KR102505643B1 - 유리 가공용 테이프 - Google Patents

유리 가공용 테이프 Download PDF

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Publication number
KR102505643B1
KR102505643B1 KR1020207037105A KR20207037105A KR102505643B1 KR 102505643 B1 KR102505643 B1 KR 102505643B1 KR 1020207037105 A KR1020207037105 A KR 1020207037105A KR 20207037105 A KR20207037105 A KR 20207037105A KR 102505643 B1 KR102505643 B1 KR 102505643B1
Authority
KR
South Korea
Prior art keywords
tape
adhesive layer
glass
adhesive
base film
Prior art date
Application number
KR1020207037105A
Other languages
English (en)
Korean (ko)
Other versions
KR20210015891A (ko
Inventor
유끼히로 마쯔바라
히로또끼 요꼬이
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20210015891A publication Critical patent/KR20210015891A/ko
Application granted granted Critical
Publication of KR102505643B1 publication Critical patent/KR102505643B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020207037105A 2019-05-29 2020-03-04 유리 가공용 테이프 KR102505643B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019100127A JP7269095B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
JPJP-P-2019-100127 2019-05-29
PCT/JP2020/009035 WO2020240964A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ

Publications (2)

Publication Number Publication Date
KR20210015891A KR20210015891A (ko) 2021-02-10
KR102505643B1 true KR102505643B1 (ko) 2023-03-06

Family

ID=73545917

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207037105A KR102505643B1 (ko) 2019-05-29 2020-03-04 유리 가공용 테이프

Country Status (7)

Country Link
JP (1) JP7269095B2 (ja)
KR (1) KR102505643B1 (ja)
CN (1) CN112351859B (ja)
PH (1) PH12021550127A1 (ja)
SG (1) SG11202100514UA (ja)
TW (1) TWI743810B (ja)
WO (1) WO2020240964A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2017147293A (ja) 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート

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JPH0235119B2 (ja) * 1982-12-27 1990-08-08 Tokyo Gasu Kk Suiheichokyorisakushinkohoniokerukutsusakuhetsudo
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
WO2000061658A1 (fr) * 1999-04-09 2000-10-19 Kaneka Corporation Resine polyimide, composition de resine a resistance amelioree a l'humidite la comprenant, solution adhesive, colle en film adhesif en couches et leurs procedes de production
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
KR20120068453A (ko) * 2010-12-17 2012-06-27 제일모직주식회사 다이싱 다이 본딩 필름
JP5019657B1 (ja) * 2011-10-27 2012-09-05 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5053455B1 (ja) * 2011-10-28 2012-10-17 古河電気工業株式会社 半導体加工用ダイシングテープ
JP2013133464A (ja) * 2011-12-27 2013-07-08 Nitto Denko Corp ガラス板用粘着シート
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP5731080B2 (ja) * 2013-03-28 2015-06-10 古河電気工業株式会社 粘着テープおよびウエハ加工用テープ
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
KR102359829B1 (ko) * 2014-05-12 2022-02-07 덴카 주식회사 반도체 검사용의 내열성 점착 시트, 및 반도체 검사 방법
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法
JP6535119B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2017147293A (ja) 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート

Also Published As

Publication number Publication date
PH12021550127A1 (en) 2021-10-04
TW202043400A (zh) 2020-12-01
SG11202100514UA (en) 2021-02-25
TWI743810B (zh) 2021-10-21
WO2020240964A1 (ja) 2020-12-03
CN112351859B (zh) 2023-04-11
JP2020194905A (ja) 2020-12-03
CN112351859A (zh) 2021-02-09
KR20210015891A (ko) 2021-02-10
JP7269095B2 (ja) 2023-05-08

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