KR20010089702A - 다층프린트배선판 및 다층프린트배선판의 제조 방법 - Google Patents
다층프린트배선판 및 다층프린트배선판의 제조 방법 Download PDFInfo
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- KR20010089702A KR20010089702A KR1020017008133A KR20017008133A KR20010089702A KR 20010089702 A KR20010089702 A KR 20010089702A KR 1020017008133 A KR1020017008133 A KR 1020017008133A KR 20017008133 A KR20017008133 A KR 20017008133A KR 20010089702 A KR20010089702 A KR 20010089702A
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- 238000004519 manufacturing process Methods 0.000 title claims description 61
- 229920005989 resin Polymers 0.000 claims abstract description 371
- 239000011347 resin Substances 0.000 claims abstract description 371
- 239000010410 layer Substances 0.000 claims abstract description 312
- 239000011229 interlayer Substances 0.000 claims abstract description 150
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 239000000945 filler Substances 0.000 claims description 130
- 239000003822 epoxy resin Substances 0.000 claims description 75
- 229920000647 polyepoxide Polymers 0.000 claims description 75
- 239000004020 conductor Substances 0.000 claims description 71
- 238000007747 plating Methods 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 50
- 238000007788 roughening Methods 0.000 claims description 40
- 239000000203 mixture Substances 0.000 claims description 38
- 239000010954 inorganic particle Substances 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 32
- 238000005530 etching Methods 0.000 claims description 31
- 239000002253 acid Substances 0.000 claims description 29
- 238000001723 curing Methods 0.000 claims description 29
- -1 aluminum compound Chemical class 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- 238000005498 polishing Methods 0.000 claims description 27
- 239000007800 oxidant agent Substances 0.000 claims description 26
- 238000011282 treatment Methods 0.000 claims description 26
- 238000011049 filling Methods 0.000 claims description 24
- 238000000227 grinding Methods 0.000 claims description 14
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 8
- 229920005672 polyolefin resin Polymers 0.000 claims description 8
- 150000003112 potassium compounds Chemical class 0.000 claims description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 7
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 7
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000004310 lactic acid Substances 0.000 claims description 6
- 235000014655 lactic acid Nutrition 0.000 claims description 6
- 150000002681 magnesium compounds Chemical class 0.000 claims description 6
- 150000003377 silicon compounds Chemical class 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 5
- 229910000431 copper oxide Inorganic materials 0.000 claims description 5
- 239000012784 inorganic fiber Substances 0.000 claims description 5
- 239000012766 organic filler Substances 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- JUWOETZNAMLKMG-UHFFFAOYSA-N [P].[Ni].[Cu] Chemical compound [P].[Ni].[Cu] JUWOETZNAMLKMG-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims description 4
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- 238000005429 filling process Methods 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 235000011167 hydrochloric acid Nutrition 0.000 claims 1
- 235000011007 phosphoric acid Nutrition 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 38
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 57
- 239000010949 copper Substances 0.000 description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 48
- 239000011162 core material Substances 0.000 description 48
- 229910052802 copper Inorganic materials 0.000 description 45
- 239000000243 solution Substances 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 22
- 238000012986 modification Methods 0.000 description 18
- 230000004048 modification Effects 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 238000007772 electroless plating Methods 0.000 description 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 11
- 238000005476 soldering Methods 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 238000009413 insulation Methods 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 239000011135 tin Substances 0.000 description 8
- 150000003851 azoles Chemical class 0.000 description 7
- 238000013329 compounding Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011133 lead Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000007524 organic acids Chemical class 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 229940043430 calcium compound Drugs 0.000 description 4
- 150000001674 calcium compounds Chemical class 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- SPOCRUOICRJFPC-UHFFFAOYSA-N copper;2-hydroxypropanoic acid Chemical compound [Cu].CC(O)C(O)=O SPOCRUOICRJFPC-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000033116 oxidation-reduction process Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000004699 copper complex Chemical class 0.000 description 2
- VFFQCUJVGMRYIF-UHFFFAOYSA-N copper;1h-imidazole Chemical compound [Cu+2].C1=CNC=N1 VFFQCUJVGMRYIF-UHFFFAOYSA-N 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920012287 polyphenylene sulfone Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- PKMGPWVGRVNXMC-UHFFFAOYSA-N C1(=CC=CC=C1)C=1NC(=C(N1)CCO)CCO Chemical compound C1(=CC=CC=C1)C=1NC(=C(N1)CCO)CCO PKMGPWVGRVNXMC-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229940078162 triadine Drugs 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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Abstract
Description
Claims (25)
- 층간수지절연층과 도체층이 교호 적층되어, 각 도체층 간이 바이어홀로서 접속된 빌드업층이, 코어기판의 양면에 형성되어 되는 다층프린트배선판에 있어서,상기 코어기판 및 상기 코어기판의 양면에 형성된 층간수지절연층을 관통하도록 스루홀을 형성하고,상기 스루홀의 직상에 외부접속단자로 접속되는 바이어홀을 형성한 것을 특징으로 하는 다층프린트배선판.
- 제 1 항에 있어서, 상기 스루홀이, 내부에 충전제가 충전되 상기 충전제의 스루홀에서의 노출면을 덮는 도체층이 형성되고,상기 스루홀의 직상의 바이어홀이, 상기 스루홀의 상기 도체층 상에 형성되어 있는 것을 특징으로 하는 다층프린트배선판.
- (a) 코어기판의 양면에 하층층간수지절연층을 형성하는 공정,(b) 상기 코어기판 및 상기 하층층간수지절연층을 관통하는 스루홀을 형성하는 공정,(c) 상기 하층층간수지절연층 상에 상층층간수지절연층을 형성하는 공정,(d) 상기 상층층간수지절연층에 바이어홀을 형성하는 공정에 있어서, 상기 스루홀의 일부의 직상에 외부접속단자로 접속되는 바이어홀을 형성하는 공정;
- (a) 코어기판의 양면에 하층층간수지절연층을 형성하는 공정,(b) 상기 코어기판 및 상기 하층층간수지절연층을 관통하는 스루홀을 형성하는 공정,(c) 상기 스루홀에 충전제를 충전하는 공정,(d) 상기 스루홀에서 넘친 충전제를 연마하여 평탄하게 하는 공정,(e) 상기 충전제의 상기 스루홀로부터의 노출면을 덮는 도체층을 형성하는 공정,(f) 상기 하층층간수지절연층 상에 상층층간수지절연층을 형성하는 공정,(g) 상기 상층층간수지절연층에 바이어홀을 형성하는 공정에 있어, 상기 스루홀의 일부의 직상에 외부접속단자로 접속되는 바이어홀을 형성하는 공정;을 적어도 구비하는 것을 특징으로 하는 다층프린트배선판의 제조 방법
- 코어기판의 양면에 층간절연층을 형성하고, 상기 기판을 관통하는 스루홀이 실시되어, 수지충전재가 충전되며, 또 층간절연층과 도체회로가 적층되어 있는 다층프린트배선에 있어서,상기 수지충전재에는, 에폭시수지, 경화제, 무기입자가 10 ~ 50 % 배합되어있는 것을 특징으로 하는 다층프린트배선판.
- 코어기판의 양면에 층간절연층을 형성하고, 상기 기판을 관통하는 스루홀이실시되어, 수지충전재가 충전되며, 커버 도금이 시행되어지고, 또 층간절연층과 도체회로가 적층되어 있는 다층프린트배선판에 있어서,상기 수지충전재에는, 에폭시수지, 경화제, 무기입자가 10 ~ 50 % 배합되어있는 것을 특징으로 하는 다층프린트배선판.
- 제 6 항 또는 7 항에 있어서, 상기 무기입자는, 알루미늄 화합물, 칼륨 화합물, 칼륨 화합물, 마그네슘 화합물, 규소 화합물의 어느 한 종류 이상이 배합되어있는 것을 특징으로 하는 다층프린트배선판.
- 제 6 항 또는 7 항에 있어서, 상기 무기입자는, 구형, 원형, 타원형, 파쇄형, 다각형의 어느 것인 것을 특징으로 하는 다층프린트배선판.
- 제 6 항 내지 제 8 항 기재의 어느 한 항에 있어서, 상기 스루홀의 도체층에는 조화층이 시행되어져 있는 것을 특징으로 하는 프린트 배선판.
- 코어기판의 양면에 층간절연층이 형성된 프린트배선판에 있어서,(a) 표면을 관통하는 스루홀 형성 공정-(b) 에폭시수지, 무기입자가 10 ~ 50 % 배합되어 있는 수지충전제의 충전 공정-(c) 건조 공정, 연마 공정-(d) 경화 공정-(e) 커버도금 공정-;을 경유하여 층간절연층을 형성시키는 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 10 항에 있어서, 상기 (c)의 연마 공정에는, 버프 공정을 적어도 1 회 혹은 복수회 행하는 것을 특징으로 하는 프린트배선판의 제조 방법.
- 제 10 항 또는 11 항에 있어서, 상기 (a)의 공정에 있어서, 조화층을 형성하는 공정을 행하는 것을 특징으로 하는 프린트배선판의 제조 방법.
- 층간수지절연층과 도체층이 교호 적층되어, 각 도체층 간이 바이어홀로서 접속된 빌드업층이, 코어기판의 양면에 형성되어 되는 다층프린트배선판에 있어서,상기 코어기판 및 해 코어기판의 양면에 형성된 하층층간수지절연층을 관통하도록 수지충전재를 충전하여 되는 스루홀을 형성하고,상기 하층층간수지절연층에 상기의 수지충전재를 충전하여 되는 바이어홀을 형성한 것을 특징으로 하는 다층프린트배선판.
- 제 13 항에 있어서, 상기 하층층간수지절연층의 바이어홀에 충전된 수지충전제의 노출면을 덮는 도체층을 형성하고,상기 도체층을 개재하여 바이어홀의 직상에 바이어홀을 형성한 것을 특징으로 하는 다층프린트배선판.
- (a) 코어기판의 양면에 하층층간수지절연층을 형성하는 공정,(b) 상기 코어기판 및 상기 하층층간수지절연층에 스루홀이 되는 관통공을 형성하는 공정,(c) 상기 하층층간수지절연층에 바이어홀이 되는 개구를 형성하는 공정,(d) 상기 관통공 및 상기의 개구에 도전막을 형성하여, 스루홀 및 바이어홀로 하는 공정,(e) 상기의 스루홀 및 바이어홀 내에 수지충전재를 충전하는 공정,(f) 상기의 스루홀 및 바이어홀에서 넘친 수지충전제를 연마하여 평탄하게 하는 공정,(g) 상기의 수지충전제의 상기 스루홀 및 바이어홀으로부터의 노출면을 덮는 도체층을 형성하는 공정;을 적어도 구비하는 것을 특징으로 하는 다층프린트배선판의 제조 방법:.
- (a) 코어기판의 양면에 하층층간수지절연층을 형성하는 공정,(b) 상기 코어기판 및 상기의 하층층간수지절연층에 스루홀이 되는 관통공을 형성하는 공정,(c) 상기 하층층간수지절연층에 바이어홀이 되는 개구를 형성하는 공정,(d) 상기 관통공 및 상기의 개구에 도전막을 형성하고, 스루홀 및 바이어홀로 하는 공정,(e) 상기 스루홀 및 바이어홀내에 수지충전재를 충전하는 공정,(f) 상기 스루홀 및 바이어홀에서 넘친 수지충전제를 연마하여 평탄하게 하는 공정,(g) 상기 수지충전제의 상기 스루홀 및 바이어홀으로부터의 노출면을 덮는 도체층을 형성하는 공정.(h) 상기 하층층간수지절연층 상에 상층층간수지절연층을 형성하는 공정,(i) 상기 상층층간수지절연층에 바이어홀을 형성하는 공정으로서, 상기 바이어홀의 일부의 직상에 바이어홀을 형성하는 공정;을 적어도 구비하는 것을 특징으로 하는 다층프린트배선판의 제조 방법:
- (a) 코어기판의 양면에 하층층간수지절연층을 형성하는 공정,(b) 상기 코어기판 및 상기 하층층간수지절연층에 스루홀이 되는 관통공를 형성하는 공정,(c) 상기 하층층간수지절연층에 바이어홀이 되는 개구를 형성하는 공정,(d) 산 또는 산화제로 상기 관통공의 데스미어 처리를 행함과 동시에, 하층층간수지절연층 표면의 조화 처리를 행하는 공정,(e) 상기 관통공 및 상기의 개구에 도전막을 형성하고 , 스루홀 및 바이어홀로 하는 공정;을 적어도 구비하는 것을 특징으로 하는 다층프린트배선판의 제조 방법:
- 제 17 항에 있어서, 상기 코어기판이 글래스에폭시수지, FR 4, FR 5, BT 수지의 어느 하나로 되고,상기 하층층간수지절연층이, 에폭시수지, 페놀수지, 폴리이미드수지, 폴리페닐렌수지, 폴리오레핀수지, 불소수지 중에서 적어도 하나를 함유하여 되고,상기 산화제가, 크롬산, 또는 과망간산염의 어느 하나를 함유하는 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 17 항에 있어서, 상기 산은, 유산, 염산, 초산, 인산, 포름산 중에서 선택되어지는 한 종류 이상을 함유시키고 있는 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 17 항에 있어서, 상기 산화제는, 크롬산, 과망간염산의 어느 하나를 함유하는 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- (a) 코어기판에 스루홀을 형성하는 공정:(b) 상기 스루홀에, 조화면을 형성하는 공정:(c) 상기 스루홀의 랜드의 표면을 연마하여 평탄하게 하는 공정:(d) 상기 스루홀 내에, 수지충전재를 충전하여 수지층을 형성하는 공정;을 적어도 구비하는 것을 특징으로 하는 다층프린트배선판의 제조 방법:.
- 제 21 항에 있어서, 상기 조화층은, 산화동층인 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 21 항에 있어서, 상기 조화층은, 에칭에 의하여 형성되어 있는 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 21 항에 있어서, 상기 조화층은, 동-니켈-인으로 된 침상합금층인 것을 특징으로 하는 다층프린트배선판의 제조 방법.
- 제 21 항 내지 제 24 항의 어느 한 항에 있어서, 상기 수지충전재는, 에폭시수지와 유기필러의 혼합물, 에폭시수지와 무기필러의 혼합물 및 에폭시수지와 무기 파이버의 혼합물의 중에서 선택되어지는 어느 하나인 것을 특징으로 하는 다층프린트배선판의 제조 방법.
