KR950021289A - 리드 온 칩(loc) 구조 반도체 장치 - Google Patents

리드 온 칩(loc) 구조 반도체 장치 Download PDF

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Publication number
KR950021289A
KR950021289A KR1019940033222A KR19940033222A KR950021289A KR 950021289 A KR950021289 A KR 950021289A KR 1019940033222 A KR1019940033222 A KR 1019940033222A KR 19940033222 A KR19940033222 A KR 19940033222A KR 950021289 A KR950021289 A KR 950021289A
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South Korea
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lead
chip
loc
semiconductor device
structure semiconductor
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KR1019940033222A
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English (en)
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또모히사 스끼야마
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가네꼬 히사시
니뽄 덴끼 가부시끼가이샤(NEC Corporation)
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Publication of KR950021289A publication Critical patent/KR950021289A/ko

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    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract

리드(1)의 이너리드부(1A)에 반도체 칩(3)을 탑재하기 위하여, 폴리이미드 테이프(2a)의 이너리드측면에 열가소성 접착제(2b)를 가지고, 반도체 칩측의 면에 열경화성 접착제(2c)를 가진다. 절연 접착 테이프(2)로 반도체 칩(3)이 이너리드부(1a)에 접착 고정할때의 열처리시, 절연 접착 테이프(2)의 열경화성 접착제(2c)중의 유기성분이 비산하여 리드면에 부착되는 것을 억제하고, 금속세선(4)의 본딩성을 개선한다.

Description

리드 온 칩(LOC) 구조 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 LOC구조 반도체 장치의 일실시예의 단면도이다.
제3도는 제2도의 반도체 장치의 일부 사시도이다.

Claims (6)

  1. 절연 테이프를 통해서 리드에 반도체 칩을 탑재하는 리드 온 칩(LOC)구조의 반도체 장치에 있어서, 상기 절연 테이프는 리드측의 면에 열가소성 접착제를 가지고, 반도체 칩측의 면에 열경화성 접착제를 가지는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
  2. 제1항에 있어서, 상기 반도체 칩의 전극패드와, 상기 리드의 표면을 금속세선으로 전기 접속하여 이루어지는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
  3. 제2항에 있어서, 리드의 상기 표면을 은으로 면구성되는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
  4. 제2항에 있어서, 상기 금속세선은 금으로 이루어지는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
  5. 제1항에 있어서, 상기 절연 테이프는 폴리이미드 테이프로 이루어지는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
  6. 제1항에 있어서, 상기 리드의 이너리드부, 상기 절연 테이프, 상기 반도체 칩 및 상기 금속세선을 수지로 봉지하여 이루어지는 것을 특징으로 하는 리드 온 칩(LOC)구조 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940033222A 1993-12-24 1994-12-08 리드 온 칩(loc) 구조 반도체 장치 KR950021289A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5348277A JP2546530B2 (ja) 1993-12-24 1993-12-24 Loc構造半導体装置
JP93-348277 1993-12-24

Publications (1)

Publication Number Publication Date
KR950021289A true KR950021289A (ko) 1995-07-26

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KR1019940033222A KR950021289A (ko) 1993-12-24 1994-12-08 리드 온 칩(loc) 구조 반도체 장치

Country Status (3)

Country Link
JP (1) JP2546530B2 (ko)
KR (1) KR950021289A (ko)
GB (1) GB2285171A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010096115A (ko) * 2000-04-17 2001-11-07 이형도 편향요크

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01116465U (ko) * 1988-01-30 1989-08-07
JP2518569B2 (ja) * 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010096115A (ko) * 2000-04-17 2001-11-07 이형도 편향요크

Also Published As

Publication number Publication date
JPH07193092A (ja) 1995-07-28
JP2546530B2 (ja) 1996-10-23
GB9422410D0 (en) 1995-01-04
GB2285171A (en) 1995-06-28

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