KR940001363A - 로우 프로필 오버몰드된 패드 배열 반도체 디바이스 및 그 제조방법 - Google Patents

로우 프로필 오버몰드된 패드 배열 반도체 디바이스 및 그 제조방법 Download PDF

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KR940001363A
KR940001363A KR1019930009964A KR930009964A KR940001363A KR 940001363 A KR940001363 A KR 940001363A KR 1019930009964 A KR1019930009964 A KR 1019930009964A KR 930009964 A KR930009964 A KR 930009964A KR 940001363 A KR940001363 A KR 940001363A
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holes
semiconductor device
metal traces
semiconductor die
pattern
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더블유. 슬로앤 제임스
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빈센트 비, 인그라시아
모토로라 인코포레이티드
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Abstract

로우 프로필 오버몰드된 패드 배열 캐리어 (48)는 한면에서 금속을 가지며 도금되지 않은 스루홑을 갖는 신규한 기판(40)을 이용하여 제조된다. 신균한 기판은 어느 한면에 땜납 레지스터층의 필요성을 제거한다. 반도체 다이(50)는 기관의 상단면에 부착되고 기판에서 금속 트레이스(46)에 와이어 본딩된다. 패키지 몸체 (54)는 최소한 다이와 와이어 본드 (52)를 덮으며 기관에 오버몰드된다. 땜 납볼 (56)은 스루홀 (44) 내에 부착되며, 따라서 기판의 상단면에서 금속 트레이스에 직접 연결된다.

Description

로우 프로필 오버몰드된 패드 배열 반도체 디바이스 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 실시예에 의한 로우 프로필 오브몰드된 패드 배열 캐리어를 위한 개량된 기판의 평면도, 제6도는 본 발명의 따른 실시예에 의하여 로우 프로필 오브 몰드된 패드 배열 캐리어를 위한 다른 기판의 횡단면도.

Claims (3)

  1. 로우 프로필 오버몰드된 반도체 디바이스(48)에 있어서, 기판(40)은 제1면과, 제2면과 다수의 스루홀(44)을 가지고, 다만 제1면이 다수의 스루홀을 덮는 다수의 땜납 패드(47)에서 종단하는 도전성 금속 트레이스(46)의 패턴을 가지고, 반도체 다이 (50)는 제 1면에 부착되며 도전성 금속 트레이스의 패턴에 전기 직으로 접속되고 패키지 몸체 (54)는 최소한 반도체 다이를 덮는 캡슬봉입 재료에 외해 형성되고, 다수의 땜납불 (56)은 제2면에서 연장하며 다수의 스루홀을 경유하여 제1면에서 다수의 땜납 패드에 연결되는 구성을 갖는 것을 특징으로 하는 반도체 디바이스.
  2. 로우 프로필 오버몰드된 반도체 디바이스(48)에 있어서, 인쇄 회로판(40)은 제1면과. 제2면과 다수의 스루홀(44)을 가지고, 다만 제1면이 다수의 스루홀을 덮는 다수의 땜납 패드(47)에서 종단하는 도전성 금속 트레이스(46)의 패턴을 가지며, 또 0.165㎜내지 0.3㎜의 범위에서 두께를 가지고 반도체 다이 (50)는 제1면에 부착되고,
    다수의 와이어 본드(52)는 반도체 다이를 도전성 금속 트레이스의 패턴에 전기적으로 접속시키고, 패키지 몸체(54)는 최소한 반도체 다이를 덮는 캡슬 봉입 재료에 의해 형성되고, 다수의 땜납볼(56)은 제2면에서 연장하며 다수의 스루홀을 경유하여 제1면에서 다수의 땜납 패드에 연결되는 구성을 갖는 것을 특징으로 하는 반도체 디바이스.
  3. 로우 프로필 오버몰드된 반도체 디바이스(40)의 제조방법에 있어서, 제1면과 제2면과 다수의 스루홀을 가지며 또 다만 제1면이 다수의 스루홀을 덮는 다수의 땜납 패드에서 종단하는 도전성 금속 트레이스의 패턴을 갖는 것으로 구성된 기판 (40)을 제공하는 단계와, 제 1면에 반도체 다이 (50)를 부착하는 단계와, 반도체 다이 를 도전성 금속 트레이스의 패턴에 전기적으로 접속하는 단계와, 최소한 반도체 다이를 덮기 위해 캡슬 봉입 재료로서 패키지 몸체 (54)를 형성하는 단계와, 기판의 제2면에서 연장하는 다수의 땜납볼을 수의 땜납 패드에 연결하기 위해 다수의 스루홀에서 다수의 땜납볼(56)를 부착하는 단계를 구비하는 것을 특징으로 하는 반도체 디바이스의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930009964A 1992-08-06 1993-06-03 로우 프로필 오버몰드된 패드 배열 반도체 디바이스 및 그 제조방법 KR940001363A (ko)

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