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JP???11-303307 | 1999-10-26 | ||
JP30330699A JP2001127435A (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板及び多層プリント配線板の製造方法 |
JP30330799A JP2001127436A (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板の製造方法 |
JP???11-303306 | 1999-10-26 | ||
JP???11-303305 | 1999-10-26 | ||
JP30330599A JP4832621B2 (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板 |
JP??2000-029988 | 2000-02-08 | ||
JP2000029988A JP2001223466A (ja) | 2000-02-08 | 2000-02-08 | プリント配線板の製造方法 |
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Country Status (8)
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Families Citing this family (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60027141T2 (de) | 1999-10-26 | 2006-12-28 | Ibiden Co., Ltd., Ogaki | Gedruckte mehrschichtleiterplatte und herstellungsverfahren für gedruckte mehrschichtleiterplatte |
AUPR090300A0 (en) * | 2000-10-20 | 2000-11-16 | AMC Technologies Pty Limited | An electrical lead |
US6861757B2 (en) * | 2001-09-03 | 2005-03-01 | Nec Corporation | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
CN1582461A (zh) * | 2001-09-07 | 2005-02-16 | 松下电器产业株式会社 | 显示装置及其制造方法 |
EP1915041A1 (en) * | 2001-09-28 | 2008-04-23 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
US7342470B2 (en) * | 2001-11-02 | 2008-03-11 | Fred Bassali | Circuit board microwave filters |
JP4062907B2 (ja) * | 2001-11-12 | 2008-03-19 | 松下電器産業株式会社 | 回路基板およびその製造方法 |
AUPS226402A0 (en) * | 2002-05-13 | 2002-06-13 | Advanced Metal Coatings Pty Limited | An ablation catheter |
AUPS226502A0 (en) * | 2002-05-13 | 2002-06-13 | Advanced Metal Coatings Pty Limited | A multi-electrode lead |
AU2002952318A0 (en) * | 2002-10-29 | 2002-11-14 | Advanced Metal Coatings Pty Limited | Production of lesions in a body |
EP1439689A1 (de) * | 2003-01-15 | 2004-07-21 | Siemens Aktiengesellschaft | Mobiltelefon mit einer Scan-Hilfe |
JP2004282033A (ja) * | 2003-02-28 | 2004-10-07 | Ngk Spark Plug Co Ltd | 樹脂製配線基板 |
TWI310670B (en) * | 2003-08-28 | 2009-06-01 | Ibm | Printed wiring board manufacturing method and printed wiring board |
JP4198566B2 (ja) * | 2003-09-29 | 2008-12-17 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法 |
WO2005051216A1 (en) * | 2003-11-25 | 2005-06-09 | Cathrx Ltd | A modular catheter |
TWI335195B (en) * | 2003-12-16 | 2010-12-21 | Ngk Spark Plug Co | Multilayer wiring board |
AU2005207078B2 (en) | 2004-01-26 | 2011-03-17 | Cathrx Ltd | A catheter assembly with an adjustable loop |
EP1677349A4 (en) * | 2004-02-24 | 2010-12-01 | Ibiden Co Ltd | SUBSTRATE FOR MOUNTING A SEMICONDUCTOR |
AU2005229019A1 (en) * | 2004-03-30 | 2005-10-13 | Cathrx Ltd | A catheter steering device |
DE102004032706A1 (de) * | 2004-07-06 | 2006-02-02 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement |
US7196274B2 (en) * | 2004-07-20 | 2007-03-27 | Dragonwave Inc. | Multi-layer integrated RF/IF circuit board |
US7202419B2 (en) * | 2004-07-20 | 2007-04-10 | Dragonwave Inc. | Multi-layer integrated RF/IF circuit board including a central non-conductive layer |
CA2575871A1 (en) * | 2004-08-05 | 2006-02-09 | Cathrx Ltd | A steerable catheter |
CA2575889A1 (en) * | 2004-08-05 | 2006-02-09 | Cathrx Ltd | A process of manufacturing an electrical lead |
JP4079927B2 (ja) * | 2004-09-16 | 2008-04-23 | Tdk株式会社 | 多層基板及びその製造方法 |
TW200618705A (en) | 2004-09-16 | 2006-06-01 | Tdk Corp | Multilayer substrate and manufacturing method thereof |
TWI301656B (en) * | 2004-11-26 | 2008-10-01 | Via Tech Inc | Circuit board and process thereof |
US7528006B2 (en) * | 2005-06-30 | 2009-05-05 | Intel Corporation | Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion |
TWI294757B (en) * | 2005-07-06 | 2008-03-11 | Delta Electronics Inc | Circuit board with a through hole wire, and forming method thereof |
