MY167740A - Mold cleaning sheet - Google Patents

Mold cleaning sheet

Info

Publication number
MY167740A
MY167740A MYPI2012700662A MYPI2012700662A MY167740A MY 167740 A MY167740 A MY 167740A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY 167740 A MY167740 A MY 167740A
Authority
MY
Malaysia
Prior art keywords
mold cleaning
cleaning members
width
blocks
mold
Prior art date
Application number
MYPI2012700662A
Inventor
Takashima Kouichi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY167740A publication Critical patent/MY167740A/en

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

The present invention relates to a mold cleaning sheet for cleaning a mold having a cavity which has an opening in a shape of an oval or a quadrangle, in which the mold cleaning sheet includes a sheet-like base material (1) and a plurality of belt-shaped mold cleaning members (2) formed on at least one side of the sheet-like base material (1), formed from an unvulcanized rubber composition or a thermosetting resin composition, and disposed in a pattern that the plurality of belt-shaped mold cleaning members (2) are aligned in parallel with a clearance on the base material; each of the mold cleaning members (2) is cut into a plurality of blocks in a longitudinal direction of the mold cleaning members (2) at predetermined intervals to form a column including the plurality of blocks; each of the blocks has a length (Y) of from 3 mm to 50 mm, a clearance between neighboring blocks in the column including the plurality of blocks is 0.1 mm or more and is not larger than a width (X) of the mold cleaning members (2), a clearance between neighboring mold cleaning members (2) in a direction of the width (X) of the mold cleaning members (2) is not smaller than 1/2 of the width (X) of the mold cleaning members (2) and not larger than the width (X) of the mold cleaning members (2), and the width (X) of the mold cleaning members (2) is 1 mm or more and not larger than 4/5 of a breadth of the opening of the cavity.
MYPI2012700662A 2011-11-21 2012-09-14 Mold cleaning sheet MY167740A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011254241A JP5741398B2 (en) 2011-11-21 2011-11-21 Mold cleaning sheet

Publications (1)

Publication Number Publication Date
MY167740A true MY167740A (en) 2018-09-24

Family

ID=48489653

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012700662A MY167740A (en) 2011-11-21 2012-09-14 Mold cleaning sheet

Country Status (6)

Country Link
JP (1) JP5741398B2 (en)
KR (1) KR102002175B1 (en)
CN (2) CN105538556A (en)
MY (1) MY167740A (en)
SG (1) SG190510A1 (en)
TW (1) TWI516353B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5741398B2 (en) * 2011-11-21 2015-07-01 日立化成株式会社 Mold cleaning sheet
CN104194645B (en) * 2014-08-07 2016-05-11 湖北迪曼特科技有限公司 For removing clear mould cake and the preparation and application thereof of the residual aluminium of mould to be repaired

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY102412A (en) * 1986-12-11 1992-06-17 Nitto Electric Ind Co Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet.
JPH07304044A (en) * 1994-05-11 1995-11-21 Toshiba Chem Corp Method and material for cleaning mold
JP3943145B2 (en) * 1994-11-04 2007-07-11 株式会社ルネサステクノロジ Mold cleaning method and semiconductor chip resin sealing method
JP2862852B2 (en) * 1997-04-21 1999-03-03 日東電工株式会社 Mold regeneration sheet and mold cleaning method using the same
KR100593284B1 (en) * 2002-12-06 2006-06-28 닛뽕 카바이도 고교 가부시키가이샤 Cleaning material for molding metal die, and cleaning method
JP3780284B2 (en) * 2004-01-16 2006-05-31 株式会社ルネサステクノロジ Mold cleaning sheet
JP4373291B2 (en) * 2004-06-24 2009-11-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
TWI414410B (en) * 2006-01-27 2013-11-11 Nitto Denko Corp Sheet for regenerating a mold
JP5245039B2 (en) * 2006-01-27 2013-07-24 日立化成株式会社 Mold regeneration sheet
JP5245040B2 (en) * 2006-01-27 2013-07-24 日立化成株式会社 Mold regeneration sheet
JP2007242924A (en) * 2006-03-09 2007-09-20 Renesas Technology Corp Manufacturing method of semiconductor device
MY148591A (en) * 2006-05-25 2013-05-15 Nitto Denko Corp Mold cleaning composition
JP5089273B2 (en) * 2006-10-23 2012-12-05 日東電工株式会社 Mold regeneration sheet
JP5322140B2 (en) * 2006-12-13 2013-10-23 日立化成株式会社 Mold regeneration sheet
JP2008213313A (en) * 2007-03-05 2008-09-18 Nitto Denko Corp Sheet for regeneration of mold and mold cleaning method using the sheet
JP5741398B2 (en) * 2011-11-21 2015-07-01 日立化成株式会社 Mold cleaning sheet

Also Published As

Publication number Publication date
TW201321160A (en) 2013-06-01
KR102002175B1 (en) 2019-07-19
CN105538556A (en) 2016-05-04
KR20130056162A (en) 2013-05-29
CN103128884A (en) 2013-06-05
SG190510A1 (en) 2013-06-28
CN103128884B (en) 2016-01-27
JP5741398B2 (en) 2015-07-01
JP2013107287A (en) 2013-06-06
TWI516353B (en) 2016-01-11

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