MY167740A - Mold cleaning sheet - Google Patents
Mold cleaning sheetInfo
- Publication number
- MY167740A MY167740A MYPI2012700662A MYPI2012700662A MY167740A MY 167740 A MY167740 A MY 167740A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY 167740 A MY167740 A MY 167740A
- Authority
- MY
- Malaysia
- Prior art keywords
- mold cleaning
- cleaning members
- width
- blocks
- mold
- Prior art date
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011254241A JP5741398B2 (ja) | 2011-11-21 | 2011-11-21 | 金型クリーニングシート |
Publications (1)
Publication Number | Publication Date |
---|---|
MY167740A true MY167740A (en) | 2018-09-24 |
Family
ID=48489653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2012700662A MY167740A (en) | 2011-11-21 | 2012-09-14 | Mold cleaning sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5741398B2 (ja) |
KR (1) | KR102002175B1 (ja) |
CN (2) | CN103128884B (ja) |
MY (1) | MY167740A (ja) |
SG (1) | SG190510A1 (ja) |
TW (1) | TWI516353B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5741398B2 (ja) * | 2011-11-21 | 2015-07-01 | 日立化成株式会社 | 金型クリーニングシート |
CN104194645B (zh) * | 2014-08-07 | 2016-05-11 | 湖北迪曼特科技有限公司 | 用于去除待修模具中残铝的清模饼及其制备和使用方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY102412A (en) * | 1986-12-11 | 1992-06-17 | Nitto Electric Ind Co | Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet. |
JPH07304044A (ja) * | 1994-05-11 | 1995-11-21 | Toshiba Chem Corp | 金型のクリーニング材およびクリーニング方法 |
JP3943145B2 (ja) * | 1994-11-04 | 2007-07-11 | 株式会社ルネサステクノロジ | 成形金型のクリーニング方法および半導体チップの樹脂封止方法 |
JP2862852B2 (ja) * | 1997-04-21 | 1999-03-03 | 日東電工株式会社 | 金型再生用シートおよびそれを用いた金型の洗浄方法 |
WO2004052610A1 (ja) * | 2002-12-06 | 2004-06-24 | Nippon Carbide Kogyo Kabushiki Kaisha | 成形金型用クリーニング材及びクリーニング方法 |
JP3780284B2 (ja) * | 2004-01-16 | 2006-05-31 | 株式会社ルネサステクノロジ | 成形金型クリーニング用シート |
JP4373291B2 (ja) * | 2004-06-24 | 2009-11-25 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
TWI414410B (zh) * | 2006-01-27 | 2013-11-11 | Nitto Denko Corp | 模具再生用片材 |
JP5245040B2 (ja) * | 2006-01-27 | 2013-07-24 | 日立化成株式会社 | 金型再生用シート |
JP5245039B2 (ja) * | 2006-01-27 | 2013-07-24 | 日立化成株式会社 | 金型再生用シート |
JP2007242924A (ja) * | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | 半導体装置の製造方法 |
MY148591A (en) * | 2006-05-25 | 2013-05-15 | Nitto Denko Corp | Mold cleaning composition |
JP5089273B2 (ja) * | 2006-10-23 | 2012-12-05 | 日東電工株式会社 | 金型再生用シート |
JP5322140B2 (ja) * | 2006-12-13 | 2013-10-23 | 日立化成株式会社 | 金型再生用シート |
JP2008213313A (ja) * | 2007-03-05 | 2008-09-18 | Nitto Denko Corp | 金型再生用シートおよびそれを用いた金型クリーニング方法 |
JP5741398B2 (ja) * | 2011-11-21 | 2015-07-01 | 日立化成株式会社 | 金型クリーニングシート |
-
2011
- 2011-11-21 JP JP2011254241A patent/JP5741398B2/ja active Active
-
2012
- 2012-09-14 TW TW101133862A patent/TWI516353B/zh active
- 2012-09-14 SG SG2012068771A patent/SG190510A1/en unknown
- 2012-09-14 KR KR1020120101875A patent/KR102002175B1/ko active IP Right Grant
- 2012-09-14 CN CN201210342468.XA patent/CN103128884B/zh active Active
- 2012-09-14 CN CN201510971755.0A patent/CN105538556A/zh active Pending
- 2012-09-14 MY MYPI2012700662A patent/MY167740A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102002175B1 (ko) | 2019-07-19 |
KR20130056162A (ko) | 2013-05-29 |
CN103128884A (zh) | 2013-06-05 |
JP2013107287A (ja) | 2013-06-06 |
CN105538556A (zh) | 2016-05-04 |
CN103128884B (zh) | 2016-01-27 |
TWI516353B (zh) | 2016-01-11 |
TW201321160A (zh) | 2013-06-01 |
SG190510A1 (en) | 2013-06-28 |
JP5741398B2 (ja) | 2015-07-01 |
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