US7602062B1 (en) * | 2005-08-10 | 2009-10-13 | Altera Corporation | Package substrate with dual material build-up layers |
TWI288591B (en) * | 2005-10-17 | 2007-10-11 | Phoenix Prec Technology Corp | Circuit board structure and dielectric structure thereof |
US20070206364A1 (en) * | 2006-03-02 | 2007-09-06 | Saint-Gobain Performance Plastics Corporation | Methods of forming a flexible circuit board |
US20080030030A1 (en) * | 2006-08-02 | 2008-02-07 | Taiwan Fu Hsing Industrial Co., Ltd. | Door lever and door lever assembly |
KR100771467B1 (ko) * | 2006-10-30 | 2007-10-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
TW200830961A (en) * | 2007-01-02 | 2008-07-16 | Unimicron Technology Corp | Circuit substrate and surface treatment process thereof |
US8440916B2 (en) * | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
KR100922810B1 (ko) * | 2007-12-11 | 2009-10-21 | 주식회사 잉크테크 | 흑화 전도성 패턴의 제조방법 |
KR20090067249A (ko) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
JP2009218545A (ja) * | 2008-03-12 | 2009-09-24 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
JP5138459B2 (ja) * | 2008-05-15 | 2013-02-06 | 新光電気工業株式会社 | 配線基板の製造方法 |
US8989837B2 (en) | 2009-12-01 | 2015-03-24 | Kyma Medical Technologies Ltd. | Methods and systems for determining fluid content of tissue |
FR2933975B1 (fr) * | 2008-07-17 | 2011-02-18 | Servier Lab | Nouveau procede de preparation de benzocyclobutenes fonctionnalises,et application a la synthese de l'ivabradine et de ses sels d'addition a un acide pharmaceutiquement acceptable. |
US8692135B2 (en) | 2008-08-27 | 2014-04-08 | Nec Corporation | Wiring board capable of containing functional element and method for manufacturing same |
JP5715747B2 (ja) * | 2008-09-30 | 2015-05-13 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
WO2010047264A1 (ja) * | 2008-10-20 | 2010-04-29 | 住友ベークライト株式会社 | スプレー塗布用ポジ型感光性樹脂組成物及びそれを用いた貫通電極の製造方法 |
TWI402173B (zh) * | 2008-11-17 | 2013-07-21 | Fujitsu Ltd | 電路板及其製造方法(一) |
JP5142967B2 (ja) * | 2008-12-10 | 2013-02-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR101019706B1 (ko) * | 2008-12-30 | 2011-03-07 | 주식회사 하이닉스반도체 | 반도체 패키지 및 이의 제조 방법 |
KR101060862B1 (ko) * | 2009-09-14 | 2011-08-31 | 삼성전기주식회사 | 인터포저 및 그의 제조방법 |
CN102026498B (zh) * | 2009-09-21 | 2012-11-28 | 日月光半导体制造股份有限公司 | 线路板的制作方法、线路板及晶片封装结构 |
US20110114372A1 (en) * | 2009-10-30 | 2011-05-19 | Ibiden Co., Ltd. | Printed wiring board |
CA2782499A1 (en) | 2009-12-01 | 2011-06-09 | Kyma Medical Technologies Ltd. | Locating features in the heart using radio frequency imaging |
KR101737478B1 (ko) * | 2009-12-14 | 2017-05-19 | 엘지이노텍 주식회사 | 카메라 모듈 및 그 제조 방법 |
US8207453B2 (en) * | 2009-12-17 | 2012-06-26 | Intel Corporation | Glass core substrate for integrated circuit devices and methods of making the same |
US9420707B2 (en) * | 2009-12-17 | 2016-08-16 | Intel Corporation | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
CN102149255B (zh) * | 2010-02-04 | 2013-07-24 | 日月光半导体制造股份有限公司 | 多引线通孔的形成方法 |
WO2011109648A1 (en) * | 2010-03-03 | 2011-09-09 | Georgia Tech Research Corporation | Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same |
JP6081355B2 (ja) | 2010-07-21 | 2017-02-15 | キマ メディカル テクノロジーズ リミテッド | 埋込み式無線周波数センサ |
JP5592808B2 (ja) * | 2010-09-15 | 2014-09-17 | 日東電工株式会社 | 配線回路基板 |
JP5756515B2 (ja) * | 2011-04-04 | 2015-07-29 | 株式会社村田製作所 | チップ部品内蔵樹脂多層基板およびその製造方法 |
JP2013008880A (ja) * | 2011-06-24 | 2013-01-10 | Fujitsu Ltd | 積層回路基板の製造方法及び積層回路基板 |
KR101310256B1 (ko) | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | 인쇄회로기판의 무전해 표면처리 도금층 및 이의 제조방법 |
KR20130007022A (ko) * | 2011-06-28 | 2013-01-18 | 삼성전기주식회사 | 인쇄회로기판 및 이의 제조방법 |
WO2013041971A2 (en) * | 2011-09-19 | 2013-03-28 | Cima Nanotech Israel Ltd. | Process for preparing transparent conductive coatings |
US8969732B2 (en) * | 2011-09-28 | 2015-03-03 | Ibiden Co., Ltd. | Printed wiring board |
US8895873B2 (en) * | 2011-09-28 | 2014-11-25 | Ibiden Co., Ltd. | Printed wiring board |
US20130168132A1 (en) * | 2011-12-29 | 2013-07-04 | Sumsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
KR20130089475A (ko) * | 2012-02-02 | 2013-08-12 | 삼성전자주식회사 | 회로 기판 및 이의 제조 방법과 이를 이용한 반도체 패키지 |
WO2013133827A1 (en) | 2012-03-07 | 2013-09-12 | Intel Corporation | Glass clad microelectronic substrate |
US8961550B2 (en) | 2012-04-17 | 2015-02-24 | Indian Wells Medical, Inc. | Steerable endoluminal punch |
JP6003194B2 (ja) * | 2012-04-27 | 2016-10-05 | セイコーエプソン株式会社 | ベース基板、電子デバイスおよびベース基板の製造方法 |
CN102723306B (zh) * | 2012-06-28 | 2014-10-08 | 中国科学院上海微***与信息技术研究所 | 一种利用穿硅通孔的微波多芯片封装结构及其制作方法 |
US9001520B2 (en) | 2012-09-24 | 2015-04-07 | Intel Corporation | Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
KR20140071561A (ko) * | 2012-11-27 | 2014-06-12 | 삼성전자주식회사 | 회로 기판과 이를 구비하는 반도체 패키지 |
JP6013960B2 (ja) * | 2013-03-28 | 2016-10-25 | 京セラ株式会社 | 配線基板 |
JP6266907B2 (ja) * | 2013-07-03 | 2018-01-24 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
CN206040982U (zh) * | 2013-10-29 | 2017-03-22 | 基马医疗科技有限公司 | 印刷电路板和医疗装置 |
US9288917B2 (en) * | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
EP4233711A3 (en) | 2014-02-05 | 2023-10-18 | Zoll Medical Israel Ltd. | Apparatuses for determining blood pressure |
JP2015213124A (ja) * | 2014-05-02 | 2015-11-26 | イビデン株式会社 | パッケージ基板 |
CN105225976A (zh) * | 2014-06-25 | 2016-01-06 | 中芯国际集成电路制造(上海)有限公司 | 焊盘的制作方法及半导体器件 |
JP2016051847A (ja) * | 2014-09-01 | 2016-04-11 | イビデン株式会社 | プリント配線板、その製造方法及び半導体装置 |
WO2016040337A1 (en) | 2014-09-08 | 2016-03-17 | KYMA Medical Technologies, Inc. | Monitoring and diagnostics systems and methods |
US10439317B2 (en) | 2014-09-16 | 2019-10-08 | Fci Usa Llc | Hermetically sealed electrical connector assembly |
US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
WO2016115175A1 (en) | 2015-01-12 | 2016-07-21 | KYMA Medical Technologies, Inc. | Systems, apparatuses and methods for radio frequency-based attachment sensing |
KR101795480B1 (ko) * | 2015-04-06 | 2017-11-10 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
KR20170002179A (ko) * | 2015-06-29 | 2017-01-06 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조방법 |
KR20180022628A (ko) * | 2015-07-03 | 2018-03-06 | 르네사스 일렉트로닉스 가부시키가이샤 | 반도체 장치 |
US9780052B2 (en) * | 2015-09-14 | 2017-10-03 | Micron Technology, Inc. | Collars for under-bump metal structures and associated systems and methods |
US10832029B2 (en) | 2015-11-13 | 2020-11-10 | Cypress Semiconductor Corporation | Sensor-compatible overlay |
US10282585B2 (en) | 2015-11-13 | 2019-05-07 | Cypress Semiconductor Corporation | Sensor-compatible overlay |
US9639734B1 (en) * | 2015-11-13 | 2017-05-02 | Cypress Semiconductor Corporation | Fingerprint sensor-compatible overlay material |
CN105744722A (zh) * | 2016-02-19 | 2016-07-06 | 罗嘉妤 | 一种计算机散热pcb板 |
CN105575938B (zh) * | 2016-02-26 | 2018-10-26 | 中国科学院微电子研究所 | 一种硅基转接板及其制备方法 |
US9922951B1 (en) * | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
CN110366761B (zh) | 2017-03-16 | 2022-04-29 | 旭化成株式会社 | 分散体以及使用其的带导电性图案的结构体的制造方法和带导电性图案的结构体 |
US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
TWI719646B (zh) * | 2017-07-18 | 2021-02-21 | 日商旭化成股份有限公司 | 具有導電性圖案區域之構造體及其製造方法以及積層體及其製造方法 |
KR20190012485A (ko) * | 2017-07-27 | 2019-02-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
KR102456821B1 (ko) | 2017-07-27 | 2022-10-19 | 아사히 가세이 가부시키가이샤 | 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품 |
WO2019030746A1 (en) | 2017-08-10 | 2019-02-14 | Zoll Medical Israel Ltd. | SYSTEMS, DEVICES AND METHODS FOR PHYSIOLOGICAL MONITORING OF PATIENTS |
CN109673112B (zh) * | 2017-10-13 | 2021-08-20 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板以及柔性电路板的制作方法 |
US10602622B2 (en) * | 2017-10-27 | 2020-03-24 | Kyocera Corporation | Wiring board |
US11523518B2 (en) * | 2017-11-28 | 2022-12-06 | Sumitomo Electric Printed Circuits, Inc. | Method of making flexible printed circuit board and flexible printed circuit board |
JP7089453B2 (ja) * | 2018-10-10 | 2022-06-22 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
EP3709779A1 (en) * | 2019-03-12 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
CN113035834B (zh) * | 2021-05-28 | 2021-07-30 | 浙江集迈科微电子有限公司 | 转接板及其制备方法 |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US557844A (en) * | 1896-04-07 | maloney | ||
US4496475A (en) | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
JPS6366993A (ja) * | 1986-09-08 | 1988-03-25 | 日本電気株式会社 | 多層配線基板 |
JP2570866B2 (ja) | 1989-08-29 | 1997-01-16 | 日本電気株式会社 | パタン正規化装置 |
JPH0651010Y2 (ja) | 1989-12-22 | 1994-12-21 | 富士通株式会社 | プリント配線板構造 |
US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
US5118385A (en) * | 1991-05-28 | 1992-06-02 | Microelectronics And Computer Technology Corporation | Multilayer electrical interconnect fabrication with few process steps |
US5153986A (en) * | 1991-07-17 | 1992-10-13 | International Business Machines | Method for fabricating metal core layers for a multi-layer circuit board |
US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
US5450290A (en) * | 1993-02-01 | 1995-09-12 | International Business Machines Corporation | Printed circuit board with aligned connections and method of making same |
JPH06283847A (ja) * | 1993-03-29 | 1994-10-07 | Hitachi Chem Co Ltd | プリント配線板 |
JPH07283539A (ja) | 1994-04-14 | 1995-10-27 | Sony Corp | ビルドアップ多層プリント配線板 |
JPH07283538A (ja) | 1994-04-14 | 1995-10-27 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
US5590460A (en) * | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5557884A (en) * | 1994-07-27 | 1996-09-24 | Deppe; Gregory | Spraying and level control for aero-hydroponic system |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
JP3101197B2 (ja) | 1994-12-01 | 2000-10-23 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
WO1996017503A1 (fr) | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et son procede de production |
TW323432B (ko) | 1995-04-28 | 1997-12-21 | Victor Company Of Japan | |
US5890460A (en) * | 1995-05-08 | 1999-04-06 | Ball; Ronald C. | Electrical generator set |
US6195883B1 (en) | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
AUPN416395A0 (en) * | 1995-07-14 | 1995-08-03 | Matchplay Ltd | Ball hitting sports implement and/or sports balls |
JP3084352B2 (ja) * | 1995-08-28 | 2000-09-04 | 太陽インキ製造株式会社 | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
SG71684A1 (en) | 1995-10-23 | 2000-04-18 | Ibiden Co Ltd | Multilayer printed circuit board method of producing multilayer printed circut board and resin filler |
JP3172456B2 (ja) | 1995-10-23 | 2001-06-04 | イビデン株式会社 | プリント配線板 |
US6010768A (en) * | 1995-11-10 | 2000-01-04 | Ibiden Co., Ltd. | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
JPH09148748A (ja) | 1995-11-20 | 1997-06-06 | Taiyo Ink Mfg Ltd | 多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物 |
JP3266778B2 (ja) | 1995-11-30 | 2002-03-18 | シャープ株式会社 | 多層フレキシブルリジットプリント配線板の製造方法 |
JP3229923B2 (ja) * | 1996-03-01 | 2001-11-19 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
JPH09260849A (ja) | 1996-03-19 | 1997-10-03 | Matsushita Electric Works Ltd | 内層用回路板の製造方法、及び、多層プリント配線板の製造方法 |
JP3580638B2 (ja) | 1996-05-29 | 2004-10-27 | 京セラ株式会社 | 配線基板及びその製造方法 |
JPH09331152A (ja) * | 1996-06-11 | 1997-12-22 | Tokuyama Corp | 回路基板の製造方法 |
TW331698B (en) * | 1996-06-18 | 1998-05-11 | Hitachi Chemical Co Ltd | Multi-layered printed circuit board |
JP3050807B2 (ja) | 1996-06-19 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JP3050812B2 (ja) | 1996-08-05 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JPH10107449A (ja) | 1996-09-27 | 1998-04-24 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
US5891606A (en) * | 1996-10-07 | 1999-04-06 | Motorola, Inc. | Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
