KR930016225U - Semiconductor package packaging tray - Google Patents

Semiconductor package packaging tray

Info

Publication number
KR930016225U
KR930016225U KR2019910023704U KR910023704U KR930016225U KR 930016225 U KR930016225 U KR 930016225U KR 2019910023704 U KR2019910023704 U KR 2019910023704U KR 910023704 U KR910023704 U KR 910023704U KR 930016225 U KR930016225 U KR 930016225U
Authority
KR
South Korea
Prior art keywords
semiconductor package
packaging tray
package packaging
tray
semiconductor
Prior art date
Application number
KR2019910023704U
Other languages
Korean (ko)
Other versions
KR940008243Y1 (en
Inventor
오세혁
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR2019910023704U priority Critical patent/KR940008243Y1/en
Publication of KR930016225U publication Critical patent/KR930016225U/en
Application granted granted Critical
Publication of KR940008243Y1 publication Critical patent/KR940008243Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
KR2019910023704U 1991-12-24 1991-12-24 Tray for semiconductor package cover KR940008243Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910023704U KR940008243Y1 (en) 1991-12-24 1991-12-24 Tray for semiconductor package cover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023704U KR940008243Y1 (en) 1991-12-24 1991-12-24 Tray for semiconductor package cover

Publications (2)

Publication Number Publication Date
KR930016225U true KR930016225U (en) 1993-07-28
KR940008243Y1 KR940008243Y1 (en) 1994-12-05

Family

ID=19325399

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023704U KR940008243Y1 (en) 1991-12-24 1991-12-24 Tray for semiconductor package cover

Country Status (1)

Country Link
KR (1) KR940008243Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100464171B1 (en) * 1997-11-27 2005-04-06 삼성전자주식회사 Tray for Semiconductor Package
KR100604256B1 (en) * 2004-10-11 2006-07-28 엘지전자 주식회사 Encapsulation cap

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100464171B1 (en) * 1997-11-27 2005-04-06 삼성전자주식회사 Tray for Semiconductor Package
KR100604256B1 (en) * 2004-10-11 2006-07-28 엘지전자 주식회사 Encapsulation cap

Also Published As

Publication number Publication date
KR940008243Y1 (en) 1994-12-05

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20011107

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee