KR950032394A - 마이크로캡슐형 경화제, 그 제조법, 열경화성 수지조성물, 프리프레그 및 섬유강화복합재료 - Google Patents

마이크로캡슐형 경화제, 그 제조법, 열경화성 수지조성물, 프리프레그 및 섬유강화복합재료 Download PDF

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KR950032394A
KR950032394A KR1019950005356A KR19950005356A KR950032394A KR 950032394 A KR950032394 A KR 950032394A KR 1019950005356 A KR1019950005356 A KR 1019950005356A KR 19950005356 A KR19950005356 A KR 19950005356A KR 950032394 A KR950032394 A KR 950032394A
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thermosetting resin
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류우지 사와오카
신지 코오치
토시오 무라키
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마에다 카쯔노수케
토오레 카부시키가이샤
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Abstract

(A)열경화성수지의 경화제 및 (B)열경화수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분 (A)가 성분(B)를 주성분으로 하는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 것을 특징으로 하는 마이크로캡슐형 경화제가 개시되어 있다. 이 마이크로캡슐형 경화제를 사용하므로써 실온에서의 보조안정성이 양호하며 경화물의 내열성이 우수한 열경화성 수지조성물 또는 실온에서의 보존안정성이 양호하며 경화물의 내열성이 우수한 열경화성 수지조성물 또는 프리프레글 얻을 수 있다. 또 이 열경화성 수지조성물을 사용하여 얻어지는 섬유강화복합재료는 경화시 열룩이 생기지 않으며 내열성도 우수하다.

Description

마이크로캡슐형 경화제, 그 제조법, 열경화성 수지조성물, 프리프레그 및 섬유강화복합재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (25)

  1. (A)열경화성수지의 경화제 및 (B)열경화수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분(A)가 성분(B)를 주성분으로 하는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 마이크로캡슐형 경화제.
  2. 제1항에 있어서, 평균입자경이 0.5∼10㎛인 마이크로캡슐형 경화제.
  3. 제1항에 있어서, 성분(A) 및 성분(B)가 모두 유기용매가 가용성인 마이크로캡슐형 경화제.
  4. 제1항에 있어서, 성분(A) 및 성분(B)가 모두 물에 불용성이며 또 비점 100℃ 이하의 소수성 유기용매에 가용성인 마이크로캡슐형 경화제.
  5. 제1항에 있어서, 열경화성수지가 에폭시수지, 시안산에스테르수지, 말레이드수지 및 시안산에스테르수지와 말레이미드수지를 미리 반응한 수지에서 선택된 1종 이상의 열경화성수지를 포함하는 마이크로캡슐형 경화제.
  6. 제1항에 있어서, 성분(A)가 지방족아민, 지환족아민, 방향족아민, 폴리아미드, 요소화합물, 이미다졸화합물, 구아니딘화합물, 히드라지드화합물, 산무수물, 루이스산착체, 페놀화합물, 메르캅탄화합물로 이루어지는 군에서 선택된 1종 이상의 화합물을 포함하는 마이크로캡슐형 경화제.
  7. 제1항에 있어서, 성분(A)가 지방족아민, 지환족아민, 방향족아민, 이미다졸화합물, 구아니딘화합물로 이루어지는 군에서 선택된 1종 이상의 화합물과 글리시딜기를 보유하는 화합물과의 부가반응물인 마이크로캡슐형 경화제.
  8. 제1항에 있어서, 성분(B)가 연화점이 200℃를 과하는 마이크로캡슐형 경화제.
  9. 제1항에 있어서, 성분(B)가 폴리아미드, 폴리페닐렌옥시드, 폴리아세탈, 폴리아릴레이트, 폴리에스테르, 폴리카아보네이트, 폴리에테르이미드, 폴리이미드, 폴시술폰, 폴리에테르술폰 및 폴리아릴술폰으로이루어지는 기에서 선택되는 1종 이상의 열가소성수지인 마이크로캡슐형 경화제.
  10. 제1항에 있어서, 성분(B)가 폴리아릴레이트, 폴리카아보네이트, 폴리에테르이미드, 폴리이미드, 폴리술폰, 폴리에테르술폰, 폴리아릴술폰으로 이루어지는 군에서 선택되는 1종 이상의 비정성 열가소성 수지인 마이크로캡슐형 경화제.
  11. 제1항에 있어서, 성분(B)가 성분(A)에 대하여 중량비가 0.5∼7인 마이크로캡슐형 경화제.
  12. 물에 불용성인 열경화성 수지의 경화제 및 물에 불용성이며 열경화성 수지에 가열용해가능한 염가소성수지를 유기용매에 용해시키고; 그 용액을 물속에서 유화분산시킨 후; 그 유기용매를 제거하는 것을 특징으로 하는 마이크로캡슐형 경화제의 제조법.
  13. 제12항에 있어서, 유기용매가 비접 100℃ 이상의 소수성 유기용매인 것을 특징으로 하는 마이크로캡슐형 경화제의 제조법.
  14. 제12항에 있어서, 물에 불용성이며 열경화성수지에 가열용해가능한 열가소성수지의 연화점이 200℃을 초과하는 것을 특징으로 하는 마이크로캡슐형 경화제의 제조법.
  15. 제12항에 있어서, 유기용매의 제거는 가열에 의한 증발에 의한 마이크로캡슐형 경화제의 제조법.
  16. 제12항에 있어서, 유기용매의 제거는 감압하에서 증발에 의한 마이크로캡슐형 경화제의 제조법.
  17. 열경화성수지 및 (A)열경화성수지의 경화제 및 (B)열경화성수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분(A)가 성분(B)를 주성분으로 하는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 마이크로캡슐형 경화제로 이루어지는 열경화성 수지조성물.
  18. 제17항에 있어서, 열경화성수지가 에폭시수지, 시안산에스테르수지, 말레이미드 수지 및 시안산에스테르수지와 말레이미드수지를 미리 반응한 수지로부터 선택된 1종 이상의 열경화성수지인 열경화성 수지조성물.
  19. 제18항에 있어서, 열경화성수지가 에폭시수지인 열경화성 수지조성물.
  20. 열경화성수지; (A)열경화성수지의 경화제 및 (B)열경화성수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분(A)가 성분(B)를 주성분으로 하는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 마이크로캡슐형 경화제; 및 강화섬유로 이루어지는 프리프레그.
  21. 제20항에 있어서, 강화섬유가 탄소섬유인 프리프레그.
  22. 열경화성수지; (A)열경화성수지의 경화제 및 (B)열경화성수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분(A)가 성분(B)를 주성분으로 한는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 마이크로캡슐형 경화제; 및 강화섬유로 이루어지는 프리프레그를 경화하므로써 형성되는 섬유강화복합재료.
  23. 제22항에 있어서, 강화섬유가 탄소섬유인 섬유강화복합재료.
  24. 강화섬유 및 메트릭스수지로 이루어지며, 이 메트릭스수지는, 열경화성수지 및 (A)열경화성수지의 경화제 및 (B)열경화성수지에 가열용해가능한 열가소성수지를 필수성분으로 하며, 성분(A)가 성분(B)를 주성분으로 하는 층으로 피복된 입자상이며, 그 평균입자경이 0.1∼20㎛인 마이크로캡슐형 경화제로 이루어지는 열경화성 수지조성물을 경화하여 이루어지는 경화물인 섬유강화복합재료.
  25. 제24항에 있어서, 강화섬유가 탄소섬유인 섬유강화복합재료.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950005356A 1994-03-15 1995-03-15 마이크로캡슐형 경화제, 그 제조법, 열경화성 수지조성물, 프리프레그 및 섬유강화복합재료 KR950032394A (ko)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430626B1 (ko) * 1997-01-20 2004-07-30 주식회사 코오롱 열융착 에폭시 필름 및 그의 제조방법

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800923A (en) * 1995-08-29 1998-09-01 E. I. Du Pont De Nemours And Company Acid composition comprising a coated polyvalent carboxylic acid solid particle and a powder coating comprising the same
BR9606962A (pt) * 1995-12-06 1997-11-04 Asahi Chemical Ind Agentem de cura granular revestido composição de fixação de parafuso de ancoragem cápsula de fixação de parafuso de ancoragem e processo para produzir uma composição de fixação de parafuso de ancoragem
DE69913671T2 (de) * 1998-03-13 2004-06-17 Matsumoto Yushi-Seiyaku Co., Ltd., Yao Hitzeexpandierbare mikrokapseln und verfahren zu deren verwendung
US6447915B1 (en) * 1999-03-11 2002-09-10 Sumitomo Bakelite Company Limited Interlaminar insulating adhesive for multilayer printed circuit board
DE19935532A1 (de) * 1999-07-30 2001-02-08 Guido Enderle Verfahren zur Aktivierung mikroverkapselter Komponenten und Werk- oder Wirkstoff mit zumindest einer mikroverkapselten Komponente
EP1252217B1 (en) 1999-12-20 2004-08-18 3M Innovative Properties Company Ambient-temperature-stable, one-part curable epoxy adhesive
JP3485513B2 (ja) * 2000-01-19 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
JP2002069157A (ja) * 2000-08-24 2002-03-08 Nitto Denko Corp 半導体封止用樹脂組成物、およびそれを用いた半導体装置、半導体ウエハ、ならびに半導体装置の実装構造
ITMI20010236A1 (it) * 2001-02-07 2002-08-07 Giuseppe Cappi Procedimento per la realizzazione di manufatti termo e fonoisolanti per l'edilizia e per l'industria impianto per la realizzazione di questo
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
DE10139790A1 (de) * 2001-08-14 2003-03-06 Henkel Kgaa Mikrokapseln, Verfahren zu deren Herstellung und deren Verwendung
DE10231706B4 (de) * 2002-07-13 2006-10-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrokomposite und Verfahren zu deren Herstellung sowie deren Verwendung
ES2387333T3 (es) * 2002-07-18 2012-09-20 Mitsubishi Rayon Co., Ltd. Preimpregnado, material intermedio para moldeado de FRP, y procedimientos de producción para el mismo, y procedimientos de producción para material compuesto reforzado con fibras
US20040052997A1 (en) * 2002-09-17 2004-03-18 Ietsugu Santo Composite pressure container or tubular body and composite intermediate
ES2302980T5 (es) * 2002-11-28 2015-12-01 Mitsubishi Rayon Co., Ltd. Procedimientos para la producción de material compuesto reforzado con fibras
US7045562B2 (en) * 2003-10-16 2006-05-16 International Business Machines Corporation Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls
US7001091B1 (en) 2003-10-31 2006-02-21 Knight Andrew F Ink pen for dispensing ink having time-dependent characteristics
EP1784302B1 (en) * 2004-09-01 2016-07-06 Encapsys, Llc Encapsulated cure systems
US20060292375A1 (en) * 2005-06-28 2006-12-28 Martin Cary J Resin compositions with high thermoplatic loading
EP1930359A1 (en) 2005-09-29 2008-06-11 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
CN100423935C (zh) * 2005-12-26 2008-10-08 四川省宜宾五粮液集团有限公司 表面带有装饰标材的模塑制品及其制造方法
US7927514B2 (en) * 2006-02-03 2011-04-19 Asahi Kasei Chemicals Corporation Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good
US8153229B2 (en) * 2006-04-25 2012-04-10 The Yokohama Rubber Co., Ltd. Epoxy resin composition for fiber-reinforced composite material
DE502006003010D1 (de) * 2006-05-04 2009-04-16 Sgl Carbon Ag Hochtemperaturbeständiger Verbundwerkstoff
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
KR100787381B1 (ko) * 2006-11-16 2007-12-24 한국과학기술연구원 미세 캡슐-도전성 입자 복합체, 이의 제조 방법 및 이를이용한 이방 도전성 접착 필름
