KR930006846A - 반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프 - Google Patents

반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프 Download PDF

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KR930006846A
KR930006846A KR1019920015432A KR920015432A KR930006846A KR 930006846 A KR930006846 A KR 930006846A KR 1019920015432 A KR1019920015432 A KR 1019920015432A KR 920015432 A KR920015432 A KR 920015432A KR 930006846 A KR930006846 A KR 930006846A
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South Korea
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crosslinking agent
weight
parts
semiconductor wafer
epoxy
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KR1019920015432A
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English (en)
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오사무 나리마쓰
가즈요시 고마쓰
야스오 다케무라
요우코 다케우치
Original Assignee
사와무라 하루오
미쓰이도오아쓰 가가쿠 가부시키가이샤
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Publication of KR930006846A publication Critical patent/KR930006846A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)

Abstract

본 발명에 의하여, 기재 필름의 한쪽면에, 아크릴계 수지 100중량부, 비이온계 계면활성계 0.05-10 중량부, 에폭시계 가교제 및/또는 아지리딘 가교제 0.1-10 중량부 및 비점이 100℃이상인 수용성 유기화합물 0.1-100 중량부를 함유, 또한, 23℃에서의 미러 웨이퍼에의 점착력이 50-450g/25㎜인 점착제 층이 만들어진 점착테이프를, 반도체 웨이퍼의 표면에 붙여 이면을 연삭하는 것을 특징으로 하는 반도체 웨이처의 이면연삭 방법 및 그 방법에 이용하는 점착테이프가 제공된다.
효과 본 발명의 점착테이프는, 미러 웨이퍼에의 초기 점착력이 낮고, 또한, 경시적 중점이 적어지므로, 반도체 웨이퍼의 표면에서 박리할 때 그 웨이퍼를 파손하는 것없이 박리작업성이 양호하다.

Description

반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 접착 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. 반도체 웨이퍼의 이면을 연삭하는 방법에 있어서, 합성수지 필름의 단층체 또는 복수층체로 되는 깆 필름의 한쪽면에, 아크릴계 계수지수계에멀죤형 점착제를 고형분으로하여 100중량부, 비이온계 계면활성계 0.05-10중량부, 에폭시계 가교제,지리딘계 가교제 및 에폭시계 가교제와 아지리딘계 가교제의 혼합물로 되는 그룹에서 선택된 가교제 0.01-10중량부 및 비점이 100℃이상인 수용성 유기 화합물 0.1-100중량부를 유하는 크릴계수지수계 에멀죤형 점착제 도포액을 도포, 건조하여, 23℃에서의 미러 웨이퍼에의 점착력이 50-450g/25㎜인 점착제 층이 만들어진 점착테이프를, 반도체 웨이퍼의 집적회로를 짜넣은 쪽의 면에 붙여 이면을 연마하는 것을 특징으로 하는 반도체 웨이퍼의 이면 연삭 방법.
  2. 제1항에 있어서, 상기 가교제가, 아지리딘계 가교제 및 에폭시계 가교제의 혼합물인 것을 특징으로 하는 반도체 웨이퍼 연삭 방법.
  3. 제2항에 있어서, 상기 가교제의 혼합비가, 에폭시계 가교제 1중량부에 대하여, 아지리딘계 가교제가 0.1-10중량부인 것을 특징으로 하는 반도체 웨이퍼 이면 연삭 방법.
  4. 합성수지 필름의 단층체 도는 복수층제로 되는 기재필름의 한쪽면에, 아크릴계수지수계멀죤형 점착제를 고형분으로 하여 100중량부, 비이온계계면활성제 0.05-10중량부, 에폭시계 가교제, 아지리딘계 가교제 및 에폭시계 가교제와 아지리딘계 가교제의 혼합물로 되는 그룹에서 선택된 가교제 0.01-10중량부 및 비점이 100℃이상인 수용성 유기화합물 0.1-100중량부를 함유하는 아크릴계 수지수계에멀죤형 점착제 도포액을 도포, 건도하여 되며, 또, 23℃에서의 미러 웨이퍼에의 점력이 50-450g/25㎜인 것을 특징으로 하는 반도체 웨이퍼의 이면 연삭용 점착테이프.
  5. 제4항에 있어서, 상기 가교제가, 아지리딘계 가교제 및 에폭시게 가교제의 혼합물인 것을 특징으로 하는 반도체 웨이퍼의 이면연삭용 점착테이프.
  6. 제5항에 있어서, 상기 가교제의 혼합비가, 에폭시계 가교제 1중량부에 대하여, 아지리딘계 가교제가 0.1-10중량부인 것을 특징으로 하는 반도체 웨이퍼의 이면연삭용 점착테이프.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920015432A 1991-09-02 1992-08-26 반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프 KR930006846A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-220863 1991-09-02
JP22086391 1991-09-02

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KR930006846A true KR930006846A (ko) 1993-04-22

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US6312800B1 (en) 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
JP4256481B2 (ja) * 1997-02-14 2009-04-22 リンテック株式会社 粘着剤組成物およびその利用方法
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US6515045B1 (en) * 1999-11-29 2003-02-04 Vantico, Inc. Removable adhesive of epoxy resin, amine and non-ionic surfactant
US20030092246A1 (en) * 2001-10-11 2003-05-15 Wanat Stanley F. Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
JP2006501328A (ja) * 2002-09-26 2006-01-12 サーフェース スペシャリティーズ、エス．エイ． 剥離可能型耐水白化性感圧接着剤
US7652103B2 (en) * 2008-02-14 2010-01-26 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with aziridine crosslinking agents
WO2009152126A1 (en) 2008-06-09 2009-12-17 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with aziridine crosslinking agents
CN102405267A (zh) 2009-03-09 2012-04-04 3M创新有限公司 用于丙烯酸系粘合剂的氮丙啶交联剂
US8148471B2 (en) 2009-11-23 2012-04-03 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with aziridinyl-epoxy crosslinking system
CN102127183B (zh) 2010-01-20 2014-08-20 3M创新有限公司 可交联的丙烯酸酯粘合剂聚合物组合物
US9271914B2 (en) 2012-04-04 2016-03-01 Mad River Science Primecoat compositions for proteinaceous substrates and methods of priming proteinaceous substrates therewith
CN103740290B (zh) * 2013-12-24 2016-09-07 张家港康得新光电材料有限公司 铝箔胶粘带及其制备方法
CN115247032B (zh) * 2022-04-06 2023-10-17 上海固柯胶带科技有限公司 一种晶圆减薄用高效研磨胶带及其制备方法

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