圖20到圖24所示，設置在基板91表面上的電子零件92的高度尺寸較小，且基板91之表面到成形後之樹脂表面的厚度尺寸也較小。舉例來說，電子零件92的高度尺寸為0.1mm，基板91的表面至成形後之樹脂部的表面之高度尺寸為0.2mm，且上模腔室塊27的移動距離為0.5mm。 In the transfer molding machine 1 of the fifth embodiment, as shown in Figs. 20 to 24, the height dimension of the electronic component 92 provided on the surface of the substrate 91 is small, and the thickness of the surface of the substrate 91 to the surface of the resin after molding is small. Also small. For example, the height dimension of the electronic component 92 is 0.1 mm, the height of the surface of the substrate 91 to the surface of the formed resin portion is 0.2 mm, and the moving distance of the upper mold cavity block 27 is 0.5 mm.
因此，如圖20所示，僅利用上模第1彈簧件28的彈簧力將基板91挾持在上模腔室保持部23與下模腔室塊53，而成為第1次閉模狀態。藉此，在上模腔室塊27的下表面形成腔室27a。 Therefore, as shown in FIG. 20, the substrate 91 is held by the upper mold chamber holding portion 23 and the lower mold chamber block 53 only by the spring force of the upper mold first spring member 28, and is in the first closed state. Thereby, the chamber 27a is formed on the lower surface of the upper mold chamber block 27.
接著，如圖21所示，將柱塞65上推後，柱塞65將平板樹脂93推壓至擷取部23a，藉此進行加壓並同時促使 加熱。因此，如圖21所示，平板樹脂93開始熔融，且熔融樹脂93a注入於擷取部23a內，接著，注入至腔室27a內。此時，電子零件92的上表面與上模腔室塊27的下表面之間的腔室間隙較大。因此，熔融樹脂93a不會滯留，並圓滑地覆蓋電子零件92的表面。 Next, as shown in FIG. 21, after the plunger 65 is pushed up, the plunger 65 pushes the plate resin 93 to the scooping portion 23a, thereby performing pressurization and simultaneously promoting heating. Therefore, as shown in FIG. 21, the flat plate resin 93 starts to melt, and the molten resin 93a is injected into the scooping portion 23a, and then injected into the chamber 27a. At this time, the chamber gap between the upper surface of the electronic component 92 and the lower surface of the upper mold cavity block 27 is large. Therefore, the molten resin 93a does not stay and smoothly covers the surface of the electronic component 92.
然後，將柱塞65停止於填充結束前的特定位置。只是，此時的柱塞65的推壓量雖然是可將電子零件92之表面以熔融樹脂93a確實覆蓋的推壓量，但並非是將熔融樹脂93a完全地填充於腔室27a內的推壓量。因此，因為腔室27a內不會超過特定之樹脂壓力以上，所以熔融樹脂93a不會從上模具3與下模具4之接合面漏出。 Then, the plunger 65 is stopped at a specific position before the end of filling. However, the pressing amount of the plunger 65 at this time is a pressing amount that can reliably cover the surface of the electronic component 92 with the molten resin 93a, but is not the pressing of completely filling the molten resin 93a in the chamber 27a. the amount. Therefore, since the inside of the chamber 27a does not exceed a specific resin pressure or more, the molten resin 93a does not leak from the joint surface of the upper mold 3 and the lower mold 4.
