KR20080061232A - 전자 제어 장치 - Google Patents
전자 제어 장치 Download PDFInfo
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- KR20080061232A KR20080061232A KR1020070058877A KR20070058877A KR20080061232A KR 20080061232 A KR20080061232 A KR 20080061232A KR 1020070058877 A KR1020070058877 A KR 1020070058877A KR 20070058877 A KR20070058877 A KR 20070058877A KR 20080061232 A KR20080061232 A KR 20080061232A
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- South Korea
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- heat sink
- electronic control
- housing
- control apparatus
- power device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0043—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
- B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Power Steering Mechanism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (16)
- 양단부에 각각 개구부를 갖는 절연성 수지제의 하우징과,이 하우징의 한쪽의 상기 단부에 부착된 히트싱크와,이 히트싱크에 탑재된 파워 디바이스와,상기 히트싱크와 대향하여 마련되어 있음과 함께, 상기 파워 디바이스를 제어하는 제어 회로를 포함하는 전자 회로가 형성된 회로 기판과,기초부가 상기 하우징에 지지되어 있음과 함께, 상기 회로 기판과 상기 파워 디바이스를 전기적으로 접속한 복수개의 도전판을 구비하고,상기 히트싱크는, 히트싱크 본체와, 이 히트싱크 본체의 상기 파워 디바이스가 탑재되는 측의 면의 표면에 적어도 형성된 절연 피막으로 구성되고,상기 히트싱크 본체의 외주 단면과 상기 개구부의 내벽면이 대향하고 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항에 있어서,상기 히트싱크는, 전면에 상기 절연 피막이 형성된 장척의 히트싱크 소재를 절단하여 형성된 절단면을 갖고 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 히트싱크 본체는, 알루미늄 또는 알루미늄 합금으로 구성되어 있는 것 을 특징으로 하는 전자 제어 장치.
- 제 3항에 있어서,상기 절연 피막은, 알루마이트막인 것을 특징으로 하는 청구항 3에 기재된 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 절연 피막은, 상기 히트싱크 본체의 표면에 프레코트된 절연성 수지인 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 히트싱크는, 판재를 이용하여 형성되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 히트싱크는, 압출형재를 이용하여 형성되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 파워 디바이스는, 상기 히트싱크에 제 1의 접착성 수지로 고정되어 있 는 것을 특징으로 하는 전자 제어 장치
- 제 8항에 있어서,상기 제 1의 접착성 수지는, 고열전도의 재료로 구성되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 파워 디바이스는, 상기 히트싱크에 탄성체를 통하여 고정 수단으로 고정되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 10항에 있어서,상기 파워 디바이스와 상기 히트싱크 사이에는, 고열전도의 그리스가 개재하고 있는 것을 특징으로 하는 전자 제어 장치.
- 제 2항에 있어서,상기 히트싱크의 상기 절단면과 상기 하우징의 상기 내벽면이 대향하고 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 히트싱크의 외주 단면과 상기 개구부의 내벽면 사이에는, 홈부가 형성 되어 있고, 이 홈부에 제 2의 접착성 수지가 충전되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 13항에 있어서,상기 히트싱크의 상기 히트싱크 본체의 상기 외주 단면과 상기 내요면 사이의 상기 홈부에, 상기 제 2의 접착성 수지가 충전되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 하우징의 다른쪽의 상기 단부에는, 피부착체에 부착되는 부착 다리부가 형성되어 있는 것을 특징으로 하는 전자 제어 장치.
- 제 1항 또는 제 2항에 있어서,상기 파워 디바이스는, 반도체 스위칭 소자인 것을 특징으로 하는 전자 제어 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00352271 | 2006-12-27 | ||
JP2006352271A JP4278680B2 (ja) | 2006-12-27 | 2006-12-27 | 電子制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080061232A true KR20080061232A (ko) | 2008-07-02 |
KR100887101B1 KR100887101B1 (ko) | 2009-03-04 |
Family
ID=39465881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070058877A KR100887101B1 (ko) | 2006-12-27 | 2007-06-15 | 전자 제어 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7791888B2 (ko) |
JP (1) | JP4278680B2 (ko) |
KR (1) | KR100887101B1 (ko) |
DE (1) | DE102007029664B4 (ko) |
FR (1) | FR2911041B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150130562A (ko) * | 2008-07-03 | 2015-11-23 | 로베르트 보쉬 게엠베하 | 차량 탑승자 보호 수단용 제어 장치 및 이러한 제어 장치의 조립 방법 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4410242B2 (ja) * | 2006-12-27 | 2010-02-03 | 三菱電機株式会社 | 電子制御装置及びその製造方法 |
DE102007016222B3 (de) * | 2007-04-04 | 2008-11-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben |
JP2009119957A (ja) * | 2007-11-13 | 2009-06-04 | Mitsubishi Electric Corp | 電子制御装置および電子制御装置の製造方法 |
EP2226185B1 (en) * | 2007-11-29 | 2017-04-26 | Ngk Spark Plug Co., Ltd. | Metal-resin compound member |
US8930083B2 (en) * | 2008-08-25 | 2015-01-06 | Steering Solutions Ip Holding Corporation | Electric power steering system having fail-safe control module operation |
JP5181981B2 (ja) * | 2008-09-29 | 2013-04-10 | 住友電装株式会社 | 電気接続箱 |
JP5187103B2 (ja) * | 2008-09-29 | 2013-04-24 | 住友電装株式会社 | 電気接続箱 |
JP2010100217A (ja) * | 2008-10-24 | 2010-05-06 | Jtekt Corp | 電動パワーステアリング装置 |
US20100103622A1 (en) * | 2008-10-24 | 2010-04-29 | Keihin Corporation | Electronic control device |
JP2010103369A (ja) * | 2008-10-24 | 2010-05-06 | Keihin Corp | 電子制御装置 |
WO2010090326A1 (ja) * | 2009-02-09 | 2010-08-12 | 株式会社安川電機 | 半導体装置の冷却構造及びその冷却構造を備えた電力変換装置 |
JP5084783B2 (ja) * | 2009-05-21 | 2012-11-28 | 三菱電機株式会社 | 電動式パワーステアリング装置 |
JP5481148B2 (ja) * | 2009-10-02 | 2014-04-23 | 日立オートモティブシステムズ株式会社 | 半導体装置、およびパワー半導体モジュール、およびパワー半導体モジュールを備えた電力変換装置 |
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2006
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2007
- 2007-06-15 KR KR1020070058877A patent/KR100887101B1/ko active IP Right Grant
- 2007-06-19 US US11/812,433 patent/US7791888B2/en not_active Expired - Fee Related
- 2007-06-27 DE DE102007029664.0A patent/DE102007029664B4/de not_active Expired - Fee Related
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KR20150130562A (ko) * | 2008-07-03 | 2015-11-23 | 로베르트 보쉬 게엠베하 | 차량 탑승자 보호 수단용 제어 장치 및 이러한 제어 장치의 조립 방법 |
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DE102007029664B4 (de) | 2016-10-20 |
JP2008166383A (ja) | 2008-07-17 |
US7791888B2 (en) | 2010-09-07 |
KR100887101B1 (ko) | 2009-03-04 |
FR2911041A1 (fr) | 2008-07-04 |
FR2911041B1 (fr) | 2014-08-08 |
DE102007029664A1 (de) | 2008-07-03 |
JP4278680B2 (ja) | 2009-06-17 |
US20080158823A1 (en) | 2008-07-03 |
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