JPS5553448A - Semiconductor element holding tape and mounting of element on wafer - Google Patents
Semiconductor element holding tape and mounting of element on waferInfo
- Publication number
- JPS5553448A JPS5553448A JP12624278A JP12624278A JPS5553448A JP S5553448 A JPS5553448 A JP S5553448A JP 12624278 A JP12624278 A JP 12624278A JP 12624278 A JP12624278 A JP 12624278A JP S5553448 A JPS5553448 A JP S5553448A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- wafer
- glueing
- transistor
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To facilitate the disconnection of semiconductor elements held on a tape by an adhesive to mount them on a wafer automatically.
CONSTITUTION: The holding tape 13 consists of a wafer 14, an exfoliating layer 18 and a guide tape 16. The guide tape 16 has guiding holes 17 on both sides of it at suitable intervals, and a space wider than that of the under surface of a package for glueing a transistor 1 where the exfoliating layer 18 is exposed. The transistor is glued to the exposed portion through a glueing material layer 15 having the same area as that of the under surface of the package. The adhesive is supplied to the tape 13 or the transistor 1 before glueing. According to this composition, it makes easier the work of disconnecting the transistors from the tape 13. The glueing material layer 15 is directly attached to the under surface of the package, it is possible to do temporary mounting work quickly, thus automate the mounting process.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12624278A JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12624278A JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5553448A true JPS5553448A (en) | 1980-04-18 |
JPS6135696B2 JPS6135696B2 (en) | 1986-08-14 |
Family
ID=14930304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12624278A Granted JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5553448A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
JPS5840858U (en) * | 1981-08-26 | 1983-03-17 | クラリオン株式会社 | chip parts |
JPS58196099A (en) * | 1982-05-11 | 1983-11-15 | 松下電器産業株式会社 | Device for mounting electronic part |
US4489487A (en) * | 1981-02-10 | 1984-12-25 | Robert Bosch Gmbh | Electronic component and adhesive strip combination, and method of attachment of component to a substrate |
DE10044418A1 (en) * | 2000-09-08 | 2002-04-18 | Siemens Ag | Placement element belt, placement element removal device and method for removing placement elements from a placement element belt |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62151865U (en) * | 1986-03-18 | 1987-09-26 |
-
1978
- 1978-10-16 JP JP12624278A patent/JPS5553448A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
US4489487A (en) * | 1981-02-10 | 1984-12-25 | Robert Bosch Gmbh | Electronic component and adhesive strip combination, and method of attachment of component to a substrate |
JPS5840858U (en) * | 1981-08-26 | 1983-03-17 | クラリオン株式会社 | chip parts |
JPS58196099A (en) * | 1982-05-11 | 1983-11-15 | 松下電器産業株式会社 | Device for mounting electronic part |
JPH0147918B2 (en) * | 1982-05-11 | 1989-10-17 | Matsushita Electric Ind Co Ltd | |
DE10044418A1 (en) * | 2000-09-08 | 2002-04-18 | Siemens Ag | Placement element belt, placement element removal device and method for removing placement elements from a placement element belt |
DE10044418C2 (en) * | 2000-09-08 | 2002-09-19 | Siemens Ag | Placement element removal device and method for removing placement elements from a placement element belt |
Also Published As
Publication number | Publication date |
---|---|
JPS6135696B2 (en) | 1986-08-14 |
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