再者，如圖22所示，使可動定模板15(圖1)再度上昇。藉此，下模座16之下模基座板17上推，且下模棋座50之下模腔室塊53透過基板91而上推上模棋座20之上模腔室保持部23，而使上模第1彈簧件28壓縮。因此，電子零件92的上表面接近於上模腔室塊27的下表面(圖23)。其結果為，覆蓋電子零件92的上表面之熔融樹脂93a被上模腔室塊27的下表面壓散開而變薄，且同時成為第2次閉模狀態。此時，雖然熔融樹脂93a在腔室27a內被壓散開，但柱塞65也下降。因此，腔室27a內之樹脂壓力不會大於特定之壓力以上，熔融樹脂93a不會從上模具3與下模具4之接合面漏出。 Further, as shown in Fig. 22, the movable fixed platen 15 (Fig. 1) is raised again. Thereby, the lower die base plate 17 of the lower die holder 16 is pushed up, and the lower mold cavity block 53 of the lower die block 50 is pushed up through the substrate 91 to push up the upper mold cavity holding portion 23 of the die block 20, The first spring member 28 of the upper mold is compressed. Therefore, the upper surface of the electronic component 92 is close to the lower surface of the upper mold cavity block 27 (Fig. 23). As a result, the molten resin 93a covering the upper surface of the electronic component 92 is shrunk and thinned by the lower surface of the upper mold cavity block 27, and at the same time, it is in the second closed state. At this time, although the molten resin 93a is dispersed in the chamber 27a, the plunger 65 is also lowered. Therefore, the resin pressure in the chamber 27a is not greater than a specific pressure, and the molten resin 93a does not leak from the joint surface of the upper mold 3 and the lower mold 4.
接著，藉由使柱塞65再度上昇，將殘留在釜部66內之熔融樹脂93a從擷取部23a壓出於腔室27a內。然後，將熔融樹脂93a完全地填充於前述腔室27a內之後，以特定時 間、特定壓力進行保壓保持，而使熔融樹脂93a硬化。 Then, by causing the plunger 65 to rise again, the molten resin 93a remaining in the kettle portion 66 is pressed out of the chamber 27a from the scooping portion 23a. Then, after the molten resin 93a is completely filled in the aforementioned chamber 27a, at a specific time The pressure and the specific pressure are maintained, and the molten resin 93a is hardened.
根據第5實施形態，在成為第2次閉模狀態之前，藉由使柱塞65上下移動，而將腔室27a內調整在特定的壓力以內。因此，即使上模腔室塊27更深入地推壓，也不會造成壓縮成形，因而具有可進行尺寸精度較高的樹脂密封的優點。 According to the fifth embodiment, the inside of the chamber 27a is adjusted to a specific pressure by moving the plunger 65 up and down before the second mold closing state. Therefore, even if the upper mold cavity block 27 is pressed more deeply, compression molding is not caused, and thus there is an advantage that a resin seal having high dimensional accuracy can be performed.
以上，雖然藉由實施形態來說明本發明，但本發明不受實施形態所限制，在不脫離本發明之主旨的範圍中，可進行種種的改良及設計上的變更。此外，可藉由自由地組合各實施形態所記載之特徵，而實現任意的實施形態。 The present invention is not limited by the embodiments, and various modifications and changes in design may be made without departing from the spirit and scope of the invention. Further, any of the embodiments can be realized by freely combining the features described in the respective embodiments.
12‧‧‧上模座 12‧‧‧Upper mold base
13‧‧‧上模基座板 13‧‧‧Upper base plate
14‧‧‧上模保持塊 14‧‧‧Upper mold holding block
14a、18a‧‧‧突起部 14a, 18a‧‧‧ protrusion
16‧‧‧下模座 16‧‧‧ lower mold base
17‧‧‧下模基座板 17‧‧‧Mold base plate
18‧‧‧下模保持塊 18‧‧‧Down mold holding block
2‧‧‧電子零件密封模具 2‧‧‧Electronic parts sealing mould
20‧‧‧上模棋座 20‧‧‧上模棋座
21‧‧‧上模支持塊 21‧‧‧Upper support block
22‧‧‧上模棋座保持部 22‧‧‧Upper Chess Holder
22a、58、60、64‧‧‧貫穿孔 22a, 58, 60, 64‧‧‧through holes
23‧‧‧上模腔室保持部 23‧‧‧Upper mold chamber holding unit
23a‧‧‧擷取部 23a‧‧‧Capture Department
24‧‧‧上模止擋塊 24‧‧‧Upper stop block
25‧‧‧連結棒 25‧‧‧Links
26‧‧‧上模後座板 26‧‧‧Upper mold back seat
27‧‧‧上模腔室塊 27‧‧‧Upper cavity block
27a‧‧‧腔室 27a‧‧‧室
