JPS5553448A - Semiconductor element holding tape and mounting of element on wafer - Google Patents

Semiconductor element holding tape and mounting of element on wafer

Info

Publication number
JPS5553448A
JPS5553448A JP12624278A JP12624278A JPS5553448A JP S5553448 A JPS5553448 A JP S5553448A JP 12624278 A JP12624278 A JP 12624278A JP 12624278 A JP12624278 A JP 12624278A JP S5553448 A JPS5553448 A JP S5553448A
Authority
JP
Japan
Prior art keywords
tape
wafer
glueing
transistor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12624278A
Other languages
Japanese (ja)
Other versions
JPS6135696B2 (en
Inventor
Minoru Imai
Noboru Iida
Yoshiaki Kawai
Yasuo Taira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12624278A priority Critical patent/JPS5553448A/en
Publication of JPS5553448A publication Critical patent/JPS5553448A/en
Publication of JPS6135696B2 publication Critical patent/JPS6135696B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To facilitate the disconnection of semiconductor elements held on a tape by an adhesive to mount them on a wafer automatically.
CONSTITUTION: The holding tape 13 consists of a wafer 14, an exfoliating layer 18 and a guide tape 16. The guide tape 16 has guiding holes 17 on both sides of it at suitable intervals, and a space wider than that of the under surface of a package for glueing a transistor 1 where the exfoliating layer 18 is exposed. The transistor is glued to the exposed portion through a glueing material layer 15 having the same area as that of the under surface of the package. The adhesive is supplied to the tape 13 or the transistor 1 before glueing. According to this composition, it makes easier the work of disconnecting the transistors from the tape 13. The glueing material layer 15 is directly attached to the under surface of the package, it is possible to do temporary mounting work quickly, thus automate the mounting process.
COPYRIGHT: (C)1980,JPO&Japio
JP12624278A 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer Granted JPS5553448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12624278A JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12624278A JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Publications (2)

Publication Number Publication Date
JPS5553448A true JPS5553448A (en) 1980-04-18
JPS6135696B2 JPS6135696B2 (en) 1986-08-14

Family

ID=14930304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12624278A Granted JPS5553448A (en) 1978-10-16 1978-10-16 Semiconductor element holding tape and mounting of element on wafer

Country Status (1)

Country Link
JP (1) JPS5553448A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768053A (en) * 1980-10-16 1982-04-26 Seiko Epson Corp Integrated circuit package
JPS5840858U (en) * 1981-08-26 1983-03-17 クラリオン株式会社 chip parts
JPS58196099A (en) * 1982-05-11 1983-11-15 松下電器産業株式会社 Device for mounting electronic part
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
DE10044418A1 (en) * 2000-09-08 2002-04-18 Siemens Ag Placement element belt, placement element removal device and method for removing placement elements from a placement element belt

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62151865U (en) * 1986-03-18 1987-09-26

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768053A (en) * 1980-10-16 1982-04-26 Seiko Epson Corp Integrated circuit package
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
JPS5840858U (en) * 1981-08-26 1983-03-17 クラリオン株式会社 chip parts
JPS58196099A (en) * 1982-05-11 1983-11-15 松下電器産業株式会社 Device for mounting electronic part
JPH0147918B2 (en) * 1982-05-11 1989-10-17 Matsushita Electric Ind Co Ltd
DE10044418A1 (en) * 2000-09-08 2002-04-18 Siemens Ag Placement element belt, placement element removal device and method for removing placement elements from a placement element belt
DE10044418C2 (en) * 2000-09-08 2002-09-19 Siemens Ag Placement element removal device and method for removing placement elements from a placement element belt

Also Published As

Publication number Publication date
JPS6135696B2 (en) 1986-08-14

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