MX2016001257A - Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico. - Google Patents
Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico.Info
- Publication number
- MX2016001257A MX2016001257A MX2016001257A MX2016001257A MX2016001257A MX 2016001257 A MX2016001257 A MX 2016001257A MX 2016001257 A MX2016001257 A MX 2016001257A MX 2016001257 A MX2016001257 A MX 2016001257A MX 2016001257 A MX2016001257 A MX 2016001257A
- Authority
- MX
- Mexico
- Prior art keywords
- electronic
- electrical equipment
- copper alloy
- terminal
- content
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
La presente invención provee una aleación de cobre para equipo electrónico y eléctrico que tiene características mecánicas superiores y la capacidad para suprimir la aparición de defectos, incluso cuando se procesa a un espesor de placa delgado o un diámetro de alambre fino, material de aleación de cobre plásticamente trabajado para un equipo electrónico y eléctrico, y un componente y una terminal para equipo electrónico y eléctrico. Esta aleación de cobre para equipo electrónico y eléctrico se caracteriza porque incluye Mg en un intervalo de 1.3% en masa a 2.8% en masa con el resto siendo sustancialmente Cu e impurezas inevitables, y se caracteriza por el contenido de H que es 10 ppm en masa o 10 menos, el contenido de 0 que es 100 ppm en masa o menos, el contenido de S que es 50 ppm en masa o menos, y el contenido de C que es 10 masa ppm o menos.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013159642 | 2013-07-31 | ||
JP2014117998A JP5962707B2 (ja) | 2013-07-31 | 2014-06-06 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子 |
PCT/JP2014/069942 WO2015016218A1 (ja) | 2013-07-31 | 2014-07-29 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016001257A true MX2016001257A (es) | 2016-05-24 |
Family
ID=52431750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016001257A MX2016001257A (es) | 2013-07-31 | 2014-07-29 | Aleacion de cobre para equipo electronico y electrico, material de aleacion de cobre plasticamente trabajado para equipo electronico y electrico, y componente y terminal para equipo electronico y electrico. |
Country Status (9)
Country | Link |
---|---|
US (1) | US10294547B2 (es) |
EP (1) | EP3029168A4 (es) |
JP (1) | JP5962707B2 (es) |
KR (1) | KR20160036038A (es) |
CN (1) | CN105392908A (es) |
MX (1) | MX2016001257A (es) |
MY (1) | MY178741A (es) |
TW (1) | TWI521072B (es) |
WO (1) | WO2015016218A1 (es) |
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DE19900673A1 (de) * | 1999-01-11 | 2000-07-13 | Basf Ag | Verwendung von Bindungspartnern für 5-HT5-Rezeptoren zur Behandlung neurodegenerativer und neuropsychiatrischer Störungen |
EP2570506B1 (en) * | 2010-05-14 | 2016-04-13 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device |
JP5903838B2 (ja) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
JP5903842B2 (ja) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
TWI740842B (zh) * | 2015-09-09 | 2021-10-01 | 日商三菱綜合材料股份有限公司 | 電子/電氣機器用銅合金、電子/電氣機器用銅合金塑性加工材、電子/電氣機器用零件、端子、以及匯流排 |
US20180245183A1 (en) * | 2015-09-09 | 2018-08-30 | Mitsubishi Materials Corporation | Copper alloy for electronic and electric device, component for electronic and electric device, terminal, and bus bar |
CN107709585B (zh) * | 2015-09-09 | 2020-12-04 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
EP3348659B1 (en) | 2015-09-09 | 2020-12-23 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
CN107208189B (zh) | 2015-09-09 | 2020-08-04 | 三菱综合材料株式会社 | 铜合金、铜合金塑性加工材、组件、端子及汇流条 |
EP3382814A4 (en) * | 2015-11-27 | 2019-09-04 | Mitsubishi Materials Corporation | PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND TERMINAL PART STRUCTURE OF ELECTRIC WIRE |
WO2017170699A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
JP6226097B2 (ja) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
FI3438299T3 (fi) | 2016-03-30 | 2023-05-23 | Mitsubishi Materials Corp | Kupariseoksesta valmistettu nauha elektronisia laitteita ja sähkölaitteita varten, komponentti, liitosnapa, virtakisko sekä liikuteltava kappale releitä varten |
JP6226098B2 (ja) * | 2016-03-30 | 2017-11-08 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
JP6299802B2 (ja) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
JP2018077942A (ja) * | 2016-11-07 | 2018-05-17 | 住友電気工業株式会社 | 被覆電線、端子付き電線、銅合金線、及び銅合金撚線 |
JP6828444B2 (ja) * | 2017-01-10 | 2021-02-10 | 日立金属株式会社 | 導電線の製造方法、並びにケーブルの製造方法 |
KR102452709B1 (ko) * | 2017-05-30 | 2022-10-11 | 현대자동차주식회사 | 자동차 가니쉬용 합금 및 자동차용 가니쉬 |
KR101875807B1 (ko) * | 2018-03-14 | 2018-07-06 | 주식회사 풍산 | 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법 |
JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
TWI770375B (zh) | 2018-03-30 | 2022-07-11 | 日商三菱綜合材料股份有限公司 | 電子/電氣機器用銅合金﹑電子/電氣機器用銅合金板條材料、電子/電氣機器用構件、端子及匯流排 |
JP7116870B2 (ja) * | 2019-03-29 | 2022-08-12 | 三菱マテリアル株式会社 | 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法 |
TW202130826A (zh) * | 2019-11-29 | 2021-08-16 | 日商三菱綜合材料股份有限公司 | 銅合金、銅合金塑性加工材、電子/電氣機器用零件、端子、匯流條、散熱基板 |
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US20140096877A1 (en) | 2011-06-06 | 2014-04-10 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method for producing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
JP5903832B2 (ja) * | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品 |
JP5903838B2 (ja) * | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品 |
JP5910004B2 (ja) | 2011-11-07 | 2016-04-27 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品 |
JP5903842B2 (ja) * | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
JP2013104096A (ja) | 2011-11-14 | 2013-05-30 | Mitsubishi Materials Corp | 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材および電子機器用部品 |
-
2014
- 2014-06-06 JP JP2014117998A patent/JP5962707B2/ja active Active
- 2014-07-28 TW TW103125685A patent/TWI521072B/zh active
- 2014-07-29 US US14/907,193 patent/US10294547B2/en active Active
- 2014-07-29 CN CN201480039932.5A patent/CN105392908A/zh active Pending
- 2014-07-29 MY MYPI2016700236A patent/MY178741A/en unknown
- 2014-07-29 MX MX2016001257A patent/MX2016001257A/es unknown
- 2014-07-29 KR KR1020167001487A patent/KR20160036038A/ko not_active Application Discontinuation
- 2014-07-29 EP EP14831793.6A patent/EP3029168A4/en not_active Withdrawn
- 2014-07-29 WO PCT/JP2014/069942 patent/WO2015016218A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TWI521072B (zh) | 2016-02-11 |
US10294547B2 (en) | 2019-05-21 |
JP5962707B2 (ja) | 2016-08-03 |
EP3029168A4 (en) | 2017-03-15 |
JP2015045083A (ja) | 2015-03-12 |
MY178741A (en) | 2020-10-20 |
KR20160036038A (ko) | 2016-04-01 |
US20160160321A1 (en) | 2016-06-09 |
TW201522669A (zh) | 2015-06-16 |
CN105392908A (zh) | 2016-03-09 |
EP3029168A1 (en) | 2016-06-08 |
WO2015016218A1 (ja) | 2015-02-05 |
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