28‧‧‧上模第1彈簧件 28‧‧‧Upper mold first spring parts
3‧‧‧上模具 3‧‧‧Upper mold
30‧‧‧上模後備板 30‧‧‧Upper formwork board
31‧‧‧上模銷板 31‧‧‧Upper die plate
32‧‧‧擷取部用頂銷 32‧‧‧Capture department for top selling
34‧‧‧上模螺栓 34‧‧‧Upper bolt
36‧‧‧上模第2彈簧件 36‧‧‧Upper mold 2 spring parts
4‧‧‧下模具 4‧‧‧ Lower mold
50‧‧‧下模棋座 50‧‧‧The lower chess seat
51‧‧‧下模支持塊 51‧‧‧Mold support block
52‧‧‧下模棋座保持部 52‧‧‧The lower die holder
53‧‧‧下模腔室塊 53‧‧‧ Lower cavity block
55‧‧‧下模後座板 55‧‧‧ Lower mold rear seat plate
56‧‧‧下模銷板 56‧‧‧ Lower die plate
57‧‧‧成形品用頂銷 57‧‧‧Production for topping
59‧‧‧下模止擋塊 59‧‧‧Mold stop block
61‧‧‧下模螺栓 61‧‧‧Down bolt
62‧‧‧防脫落環 62‧‧‧Anti-falling ring
63‧‧‧下模彈簧件 63‧‧‧ Lower mold spring parts
65‧‧‧柱塞 65‧‧‧Plunger
66‧‧‧釜部 66‧‧‧ Kettle
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| JP2015-124024 | 2015-06-19 | ||
| JP2015124024A JP6020667B1 (en) | 2015-06-19 | 2015-06-19 | Transfer molding machine and method of manufacturing electronic component |
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| TW201701371A true TW201701371A (en) | 2017-01-01 |
| TWI668769B TWI668769B (en) | 2019-08-11 |
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| JP (1) | JP6020667B1 (en) |
| KR (1) | KR102144610B1 (en) |
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| TWI720327B (en) * | 2017-07-21 | 2021-03-01 | 日商第一精工股份有限公司 | Method for adjusting mold for resin sealing and mold for resin sealing |
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| TWI787417B (en) * | 2018-02-09 | 2022-12-21 | 日商山田尖端科技股份有限公司 | Mold for compression molding and compression molding device |
| JP7092513B2 (en) * | 2018-02-09 | 2022-06-28 | アピックヤマダ株式会社 | Mold base for compression molding dies |
| JP6923502B2 (en) * | 2018-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Transfer drive mechanism, resin molding device and manufacturing method of resin molded products |
| CN110126177A (en) * | 2019-05-30 | 2019-08-16 | 开平市盈光机电科技有限公司 | A kind of moulding process for the cell phone rear cover embryo material including center adjusting active type chamber by spring |
| JP7160770B2 (en) * | 2019-07-22 | 2022-10-25 | アピックヤマダ株式会社 | Resin molding equipment |
| TWI711520B (en) * | 2019-09-11 | 2020-12-01 | 日商朝日科技股份有限公司 | Resin sealing forming device and resin sealing forming method |
| CN112976666B (en) * | 2019-12-12 | 2022-07-26 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
| TWI822159B (en) * | 2022-06-30 | 2023-11-11 | 萬潤科技股份有限公司 | Pressing device and pressing equipment |
| KR102498076B1 (en) * | 2022-08-22 | 2023-02-10 | 에스피반도체통신 주식회사 | Mold for semicondeutor chip |
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| JP3368242B2 (en) * | 1999-12-16 | 2003-01-20 | 第一精工株式会社 | Resin sealing method and resin sealing device |
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| TWI720327B (en) * | 2017-07-21 | 2021-03-01 | 日商第一精工股份有限公司 | Method for adjusting mold for resin sealing and mold for resin sealing |
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| JP2017011072A (en) | 2017-01-12 |
| TWI668769B (en) | 2019-08-11 |
| KR20180018573A (en) | 2018-02-21 |
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| CN107708956A (en) | 2018-02-16 |
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| KR102144610B1 (en) | 2020-08-13 |
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| WO2016203779A1 (en) | 2016-12-22 |
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