WO2009038971A1 (en) * 2007-09-18 2009-03-26 3M Innovative Properties Company Erosion resistant impregnating resin systems and composites
CN101619319B (zh) * 2009-03-13 2011-06-15 创世纪转基因技术有限公司 人工改造合成的抗草甘膦基因与应用
WO2011126702A2 (en) * 2010-03-30 2011-10-13 Henkel Corporation Encapsulated curing agents
US20130128435A1 (en) * 2010-07-29 2013-05-23 Yasushi Mizuta Composition, composition being for end-face sealing display devices and consisting of the composition, display devices, and process for producing same
WO2012024354A1 (en) * 2010-08-20 2012-02-23 3M Innovative Properties Company Low temperature curable epoxy tape and method of making same
US8439511B2 (en) * 2010-12-22 2013-05-14 Vanguard Space Technologies, Inc. Mirror and a method of manufacturing thereof
US9303171B2 (en) 2011-03-18 2016-04-05 Tesla Nanocoatings, Inc. Self-healing polymer compositions
US8715543B2 (en) 2011-03-31 2014-05-06 Ocv Intellectual Capital, Llc Microencapsulated curing agent
CN102423673A (zh) * 2011-07-28 2012-04-25 西北工业大学 一种在中温下引发热固性环氧树脂固化的潜伏性微胶囊固化剂及其胶黏剂的制备方法
US9953739B2 (en) 2011-08-31 2018-04-24 Tesla Nanocoatings, Inc. Composition for corrosion prevention
JP6153172B2 (ja) 2011-12-08 2017-06-28 オーシーヴィー インテレクチュアル キャピタル リミテッド ライアビリティ カンパニー 繊維強化樹脂モールディングコンパウンド及びその繊維強化樹脂成形品の製造方法
CN102559015B (zh) * 2011-12-16 2014-09-10 展辰涂料集团股份有限公司 一种防水藻涂料组合物及其制备方法
US10570296B2 (en) 2012-03-19 2020-02-25 Tesla Nanocoatings, Inc. Self-healing polymer compositions
US9328266B2 (en) * 2012-07-09 2016-05-03 Gm Global Technology Operations, Llc Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC
US10953625B2 (en) 2014-01-23 2021-03-23 Spartan Acquisition Llc Unidirectional fiber composite system for structural repairs and reinforcement
CN103966248A (zh) * 2014-04-10 2014-08-06 杭州市疾病预防控制中心 一种基于同源重组的细菌基因点突变分子克隆技术
US10472472B2 (en) 2014-09-23 2019-11-12 The Boeing Company Placement of modifier material in resin-rich pockets to mitigate microcracking in a composite structure
US10072126B2 (en) 2014-09-23 2018-09-11 The Boeing Company Soluble nanoparticles for composite performance enhancement
US9862828B2 (en) 2014-09-23 2018-01-09 The Boeing Company Polymer nanoparticle additions for resin modification
US10160840B2 (en) 2014-09-23 2018-12-25 The Boeing Company Polymer nanoparticles for controlling permeability and fiber volume fraction in composites
US10662302B2 (en) 2014-09-23 2020-05-26 The Boeing Company Polymer nanoparticles for improved distortion capability in composites
US9845556B2 (en) 2014-09-23 2017-12-19 The Boeing Company Printing patterns onto composite laminates
US10808123B2 (en) 2014-09-23 2020-10-20 The Boeing Company Nanoparticles for improving the dimensional stability of resins
US9587076B2 (en) * 2014-09-23 2017-03-07 The Boeing Company Polymer nanoparticles for controlling resin reaction rates
WO2016075708A1 (en) 2014-11-11 2016-05-19 Council Of Scientific & Industrial Research Microcapsule composition containing watersoluble amine and a process for the preparation thereof
US10266292B2 (en) 2015-01-22 2019-04-23 Neptune Research, Llc Carriers for composite reinforcement systems and methods of use
US10309692B2 (en) 2015-11-11 2019-06-04 International Business Machines Corporation Self-heating thermal interface material
CN106893256B (zh) * 2015-12-18 2019-05-17 比亚迪股份有限公司 一种预浸料用环氧树脂组合物及其制备方法和预浸料
EP3263628A1 (en) 2016-06-27 2018-01-03 Hexcel Composites Limited Particulate curing components
US10011055B2 (en) * 2016-08-01 2018-07-03 The Boeing Company Force responsive pre-impregnated composite methods, systems and apparatuses