US6103992A (en) * | 1996-11-08 | 2000-08-15 | W. L. Gore & Associates, Inc. | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
EP0844809B1 (en) | 1996-11-20 | 2011-08-17 | Ibiden Co, Ltd. | Solder resist composition and printed circuit boards |
JPH10200265A (ja) | 1997-01-06 | 1998-07-31 | Ibiden Co Ltd | 多層プリント配線板 |
JPH10261868A (ja) | 1997-03-19 | 1998-09-29 | Nec Toyama Ltd | 多層印刷配線板の製造方法 |
US5827804A (en) * | 1997-04-04 | 1998-10-27 | Harris; Phillip C. | Borate cross-linked well treating fluids and methods |
JPH10322024A (ja) | 1997-05-16 | 1998-12-04 | Hitachi Ltd | 非貫通ビアホールを有するビルドアップ多層プリント配線板及びその製造方法 |
JPH10334499A (ja) | 1997-05-29 | 1998-12-18 | Nec Gumma Ltd | 光学式ピックアップ装置 |
JPH1140949A (ja) | 1997-07-23 | 1999-02-12 | Hitachi Aic Inc | 多層配線板と面付部品の実装構造 |
JPH1187930A (ja) * | 1997-09-11 | 1999-03-30 | Hitachi Aic Inc | 多層印刷配線板の製造方法 |
JP3564981B2 (ja) | 1997-10-14 | 2004-09-15 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
JP3408417B2 (ja) * | 1998-03-17 | 2003-05-19 | イビデン株式会社 | スルーホール充填用樹脂組成物および多層プリント配線板 |
US6376049B1 (en) * | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
JP3415430B2 (ja) | 1997-11-11 | 2003-06-09 | 日本特殊陶業株式会社 | プリント配線板用穴埋め材及びそれを用いたプリント配線板 |
JPH11177237A (ja) | 1997-12-16 | 1999-07-02 | Hitachi Chem Co Ltd | ビルドアップ多層プリント配線板とその製造方法 |
JPH11204944A (ja) | 1998-01-12 | 1999-07-30 | Hitachi Chem Co Ltd | 多層印刷配線板の製造方法 |
JPH11214846A (ja) | 1998-01-28 | 1999-08-06 | Ibiden Co Ltd | 多層プリント配線板 |
JP4082776B2 (ja) * | 1998-03-09 | 2008-04-30 | イビデン株式会社 | プリント配線板の製造方法 |
JPH11266079A (ja) * | 1998-03-18 | 1999-09-28 | Hitachi Ltd | ビルドアップ多層配線基板及びその製造方法 |
JP3421240B2 (ja) | 1998-03-26 | 2003-06-30 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP2000165046A (ja) | 1998-09-24 | 2000-06-16 | Ibiden Co Ltd | 多層ビルドアップ配線板 |
JP2000101245A (ja) * | 1998-09-24 | 2000-04-07 | Ngk Spark Plug Co Ltd | 積層樹脂配線基板及びその製造方法 |
JP2000244129A (ja) | 1998-12-25 | 2000-09-08 | Ngk Spark Plug Co Ltd | 配線基板、コア基板及びその製造方法 |
JP4442832B2 (ja) | 1999-04-13 | 2010-03-31 | イビデン株式会社 | 多層プリント配線板 |
US6373717B1 (en) * | 1999-07-02 | 2002-04-16 | International Business Machines Corporation | Electronic package with high density interconnect layer |
US6452117B2 (en) * | 1999-08-26 | 2002-09-17 | International Business Machines Corporation | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
DE60027141T2 (de) * | 1999-10-26 | 2006-12-28 | Ibiden Co., Ltd., Ogaki | Gedruckte mehrschichtleiterplatte und herstellungsverfahren für gedruckte mehrschichtleiterplatte |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US6826830B2 (en) * | 2002-02-05 | 2004-12-07 | International Business Machines Corporation | Multi-layered interconnect structure using liquid crystalline polymer dielectric |
-
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- 2000-10-10 KR KR1020017008133A patent/KR100833723B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
CN1652662A (zh) | 2005-08-10 |
US20060191708A1 (en) | 2006-08-31 |
MY148600A (en) | 2013-05-15 |
US20120067633A1 (en) | 2012-03-22 |
US20050189136A1 (en) | 2005-09-01 |
US6930258B1 (en) | 2005-08-16 |
DE60027141D1 (de) | 2006-05-18 |
CN100521868C (zh) | 2009-07-29 |
EP1162867A1 (en) | 2001-12-12 |
EP1672970A3 (en) | 2007-08-01 |
EP1162867A4 (en) | 2004-03-24 |
US20100006328A1 (en) | 2010-01-14 |
US7178234B2 (en) | 2007-02-20 |
EP1672970A2 (en) | 2006-06-21 |
DE60027141T2 (de) | 2006-12-28 |
EP1162867B1 (en) | 2006-04-05 |
CN1327710A (zh) | 2001-12-19 |
MY129285A (en) | 2007-03-30 |
TWI252723B (en) | 2006-04-01 |
KR100833723B1 (ko) | 2008-05-29 |
US7795542B2 (en) | 2010-09-14 |
US8106310B2 (en) | 2012-01-31 |
EP1672970B1 (en) | 2011-06-08 |
WO2001031984A1 (fr) | 2001-05-03 |
US7999194B2 (en) | 2011-08-16 |
CN1199536C (zh) | 2005-04-27 |
US20080283282A1 (en) | 2008-11-20 |
US8822839B2 (en) | 2014-09-02 |
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