KR200490675Y1 - 감광성 드라이필름 - Google Patents

감광성 드라이필름 Download PDF

Info

Publication number
KR200490675Y1
KR200490675Y1 KR2020180000402U KR20180000402U KR200490675Y1 KR 200490675 Y1 KR200490675 Y1 KR 200490675Y1 KR 2020180000402 U KR2020180000402 U KR 2020180000402U KR 20180000402 U KR20180000402 U KR 20180000402U KR 200490675 Y1 KR200490675 Y1 KR 200490675Y1
Authority
KR
South Korea
Prior art keywords
dry film
photosensitive
photosensitive resin
photosensitive dry
resin layer
Prior art date
Application number
KR2020180000402U
Other languages
English (en)
Korean (ko)
Inventor
쭝슈 차이
밍제 리
창홍 호
Original Assignee
이터널 머티리얼스 씨오., 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이터널 머티리얼스 씨오., 엘티디. filed Critical 이터널 머티리얼스 씨오., 엘티디.
Application granted granted Critical
Publication of KR200490675Y1 publication Critical patent/KR200490675Y1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR2020180000402U 2017-01-26 2018-01-26 감광성 드라이필름 KR200490675Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106201615U TWM543773U (zh) 2017-01-26 2017-01-26 感光型乾膜
TW106201615 2017-01-26

Publications (1)

Publication Number Publication Date
KR200490675Y1 true KR200490675Y1 (ko) 2019-12-16

Family

ID=59689624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020180000402U KR200490675Y1 (ko) 2017-01-26 2018-01-26 감광성 드라이필름

Country Status (4)

Country Link
JP (1) JP3215657U (zh)
KR (1) KR200490675Y1 (zh)
CN (1) CN207081941U (zh)
TW (1) TWM543773U (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI634003B (zh) * 2017-01-26 2018-09-01 長興材料工業股份有限公司 感光型乾膜及其應用
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
CN109541889B (zh) * 2018-12-19 2020-06-26 江苏艾森半导体材料股份有限公司 用于半导体封装工艺的负性光刻胶
CN114467058A (zh) * 2019-09-30 2022-05-10 太阳油墨制造株式会社 固化覆膜
CN113604164B (zh) * 2021-08-04 2023-01-31 苏州城邦达益材料科技有限公司 用于MiniLED的FPC感光覆盖膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060088126A (ko) * 2003-10-15 2006-08-03 도오꾜오까고오교 가부시끼가이샤 감광성 수지 조성물 및 이를 사용한 감광성 드라이 필름
KR20140018117A (ko) * 2012-08-01 2014-02-12 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
KR20150033324A (ko) * 2013-09-24 2015-04-01 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
KR20150047863A (ko) * 2013-10-25 2015-05-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060088126A (ko) * 2003-10-15 2006-08-03 도오꾜오까고오교 가부시끼가이샤 감광성 수지 조성물 및 이를 사용한 감광성 드라이 필름
KR20140018117A (ko) * 2012-08-01 2014-02-12 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
KR20150033324A (ko) * 2013-09-24 2015-04-01 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
KR20150047863A (ko) * 2013-10-25 2015-05-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트

Also Published As

Publication number Publication date
JP3215657U (ja) 2018-04-05
CN207081941U (zh) 2018-03-09
TWM543773U (zh) 2017-06-21

Similar Documents

Publication Publication Date Title
KR200490675Y1 (ko) 감광성 드라이필름
US11353791B2 (en) Photosensitive dry film and uses of the same
JP2852038B2 (ja) 被膜プリント回路用フレキシブル難燃性光画像形成可能組成物
US7579134B2 (en) Polyimide composite coverlays and methods and compositions relating thereto
US7476489B2 (en) Low-temperature curable photosensitive compositions
JP5839149B2 (ja) ポリアミドイミド樹脂、硬化性樹脂組成物及びその硬化物
WO2019163292A1 (ja) 積層型電子部品用樹脂組成物、ドライフィルム、硬化物、積層型電子部品、および、プリント配線板
JP5715577B2 (ja) ホスフィンオキサイドを含むポリアミド又はポリイミド樹脂組成物並びにその硬化物
JP2005154643A (ja) 活性エネルギー線硬化型アルカリ可溶性イミド樹脂、活性エネルギー線硬化型アルカリ可溶性イミド樹脂組成物、ソルダーレジスト用組成物、プリント配線板および感光性ドライフィルム
JP2017226737A (ja) ポリアミドイミド樹脂およびその製造方法
TWI751421B (zh) 感光型可溶性聚醯亞胺樹脂組合物及應用其的保護膜
JP2001159815A (ja) 感光性樹脂組成物及びこれを用いた感光性フイルム
JP7387900B2 (ja) 感光性樹脂層、それを用いたドライフィルムフォトレジスト、および感光性エレメント
JP2005037755A (ja) 感光性樹脂組成物、それを用いた感光性フィルム及びその製造方法
KR102258263B1 (ko) 감광형 가용성 폴리이미드 수지 조성물 및 이를 응용한 보호 필름
KR102253140B1 (ko) 감광성 수지층, 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 회로기판, 및 디스플레이 장치
JP2010122361A (ja) 感光性樹脂組成物、並びにこれを用いた感光性フィルム及び永久マスクレジスト
KR20230150741A (ko) 감광성 수지 조성물
JP2014209260A (ja) 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及び永久レジスト
TW202235453A (zh) 感光元件、乾膜光阻、阻抗圖案、電路板、使用此些的顯示裝置
JP2020076989A (ja) Ｆｐｉｃフィルム、これを含むフレキシブルプリント回路基板及びその製造方法
KR20220141962A (ko) 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치
CN115135496A (zh) 结构体
JP2023509862A (ja) 感光性樹脂層、それを用いたドライフィルムフォトレジスト、および感光性エレメント
JP2001154352A (ja) 感光性樹脂組成物及びこれを用いた感光性フイルム

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
REGI Registration of establishment