MX2023009641A - Pelicula, metodo para manufacturar la misma y metodo para manufacturar un paquete semiconductor. - Google Patents
Pelicula, metodo para manufacturar la misma y metodo para manufacturar un paquete semiconductor.Info
- Publication number
- MX2023009641A MX2023009641A MX2023009641A MX2023009641A MX2023009641A MX 2023009641 A MX2023009641 A MX 2023009641A MX 2023009641 A MX2023009641 A MX 2023009641A MX 2023009641 A MX2023009641 A MX 2023009641A MX 2023009641 A MX2023009641 A MX 2023009641A
- Authority
- MX
- Mexico
- Prior art keywords
- film
- manufacturing
- semiconductor package
- swabbing
- conducted
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 abstract 1
- 238000004458 analytical method Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/12—Polyvinylhalogenides containing fluorine
- B32B2327/18—PTFE, i.e. polytetrafluoroethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
Abstract
La presente invención se refiere a una película que comprende al menos un material base y una capa antiestática, la película siendo tal que: la proporción del área de superficie de desprendimiento cuando se conduce una prueba de desprendimiento de cinta después de 300% de estiramiento monoaxial a 25°C es menor que 5%; la expresión (H2-H1)=0 se satisface cuando se conduce una prueba de frotamiento después de 300% de estiramiento monoaxial a 25°C (donde H1 es la turbidez antes del frotamiento, y H2 es la turbidez después del frotamiento); o ya sea O/C está dentro del intervalo de 0.010-0.200, o N/F está dentro del intervalo de 0.010-0.100, en el análisis de la composición química de la superficie del lado de la capa antiestática del material base de conformidad con el espectroscopio de fotoelectrón de rayos-X. También se proporcionan un método para manufacturar la película, y un método para manufacturar un paquete semiconductor usando la película.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021028909 | 2021-02-25 | ||
PCT/JP2021/046391 WO2022180998A1 (ja) | 2021-02-25 | 2021-12-15 | フィルム及びその製造方法、並びに半導体パッケージの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2023009641A true MX2023009641A (es) | 2023-08-24 |
Family
ID=83048053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2023009641A MX2023009641A (es) | 2021-02-25 | 2021-12-15 | Pelicula, metodo para manufacturar la misma y metodo para manufacturar un paquete semiconductor. |
Country Status (8)
Country | Link |
---|---|
US (1) | US20230395398A1 (es) |
JP (1) | JPWO2022180998A1 (es) |
KR (1) | KR20230151995A (es) |
CN (1) | CN116867645A (es) |
DE (1) | DE112021006525T5 (es) |
MX (1) | MX2023009641A (es) |
TW (1) | TW202243873A (es) |
WO (1) | WO2022180998A1 (es) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003141935A (ja) * | 2001-10-31 | 2003-05-16 | Toppan Printing Co Ltd | 透明導電性カバーテープ |
JP5633884B2 (ja) * | 2010-09-22 | 2014-12-03 | 信越ポリマー株式会社 | 離型用フィルム |
JP2014513013A (ja) * | 2011-03-04 | 2014-05-29 | スリーエム イノベイティブ プロパティズ カンパニー | カバーテープ、コンポーネントパッケージ、及びこれらを作製する方法 |
SG10201807671QA (en) | 2014-03-07 | 2018-10-30 | Agc Inc | Mold release film, process for its production and process for producing semiconductor package |
KR102476428B1 (ko) | 2014-12-09 | 2022-12-09 | 에이지씨 가부시키가이샤 | 이형 필름 및 반도체 패키지의 제조 방법 |
CN107210236B (zh) | 2015-02-06 | 2019-06-07 | Agc株式会社 | 膜、其制造方法以及使用该膜的半导体元件的制造方法 |
WO2020145404A1 (ja) * | 2019-01-11 | 2020-07-16 | 株式会社ユポ・コーポレーション | 記録用紙及びその用途、並びに記録用紙の製造方法 |
DE102019121507B4 (de) | 2019-08-09 | 2021-04-22 | Schott Ag | Beleuchtungseinrichtung mit Lichtkonversionselement |
CN114342051A (zh) * | 2019-09-05 | 2022-04-12 | 昭和电工材料株式会社 | 脱模膜和半导体封装的制造方法 |
-
2021
- 2021-12-15 CN CN202180094409.2A patent/CN116867645A/zh active Pending
- 2021-12-15 KR KR1020237027458A patent/KR20230151995A/ko unknown
- 2021-12-15 DE DE112021006525.4T patent/DE112021006525T5/de active Pending
- 2021-12-15 JP JP2023502093A patent/JPWO2022180998A1/ja active Pending
- 2021-12-15 WO PCT/JP2021/046391 patent/WO2022180998A1/ja active Application Filing
- 2021-12-15 MX MX2023009641A patent/MX2023009641A/es unknown
- 2021-12-22 TW TW110148230A patent/TW202243873A/zh unknown
-
2023
- 2023-08-16 US US18/450,543 patent/US20230395398A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230395398A1 (en) | 2023-12-07 |
WO2022180998A1 (ja) | 2022-09-01 |
CN116867645A (zh) | 2023-10-10 |
DE112021006525T5 (de) | 2023-11-16 |
JPWO2022180998A1 (es) | 2022-09-01 |
TW202243873A (zh) | 2022-11-16 |
KR20230151995A (ko) | 2023-11-02 |
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