JP3215657U - 感光性ドライフィルム - Google Patents

感光性ドライフィルム Download PDF

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Publication number
JP3215657U
JP3215657U JP2018000215U JP2018000215U JP3215657U JP 3215657 U JP3215657 U JP 3215657U JP 2018000215 U JP2018000215 U JP 2018000215U JP 2018000215 U JP2018000215 U JP 2018000215U JP 3215657 U JP3215657 U JP 3215657U
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JP
Japan
Prior art keywords
photosensitive
dry film
photosensitive resin
photosensitive dry
resin layer
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JP2018000215U
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English (en)
Japanese (ja)
Inventor
蔡宗修
李明哲
何長鴻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eternal Materials Co Ltd
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Eternal Materials Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2018000215U 2017-01-26 2018-01-23 感光性ドライフィルム Active JP3215657U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106201615U TWM543773U (zh) 2017-01-26 2017-01-26 感光型乾膜
TW106201615 2017-01-26

Publications (1)

Publication Number Publication Date
JP3215657U true JP3215657U (ja) 2018-04-05

Family

ID=59689624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018000215U Active JP3215657U (ja) 2017-01-26 2018-01-23 感光性ドライフィルム

Country Status (4)

Country Link
JP (1) JP3215657U (zh)
KR (1) KR200490675Y1 (zh)
CN (1) CN207081941U (zh)
TW (1) TWM543773U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021065950A1 (ja) * 2019-09-30 2021-04-08 太陽インキ製造株式会社 硬化被膜

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI634003B (zh) * 2017-01-26 2018-09-01 長興材料工業股份有限公司 感光型乾膜及其應用
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
CN109541889B (zh) * 2018-12-19 2020-06-26 江苏艾森半导体材料股份有限公司 用于半导体封装工艺的负性光刻胶
CN113604164B (zh) * 2021-08-04 2023-01-31 苏州城邦达益材料科技有限公司 用于MiniLED的FPC感光覆盖膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4159094B2 (ja) * 2003-10-15 2008-10-01 東京応化工業株式会社 感光性樹脂組成物およびこれを用いた感光性ドライフィルム
CN104704426A (zh) * 2012-08-01 2015-06-10 株式会社Lg化学 具有光固化性能和热固化性能的树脂组合物及阻焊干膜
KR101734425B1 (ko) * 2013-09-24 2017-05-11 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
KR20150047863A (ko) * 2013-10-25 2015-05-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021065950A1 (ja) * 2019-09-30 2021-04-08 太陽インキ製造株式会社 硬化被膜
JP6935615B1 (ja) * 2019-09-30 2021-09-15 太陽インキ製造株式会社 硬化被膜
KR20220034861A (ko) * 2019-09-30 2022-03-18 다이요 잉키 세이조 가부시키가이샤 경화 피막

Also Published As

Publication number Publication date
KR200490675Y1 (ko) 2019-12-16
CN207081941U (zh) 2018-03-09
TWM543773U (zh) 2017-06-21

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