KR940013676U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR940013676U
KR940013676U KR2019920022489U KR920022489U KR940013676U KR 940013676 U KR940013676 U KR 940013676U KR 2019920022489 U KR2019920022489 U KR 2019920022489U KR 920022489 U KR920022489 U KR 920022489U KR 940013676 U KR940013676 U KR 940013676U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019920022489U
Other languages
Korean (ko)
Other versions
KR950006836Y1 (en
Inventor
홍성학
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR92022489U priority Critical patent/KR950006836Y1/en
Publication of KR940013676U publication Critical patent/KR940013676U/en
Application granted granted Critical
Publication of KR950006836Y1 publication Critical patent/KR950006836Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR92022489U 1992-11-16 1992-11-16 Semiconductor package KR950006836Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92022489U KR950006836Y1 (en) 1992-11-16 1992-11-16 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92022489U KR950006836Y1 (en) 1992-11-16 1992-11-16 Semiconductor package

Publications (2)

Publication Number Publication Date
KR940013676U true KR940013676U (en) 1994-06-25
KR950006836Y1 KR950006836Y1 (en) 1995-08-21

Family

ID=19344002

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92022489U KR950006836Y1 (en) 1992-11-16 1992-11-16 Semiconductor package

Country Status (1)

Country Link
KR (1) KR950006836Y1 (en)

Also Published As

Publication number Publication date
KR950006836Y1 (en) 1995-08-21

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