PH12020552144A1 - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents

Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Info

Publication number
PH12020552144A1
PH12020552144A1 PH12020552144A PH12020552144A PH12020552144A1 PH 12020552144 A1 PH12020552144 A1 PH 12020552144A1 PH 12020552144 A PH12020552144 A PH 12020552144A PH 12020552144 A PH12020552144 A PH 12020552144A PH 12020552144 A1 PH12020552144 A1 PH 12020552144A1
Authority
PH
Philippines
Prior art keywords
mould
electronic components
insert
encapsulating electronic
producing
Prior art date
Application number
PH12020552144A
Inventor
Sebastianus Hubertus Maria Kersjes
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of PH12020552144A1 publication Critical patent/PH12020552144A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulate, wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. The invention further relates to an insert for use in said mould and a method for encapsulating electronic components mounted on a carrier using said mould.
PH12020552144A 2018-06-18 2020-12-10 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components PH12020552144A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2021145A NL2021145B1 (en) 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
PCT/NL2019/050374 WO2019245364A1 (en) 2018-06-18 2019-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Publications (1)

Publication Number Publication Date
PH12020552144A1 true PH12020552144A1 (en) 2021-06-21

Family

ID=63145170

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12020552144A PH12020552144A1 (en) 2018-06-18 2020-12-10 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Country Status (8)

Country Link
JP (1) JP7391051B2 (en)
KR (1) KR20210022002A (en)
CN (1) CN112262461A (en)
NL (1) NL2021145B1 (en)
PH (1) PH12020552144A1 (en)
SG (1) SG11202011472VA (en)
TW (1) TWI834678B (en)
WO (1) WO2019245364A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114679840B (en) * 2022-03-28 2024-05-24 杭州电子科技大学 Flexible device packaging structure and packaging method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4658353B2 (en) * 2001-03-01 2011-03-23 ルネサスエレクトロニクス株式会社 Resin mold and resin mold package manufacturing method
NL1019042C2 (en) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Method for encapsulating a chip and / or other object.
JP4102634B2 (en) * 2002-09-27 2008-06-18 Ｔｏｗａ株式会社 Resin injection device for electronic parts
JP2004128303A (en) * 2002-10-04 2004-04-22 Towa Corp Underfill resin mold substrate and individual piece, and underfill resin molding method and die
JP4443334B2 (en) * 2004-07-16 2010-03-31 Ｔｏｗａ株式会社 Resin sealing molding method of semiconductor element
WO2007088835A1 (en) * 2006-02-03 2007-08-09 Mitsui Chemicals, Inc. Hollow package made of resin, and manufacturing method therefor
JP2007288081A (en) * 2006-04-20 2007-11-01 Towa Corp Resin seal molding device of electronic component
EP2192825A1 (en) * 2008-11-26 2010-06-02 Osram Gesellschaft mit Beschränkter Haftung An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process
CN102822271B (en) * 2010-03-25 2014-12-31 住友电木株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
JP5630652B2 (en) * 2011-01-06 2014-11-26 日立化成株式会社 Epoxy resin molding material for sealing and electronic component device
JP6422447B2 (en) * 2014-01-14 2018-11-14 アピックヤマダ株式会社 Resin mold and resin molding method

Also Published As

Publication number Publication date
KR20210022002A (en) 2021-03-02
WO2019245364A1 (en) 2019-12-26
TWI834678B (en) 2024-03-11
JP7391051B2 (en) 2023-12-04
CN112262461A (en) 2021-01-22
SG11202011472VA (en) 2020-12-30
TW202000416A (en) 2020-01-01
NL2021145B1 (en) 2020-01-06
JP2021531643A (en) 2021-11-18

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