KR940008678U - Packaging pack for semiconductor chips - Google Patents

Packaging pack for semiconductor chips

Info

Publication number
KR940008678U
KR940008678U KR2019920018029U KR920018029U KR940008678U KR 940008678 U KR940008678 U KR 940008678U KR 2019920018029 U KR2019920018029 U KR 2019920018029U KR 920018029 U KR920018029 U KR 920018029U KR 940008678 U KR940008678 U KR 940008678U
Authority
KR
South Korea
Prior art keywords
semiconductor chips
packaging pack
pack
packaging
chips
Prior art date
Application number
KR2019920018029U
Other languages
Korean (ko)
Other versions
KR950006128Y1 (en
Inventor
유상희
Original Assignee
유상희
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유상희 filed Critical 유상희
Priority to KR92018029U priority Critical patent/KR950006128Y1/en
Publication of KR940008678U publication Critical patent/KR940008678U/en
Application granted granted Critical
Publication of KR950006128Y1 publication Critical patent/KR950006128Y1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
KR92018029U 1992-09-22 1992-09-22 Semiconduct chip pack KR950006128Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92018029U KR950006128Y1 (en) 1992-09-22 1992-09-22 Semiconduct chip pack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92018029U KR950006128Y1 (en) 1992-09-22 1992-09-22 Semiconduct chip pack

Publications (2)

Publication Number Publication Date
KR940008678U true KR940008678U (en) 1994-04-21
KR950006128Y1 KR950006128Y1 (en) 1995-07-29

Family

ID=19340478

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92018029U KR950006128Y1 (en) 1992-09-22 1992-09-22 Semiconduct chip pack

Country Status (1)

Country Link
KR (1) KR950006128Y1 (en)

Also Published As

Publication number Publication date
KR950006128Y1 (en) 1995-07-29

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20030730

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee