KR930006867A - Loc 패키지 및 그 제조방법 - Google Patents
Loc 패키지 및 그 제조방법 Download PDFInfo
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- KR930006867A KR930006867A KR1019910015863A KR910015863A KR930006867A KR 930006867 A KR930006867 A KR 930006867A KR 1019910015863 A KR1019910015863 A KR 1019910015863A KR 910015863 A KR910015863 A KR 910015863A KR 930006867 A KR930006867 A KR 930006867A
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- Prior art keywords
- loc package
- inner lead
- package according
- chip
- forming
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract 6
- 238000000034 method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 238000005137 deposition process Methods 0.000 claims 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000001552 radio frequency sputter deposition Methods 0.000 claims 1
- 238000009966 trimming Methods 0.000 claims 1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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Abstract
본 발명은 LOC패키지 및 그제조방법에 관한 것으로서, 특히 기계적인 강도 및 박형화를 이룰수 있도록 한 것이다.
이를 위해, 본 발명은 칩(11)의 상면에 형성되는 중합체(13)와 인너리드(14)의 양면에 요철면을 형성하여 이들을 상호 접속되도록 한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 LOC 패키지의 구조를 나타낸 종단면도,
제3도는 제2도의 "A"부 상세도,
제4도는 본 발명에 의한 LOC 패키지 제조공정에 있어서, 솔더링 공정을 나타낸 평면도,
제5도는 본 발명의 다른 실시예를 나타낸 종단면도.
Claims (11)
- 칩(11)의 표면에 미세한 돌기(12)를 형성하고 중합체(13)와 인너리드(14)의 상하방에는 요철면을 각각 형성하여 이들을 차례로 접합시켜서된 LOC 패키지.
- 제1항에 있어서, 중합체(13)를 플로로에틸렌계의 필름으로 하여서된 LOC 패키지.
- 제1항 또는 제2항에 있어서, 중합체(13)의 두께를 60-70㎛으로 하여서된 LOC 패키지.
- 제1항에 있어서, 인너리드(14)와 이우터리드(18)를 별도로 형성하여 탭 또는 C-4본딩하여서된 LOC 패키지.
- 제1항에 있어서, 칩(11)의 패드(15)에 접속되는 인너리드(14)부분의 폭을 좁게 한후 이들을 상호 교호되게 설치하여서 된 LOC 패키지.
- 제1항에 있어서, 인너리드(14)에 일정간격으로 통공을 형성하여서된 LOC 패키지.
- 칩(11)의 표면에 미세한 돌기(12)를 형성하는 증착 공정과, 상기 돌기(12)의 상부에 요철면을 가진 중합체(13)를 형성하는 공정과, 상기 중합체(13)의 요철면과 접속되게 인너리드(14)에 요철면을 형성하는 공정과, 상기 각 칩(11)의 패드(15)에 솔더(16)를 형성하는 솔더공정과, 상기 솔더(16)에 프레임의 각 인너리드(14)를 솔더링하여 칩(11)과 인너리드(14)을 포함하는 일정면적을 몰딩하는 몰딩공정과, 상기 몰딩된 패키지를 트리밍/포밍하는 공정을 포함하는 LOC패키지 제조방법.
- 제7항에 있어서, 칩(11)의 표면에 형성된 미세한 돌기(12)를 저온에서 RF-스퍼터링 방법으로 형성하여서 된 LOC 패키지 제조방법.
- 제7항 또는 제8항에 있어서, 미세한 돌기 (12)를 Si3N4나 SiO2로 하여서된 LOC 패키지 제조방법.
- 제7항 또는 제8항에 있어서, 미세한 돌기 (12)의 두께를 400-500A으로 하여서 된 LOC 패키지 제조방법.
- 제7항에 있어서, 요철면을 가진 로울러를 이용하여 리드프레임의 인너리드(14)에 요철면을 형성하여서된 LOC 패키지 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910015863A KR940006083B1 (ko) | 1991-09-11 | 1991-09-11 | Loc 패키지 및 그 제조방법 |
TW081106880A TW301045B (ko) | 1991-09-11 | 1992-08-31 | |
DE4230187A DE4230187B4 (de) | 1991-09-11 | 1992-09-09 | Baueinheit mit Speicher-IC, sowie Verfahren zum Herstellen einer solchen Baueinheit |
US07/943,908 US5742096A (en) | 1991-09-11 | 1992-09-11 | Lead on chip package |
JP04243295A JP3121450B2 (ja) | 1991-09-11 | 1992-09-11 | Locパッケージおよびその製造方法 |
US08/141,455 US5358906A (en) | 1991-09-11 | 1993-10-22 | Method of making integrated circuit package containing inner leads with knurled surfaces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910015863A KR940006083B1 (ko) | 1991-09-11 | 1991-09-11 | Loc 패키지 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930006867A true KR930006867A (ko) | 1993-04-22 |
KR940006083B1 KR940006083B1 (ko) | 1994-07-06 |
Family
ID=19319826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910015863A KR940006083B1 (ko) | 1991-09-11 | 1991-09-11 | Loc 패키지 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5742096A (ko) |
JP (1) | JP3121450B2 (ko) |
KR (1) | KR940006083B1 (ko) |
DE (1) | DE4230187B4 (ko) |
TW (1) | TW301045B (ko) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0152901B1 (ko) * | 1993-06-23 | 1998-10-01 | 문정환 | 플라스틱 반도체 패키지 및 그 제조방법 |
TW270213B (ko) * | 1993-12-08 | 1996-02-11 | Matsushita Electric Ind Co Ltd | |
KR970002140B1 (ko) * | 1993-12-27 | 1997-02-24 | 엘지반도체 주식회사 | 반도체 소자, 패키지 방법, 및 리드테이프 |
US5554569A (en) * | 1994-06-06 | 1996-09-10 | Motorola, Inc. | Method and apparatus for improving interfacial adhesion between a polymer and a metal |
US5559366A (en) * | 1994-08-04 | 1996-09-24 | Micron Technology, Inc. | Lead finger tread for a semiconductor lead package system |
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-
1991
- 1991-09-11 KR KR1019910015863A patent/KR940006083B1/ko not_active IP Right Cessation
-
1992
- 1992-08-31 TW TW081106880A patent/TW301045B/zh active
- 1992-09-09 DE DE4230187A patent/DE4230187B4/de not_active Expired - Fee Related
- 1992-09-11 JP JP04243295A patent/JP3121450B2/ja not_active Expired - Fee Related
- 1992-09-11 US US07/943,908 patent/US5742096A/en not_active Expired - Fee Related
-
1993
- 1993-10-22 US US08/141,455 patent/US5358906A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5742096A (en) | 1998-04-21 |
DE4230187A1 (de) | 1993-03-18 |
TW301045B (ko) | 1997-03-21 |
KR940006083B1 (ko) | 1994-07-06 |
JP3121450B2 (ja) | 2000-12-25 |
DE4230187B4 (de) | 2007-02-01 |
US5358906A (en) | 1994-10-25 |
JPH06169052A (ja) | 1994-06-14 |
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