US10278284B2 (en) 2016-08-25 2019-04-30 International Business Machines Corporation Laminate materials with embedded heat-generating multi-compartment microcapsules
AU2017228707B2 (en) * 2016-10-25 2021-08-26 The Boeing Company Insertion of catalyst into dry carbon fibers prior to resin impregnation
US10501595B2 (en) * 2016-10-25 2019-12-10 The Boeing Company Insertion of catalyst into dry carbon fibers prior to resin impregnation
CN106739629B (zh) * 2016-11-09 2018-11-09 武汉华工图像技术开发有限公司 一种激光全息防伪膜
CN108929520A (zh) * 2017-12-14 2018-12-04 中航复合材料有限责任公司 一种快速固化自粘性预浸料及其制备方法
TWI720404B (zh) 2018-01-16 2021-03-01 日商三菱化學股份有限公司 預浸材及纖維強化複合材料
CN108976389A (zh) * 2018-07-24 2018-12-11 中国航空工业集团公司基础技术研究院 一种用于环氧树脂的微胶囊快速固化剂及其制备方法
CN109880605B (zh) * 2019-03-27 2020-04-14 中国石油化工股份有限公司 一种注气防窜用固化剂缓释胶囊和防窜剂及其制备方法
CN110229333B (zh) * 2019-06-25 2022-02-15 湘潭大学 一种聚酰亚胺的合成方法
CN110791053A (zh) * 2019-11-15 2020-02-14 西安龙德科技发展有限公司 含微胶囊固化剂的环氧树脂组合物及其预浸料和复合材料
CN111303383B (zh) * 2020-02-19 2021-11-09 东华大学 一种潜伏性多聚胺环氧树脂固化剂微胶囊及其制备和应用
CN111218472B (zh) * 2020-03-09 2020-11-03 西南大学 一种提高棉花产量的融合基因、植物表达载体、转化体及应用
CN112443053B (zh) * 2020-11-05 2022-03-18 上海新之杰新型建材有限公司 一种隔热型钢结构建筑外墙板
CN112940254A (zh) * 2021-02-03 2021-06-11 广东华智芯电子科技有限公司 一种用于微胶囊型固化剂的聚酰亚胺外壳及其制备方法
CN113480199B (zh) * 2021-08-02 2022-11-01 四川文理学院 一种增强型玄武岩纤维浸润剂及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA716638A (en) * 1965-08-24 J. Meier Dale Curing agents for polyepoxides and method for their preparation
GB1265489A (ko) * 1968-07-17 1972-03-01
JPS5431468B2 (ko) * 1972-01-17 1979-10-06
US4536524A (en) * 1981-04-21 1985-08-20 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
US4760106A (en) * 1983-05-20 1988-07-26 Amoco Corporation Impact resistant matrix resins for advanced composites
US4503161A (en) * 1984-03-23 1985-03-05 Minnesota Mining And Manufacturing Company Latent Lewis acid catalyst encapsulated within polymerized cycloaliphatic epoxide and polyhydric alcohol
US4808639A (en) * 1986-07-16 1989-02-28 Production Previews, Inc. Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent
US5225278A (en) * 1987-08-26 1993-07-06 Rohm And Haas Company Process for microencapsulation
JPH01242616A (ja) * 1988-03-23 1989-09-27 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH03220246A (ja) * 1989-03-16 1991-09-27 Nitto Denko Corp マイクロカプセル型アミン系硬化剤
JPH02292325A (ja) * 1989-05-02 1990-12-03 Nitto Denko Corp マイクロカプセル型アミン系硬化剤を用いたエポキシ樹脂組成物
ES2088781T3 (es) * 1990-01-19 1996-09-16 Minnesota Mining & Mfg Composicion termoendurecible.
JPH03292378A (ja) * 1990-04-10 1991-12-24 Nitto Denko Corp マイクロカプセル、それを用いた接着剤組成物及びその硬化方法
JP2948942B2 (ja) * 1990-10-30 1999-09-13 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴムスポンジ形成性組成物
US5371152A (en) * 1990-12-28 1994-12-06 Toho Rayon Co., Ltd. Resin composition and process for producing the composition
JPH04332404A (ja) * 1991-05-07 1992-11-19 Nec Corp 異方性導電材料及びこれを用いた集積回路素子の接続方法
JP2600536B2 (ja) * 1991-10-02 1997-04-16 日立化成工業株式会社 接着剤組成物の製造方法
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
JPH0632931A (ja) * 1992-07-17 1994-02-08 Mitsubishi Rayon Co Ltd 熱硬化性発泡材料
GB9515941D0 (en) * 1995-08-03 1995-10-04 Zeneca Ltd DNA constructs
FR2736926B1 (fr) * 1995-07-19 1997-08-22 Rhone Poulenc Agrochimie 5-enol pyruvylshikimate-3-phosphate synthase mutee, gene codant pour cette proteine et plantes transformees contenant ce gene

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430626B1 (ko) * 1997-01-20 2004-07-30 주식회사 코오롱 열융착 에폭시 필름 및 그의 제조방법

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