KR20220047346A - 도포, 현상 장치 - Google Patents

도포, 현상 장치 Download PDF

Info

Publication number: KR20220047346A
Authority: KR; South Korea
Prior art keywords: unit; coating; processing; station; wafer
Prior art date: 2019-08-19

Application number

KR1020227008467A

Other languages

English (en)

Korean (ko)

Inventor

야스시 타키구치

Original Assignee

도쿄엘렉트론가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-08-19

Filing date

2020-08-05

Publication date

2022-04-15

2020-08-05 Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤

2022-04-15 Publication of KR20220047346A publication Critical patent/KR20220047346A/ko

Links

238000000576 coating method Methods 0.000 title claims abstract description 170
239000011248 coating agent Substances 0.000 title claims abstract description 156
238000004140 cleaning Methods 0.000 claims abstract description 189
239000000758 substrate Substances 0.000 claims abstract description 54
238000010438 heat treatment Methods 0.000 claims abstract description 47
238000005406 washing Methods 0.000 claims abstract description 24
238000000034 method Methods 0.000 claims description 35
239000004065 semiconductor Substances 0.000 claims description 3
235000012431 wafers Nutrition 0.000 description 183
239000007788 liquid Substances 0.000 description 25
101150075071 TRS1 gene Proteins 0.000 description 21
230000032258 transport Effects 0.000 description 20
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
239000008367 deionised water Substances 0.000 description 9
229910021641 deionized water Inorganic materials 0.000 description 9
239000000463 material Substances 0.000 description 9
238000003860 storage Methods 0.000 description 8
230000005540 biological transmission Effects 0.000 description 7
238000007689 inspection Methods 0.000 description 7
239000007921 spray Substances 0.000 description 4
230000014509 gene expression Effects 0.000 description 3
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000007599 discharging Methods 0.000 description 2
239000012530 fluid Substances 0.000 description 2
210000004209 hair Anatomy 0.000 description 2
239000000126 substance Substances 0.000 description 2
229910021529 ammonia Inorganic materials 0.000 description 1
239000006117 anti-reflective coating Substances 0.000 description 1
238000011001 backwashing Methods 0.000 description 1
230000003749 cleanliness Effects 0.000 description 1
239000000428 dust Substances 0.000 description 1
-1 for example Substances 0.000 description 1
FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
238000009434 installation Methods 0.000 description 1
210000004185 liver Anatomy 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
238000002203 pretreatment Methods 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
238000005507 spraying Methods 0.000 description 1

Images

Classifications

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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/305—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the brushing or rubbing means
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/38—Treatment before imagewise removal, e.g. prebaking
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67098—Apparatus for thermal treatment
- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Cleaning Or Drying Semiconductors (AREA)

KR1020227008467A 2019-08-19 2020-08-05 도포, 현상 장치 KR20220047346A (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2019149736		2019-08-19
JPJP-P-2019-149736		2019-08-19
PCT/JP2020/029953 WO2021033542A1 (fr)	2019-08-19	2020-08-05	Appareil de revêtement et de développement

Publications (1)

Publication Number	Publication Date
KR20220047346A true KR20220047346A (ko)	2022-04-15

Family

ID=74661026

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020227008467A KR20220047346A (ko)	2019-08-19	2020-08-05	도포, 현상 장치

Country Status (5)

Country	Link
JP (1)	JP7262594B2 (fr)
KR (1)	KR20220047346A (fr)
CN (1)	CN114222948A (fr)
TW (1)	TW202111796A (fr)
WO (1)	WO2021033542A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010016098A (ja)	2008-07-02	2010-01-21	Tokyo Electron Ltd	基板洗浄装置

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US5345639A (en) *	1992-05-28	1994-09-13	Tokyo Electron Limited	Device and method for scrubbing and cleaning substrate
JP3779483B2 (ja) *	1998-03-23	2006-05-31	東京エレクトロン株式会社	基板の洗浄装置及び洗浄方法
JP2007294817A (ja) *	2006-04-27	2007-11-08	Sokudo:Kk	基板処理方法、基板処理システムおよび基板処理装置
JP5183993B2 (ja) *	2007-07-26	2013-04-17	株式会社Ｓｏｋｕｄｏ	基板処理装置
JP5338757B2 (ja) *	2010-07-09	2013-11-13	東京エレクトロン株式会社	塗布、現像装置、塗布、現像方法及び記憶媒体
TWI497226B (zh) *	2011-01-05	2015-08-21	Tokyo Electron Ltd	Coating, developing device, coating, developing method and memory medium

2020
- 2020-08-05 KR KR1020227008467A patent/KR20220047346A/ko active Search and Examination
- 2020-08-05 CN CN202080056483.0A patent/CN114222948A/zh active Pending
- 2020-08-05 TW TW109126417A patent/TW202111796A/zh unknown
- 2020-08-05 JP JP2021540713A patent/JP7262594B2/ja active Active
- 2020-08-05 WO PCT/JP2020/029953 patent/WO2021033542A1/fr active Application Filing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010016098A (ja)	2008-07-02	2010-01-21	Tokyo Electron Ltd	基板洗浄装置

Also Published As

Publication number	Publication date
JP7262594B2 (ja)	2023-04-21
TW202111796A (zh)	2021-03-16
CN114222948A (zh)	2022-03-22
WO2021033542A1 (fr)	2021-02-25
JPWO2021033542A1 (fr)	2021-02-25

Legal Events

Date	Code	Title	Description
2023-05-09	A201	Request for examination

Publication	Publication Date	Title
KR101059307B1 (ko)	2011-08-24	도포 현상 장치 및 도포 현상 방법
KR101798320B1 (ko)	2017-11-15	기판 처리 장치
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KR101099613B1 (ko)	2011-12-29	기판 처리 설비 및 이를 이용한 기판 처리 방법
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WO2009096380A1 (fr)	2009-08-06	Appareil de nettoyage de substrat, procédé de nettoyage de substrat et support de stockage d'ordinateur
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JP4949064B2 (ja)	2012-06-06	基板処理装置
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KR20160072545A (ko)	2016-06-23	기판 처리 장치
JP5758509B2 (ja)	2015-08-05	基板処理方法および基板処理装置
KR102303597B1 (ko)	2021-09-17	세정 용기 및 이를 가지는 기판 처리 장치
CN209766371U (zh)	2019-12-10	基板清洗装置
KR101895403B1 (ko)	2018-09-06	반송로봇 및 이를 가지는 기판처리장치