KR20190125192A - 펠리클 프레임 및 그 제조 방법 - Google Patents
펠리클 프레임 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20190125192A KR20190125192A KR1020190047247A KR20190047247A KR20190125192A KR 20190125192 A KR20190125192 A KR 20190125192A KR 1020190047247 A KR1020190047247 A KR 1020190047247A KR 20190047247 A KR20190047247 A KR 20190047247A KR 20190125192 A KR20190125192 A KR 20190125192A
- Authority
- KR
- South Korea
- Prior art keywords
- pellicle frame
- base
- fixing
- frame
- pellicle
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000012545 processing Methods 0.000 claims abstract description 118
- 230000008569 process Effects 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 41
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000000926 separation method Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 238000000227 grinding Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000003754 machining Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000005488 sandblasting Methods 0.000 description 8
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000009760 electrical discharge machining Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 241001422033 Thestylus Species 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-086876 | 2018-04-27 | ||
JP2018086876A JP7096063B2 (ja) | 2018-04-27 | 2018-04-27 | ペリクル枠の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20190125192A true KR20190125192A (ko) | 2019-11-06 |
Family
ID=68390157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190047247A KR20190125192A (ko) | 2018-04-27 | 2019-04-23 | 펠리클 프레임 및 그 제조 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7096063B2 (ja) |
KR (1) | KR20190125192A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023181869A1 (ja) * | 2022-03-22 | 2023-09-28 | 三井化学株式会社 | ペリクル枠、ペリクル、露光原版、露光装置、及びペリクルの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011007933A (ja) | 2009-06-24 | 2011-01-13 | Shin-Etsu Chemical Co Ltd | ペリクルフレーム及びリソグラフィ用ペリクル |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3072962B2 (ja) * | 1995-11-30 | 2000-08-07 | ロデール・ニッタ株式会社 | 研磨のための被加工物の保持具及びその製法 |
JP2001312047A (ja) | 2000-04-28 | 2001-11-09 | Asahi Glass Co Ltd | ペリクルおよびその製造方法 |
JP4186400B2 (ja) | 2000-09-20 | 2008-11-26 | 日本軽金属株式会社 | ショットブラスト加工方法およびその装置 |
JP2003186180A (ja) | 2001-12-14 | 2003-07-03 | Asahi Glass Co Ltd | ペリクルフレームの製造方法およびペリクル |
JP2003307832A (ja) | 2002-04-16 | 2003-10-31 | Asahi Glass Co Ltd | ペリクル及びペリクル装着フォトマスク |
JP4995103B2 (ja) | 2008-01-15 | 2012-08-08 | 新日本製鐵株式会社 | 研磨用定盤 |
JP6326737B2 (ja) | 2013-08-26 | 2018-05-23 | 学校法人立命館 | 研磨工具 |
JP6526588B2 (ja) | 2016-03-10 | 2019-06-05 | 日本特殊陶業株式会社 | ペリクル枠およびペリクル枠の製造方法 |
-
2018
- 2018-04-27 JP JP2018086876A patent/JP7096063B2/ja active Active
-
2019
- 2019-04-23 KR KR1020190047247A patent/KR20190125192A/ko not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011007933A (ja) | 2009-06-24 | 2011-01-13 | Shin-Etsu Chemical Co Ltd | ペリクルフレーム及びリソグラフィ用ペリクル |
Also Published As
Publication number | Publication date |
---|---|
JP2019191488A (ja) | 2019-10-31 |
JP7096063B2 (ja) | 2022-07-05 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |