KR940013675U - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- KR940013675U KR940013675U KR2019920022384U KR920022384U KR940013675U KR 940013675 U KR940013675 U KR 940013675U KR 2019920022384 U KR2019920022384 U KR 2019920022384U KR 920022384 U KR920022384 U KR 920022384U KR 940013675 U KR940013675 U KR 940013675U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92022384U KR960002343Y1 (en) | 1992-11-13 | 1992-11-13 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92022384U KR960002343Y1 (en) | 1992-11-13 | 1992-11-13 | Semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940013675U true KR940013675U (en) | 1994-06-25 |
KR960002343Y1 KR960002343Y1 (en) | 1996-03-20 |
Family
ID=19343921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR92022384U KR960002343Y1 (en) | 1992-11-13 | 1992-11-13 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960002343Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100673938B1 (en) * | 2000-04-26 | 2007-01-24 | 삼성테크윈 주식회사 | Semiconductor package and the fabrication method thereof |
-
1992
- 1992-11-13 KR KR92022384U patent/KR960002343Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100673938B1 (en) * | 2000-04-26 | 2007-01-24 | 삼성테크윈 주식회사 | Semiconductor package and the fabrication method thereof |
Also Published As
Publication number | Publication date |
---|---|
KR960002343Y1 (en) | 1996-03-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR930012117U (en) | Semiconductor package | |
DE69232912T2 (en) | Semiconductor packages | |
NO931286D0 (en) | FOERINGSROER PACKAGES | |
DE69518935D1 (en) | Semiconductor package | |
DE69326262D1 (en) | Compound semiconductor devices | |
DE69322140T2 (en) | Semiconductor package | |
KR960012443A (en) | Semiconductor package | |
DE69432168D1 (en) | Semiconductor packages | |
KR960025455U (en) | Semiconductor package | |
KR930024367U (en) | Semiconductor package | |
KR940013675U (en) | Semiconductor package | |
KR940017910U (en) | Semiconductor package | |
KR930024375U (en) | Semiconductor package | |
KR940013676U (en) | Semiconductor package | |
KR940013678U (en) | Semiconductor package | |
KR940006479U (en) | Multi-chip package | |
KR940013677U (en) | Out-lead exposed semiconductor package | |
KR940011118U (en) | Lead-on-chip package | |
KR960015635U (en) | Semiconductor package | |
KR960012677U (en) | Semiconductor package | |
KR960006383U (en) | Semiconductor package | |
KR930016250U (en) | Semiconductor package | |
KR940013668U (en) | Lead on chip package | |
KR940006492U (en) | Semiconductor package device | |
KR920015767U (en) | H type semiconductor package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20030218 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |